SN EN 60249-2-11 : 1994 AMD 4 2000
Current
The latest, up-to-date edition.
BASE MATERIALS FOR PRINTED CIRCUITS; PART 2: SPECIFICATIONS; SPECIFICATION NO. 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS
12-01-2013
Committees responsible
National foreword
Foreword
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad sheet
6 Non-electrical properties of the base material after
complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex ZA (normative) Other international publications
quoted in this standard with the references
of the relevant European publications
Gives requirements for properties of thin epoxide woven glass fabric copper clad laminated sheet, general-purpose grade, for use in the fabrication of multilayer printed boards. Although intended for multilayer boards, the materials may be used for single sided or double-sided printed boards. Includes materials and construction, internal marking, electrical properties, non electrical properties of the copper clad sheet, non electrical properties of the base material after complete removal of the copper foil, packaging and marking and acceptance testing.
| DocumentType |
Standard
|
| PublisherName |
Swiss Standards
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 60249-2-11:2001-09 | Identical |
| EN 60249-2-11 : 1994 AMD 4 2000 | Identical |
| IEC 60249-2-11:1987 | Identical |
| UNE-EN 60249-2-11:1996 | Identical |
| I.S. EN 60249-2-11:1995 | Identical |
| BS EN 60249-2-11:1994 | Identical |
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