SR TSY 001369 : ISSUE 1
Current
The latest, up-to-date edition.
INTRODUCTION TO RELIABILITY OF LASER DIODES AND MODULES
12-01-2013
ABSTRACT
1.0 INTRODUCTION
1.1 Typical Applications
1.2 Application Environments
1.3 Common Laser Diode Structures
1.4 Common Laser Module Designs
2.0 DESIGN ISSUES AND FAILURE MODES
2.1 Laser Diode
2.2 Laser Module
2.3 Component Parts
2.4 Summary
3.0 SCREENING
3.1 Laser Diode
3.2 Laser Module
3.3 Component Parts
4.0 QUALIFICATION PRACTICES
4.1 Laser Diode Characterization
4.2 Laser Module Characterization
4.3 Mechanical Test
4.4 Laser Diode Endurance Tests
4.5 Laser Module Endurance Tests
4.6 Special Tests
4.7 Other Module Components
4.8 Requalification/Reliability Monitors
5.0 RELIABILITY PREDICTIONS
5.1 Wear-Out Failures
5.2 Random Failures
5.3 Other Issues
5.4 Reliability Prediction Summary
6.0 CONCLUDING REMARKS
7.0 GLOSSARY
8.0 REFERENCES AND RELATED INFORMATION
Contains an introductory tutorial on the reliability of semiconductor laser diodes and modules. It is specifically concerned with lasers used in telecommunications applications, although it is relevant for almost any application where reliability is an important consideration. Reviews many design issues and possible failure modes of semiconductor lasers. Reliability assurance practices to avoid these problems are discussed, with the focus on screening and qualification practices. A method for calculating predicted reliability from life tests is also presented.
DevelopmentNote |
Included in FR 796. (04/2000)
|
DocumentType |
Standard
|
PublisherName |
Telcordia Technologies
|
Status |
Current
|
SR 332 : ISSUE 4 | RELIABILITY PREDICTION PROCEDURE FOR ELECTRONIC EQUIPMENT |
TR TSY 000357 : ISSUE 1 | COMPONENT RELIABILITY ASSURANCE GENERIC REQUIREMENTS FOR TELECOMMUNICATIONS EQUIPMENT (A MODULE OF RQGR, FR-NWT-000796) |
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