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SN EN 60249-2-19 : 1993 AMD 2 1995

Current

Current

The latest, up-to-date edition.

BASE MATERIALS FOR PRINTED CIRCUITS; PART 2: SPECIFICATIONS; SPECIFICATION NO. 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS

Published date

12-01-2013

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Committees responsible
National foreword
Specification
1. Scope
2. Normative references
3. Materials and construction
4. Internal marking
5. Electrical properties
6. Non-electrical properties of the copper-clad sheet
7. Non-electrical properties of the base material
     after complete removal of the copper foil
8. Packaging and marking
9. Acceptance testing
Tables
1. Electrical properties
2. Types, sizes and permitted number of imperfections
3. Pull-off and peel strength
4. Wetting conditions
5. Dimensional stability
6. Size tolerances for cut panels
7. Rectangularity of cut panels
8. Nominal thickness and tolerances of sheet excluding
     metal foil
9. flammability
10. Glass transition temperature and cure factor
11. Thermal coefficient of expansion

modified epoxide woven glass fabric copper clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards. Coverage includes internal marking, electrical properties, acceptance testing and nonelectrical properties of the copper clad sheet. Also includes detailed tables.

DocumentType
Standard
PublisherName
Swiss Standards
Status
Current

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