UNE-EN 60749-9:2017

The purpose of this part of IEC 60749 is to determine whether the marks on solid statesemiconductor devices will remain legible when subjected to the application and removal oflabels or the use of solvents and cleaning solutions commonly used during the removal ofsolder flux residue from the printed circuit board manufacturing process.This test is applicable for all package types. It is suitable for use in qualification and/orprocess monitor testing.. The test should be considered non-destructive. Electrical ormechanical rejects may be used for the purpose of this test.NOTE 1 This procedure does not apply to laser branded packages.Many available solvents that could be used are either not sufficiently active, too stringent, oreven dangerous to humans when in direct contact or when fumes are inhaled.NOTE 2 The composition of solvents used in this standard, is considered typical and representative of the desiredstringency as far as the usual coatings and markings are concerned.