UNE-EN 62435-5:2017
Current
Current
The latest, up-to-date edition.
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (Endorsed by Asociación Española de Normalización in May of 2017.)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-05-2017
Publisher
€66.00
Excluding VAT
This part, covering die and wafer devices, includes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder ball or bumps or other metallisation. This part also covers any special requirements for the primary packaging that to contain the die or wafers for handling purposes whether for automated use or not.
| Committee |
CTN 209/SC 47
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-3837-0
|
| Pages |
28
|
| ProductNote |
This standard also reffers (IEC 61340-5-2,IEC TR 61945,JEDEC J-STD-002,JEDEC J-STD-033,JEDEC JESD22-B116,JEDEC JESD22-B118,ASTM D3330)
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Current
|
| Standards | Relationship |
| EN 62435-5:2017 | Identical |
| IEC 62435-5:2017 | Identical |
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