UNE-EN IEC 60749-30:2020

This part of IEC 60749 establishes a standard procedure for determining the preconditioningof non-hermetic surface mount devices (SMDs) prior to reliability testing.The test method defines the preconditioning flow for non-hermetic solid-state SMDsrepresentative of a typical industry multiple solder reflow operation.These SMDs are subjected to the appropriate preconditioning sequence described in thisstandard prior to being submitted to specific in-house reliability testing (qualification and/orreliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).NOTE 1 Correlation of moisture-induced stress sensitivity conditions (or moisture sensitivity levels (MSL)) inaccordance with IEC 60749-20 and this specification and actual reflow conditions used are dependent uponidentical temperature measurement by both the semiconductor manufacturer and the board assembler. Therefore,it is recommended that the temperature at the top of the package on the hottest moisture sensitive SMD duringassembly be monitored to ensure that it does not exceed the temperature at which the components are evaluated.NOTE 2 For the purpose of this standard, SMD is restricted to include only plastic-encapsulated SMDs and otherpackages made with moisture-permeable materials.