UNE-EN IEC 60749-15:2020

This part of IEC 60749 describes a test used to determine whether encapsulated solid statedevices used for through-hole mounting can withstand the effects of the temperature to whichthey are subjected during soldering of their leads by using wave soldering.In order to establish a standard test procedure for the most reproducible methods, the solderdip method is used because of its more controllable conditions. This procedure determineswhether devices are capable of withstanding the soldering temperature encountered in printedwiring board assembly operations, without degrading their electrical characteristics or internalconnections.This test is destructive and may be used for qualification, lot acceptance and as a productmonitor.The heat is conducted through the leads into the device package from solder heat at thereverse side of the board. This procedure does not simulate wave soldering or reflow heatexposure on the same side of the board as the package body.