UNE-EN IEC 60286-3:2019
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (Endorsed by Asociación Española de Normalización in April of 2019.)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-04-2019
Publisher
Superseded date
01-02-2023
€93.00
Excluding VAT
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above mentioned purposes.This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
| Committee |
CTN 209/SC 40
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-6387-7
|
| Pages |
48
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Superseded
|
| Standards | Relationship |
| BS EN IEC 60286-3:2019 | Equivalent |
| DIN EN IEC 60286-3:2019-08 | Equivalent |
| IEC 60286-3:2019 | Identical |
| EN IEC 60286-3:2019 | Identical |
Summarise
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