SN EN 60191-6-22:2013
Current
Current
The latest, up-to-date edition.
Mechanical Standardization Of Semiconductor Devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
Available format(s)
Hardcopy
Language(s)
English - French, German
Published date
01-03-2013
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
CES/TK 47
|
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Swiss Standards
|
| Status |
Current
|
| Standards | Relationship |
| EN 60191-6-22:2013 | Identical |
| IEC 60191-6-22:2012 | Identical |
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