Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)

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Published date

01-05-2021

Publisher

Asociación Española de Normalización

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This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1 to IEC 61191-4.

Committee	CTN 203/SC 91-119
DocumentType	Standard
Pages	39
PublisherName	Asociación Española de Normalización
Status	Current

Standards	Relationship
IEC 61188-6-1:2021	Identical
EN IEC 61188-6-1:2021	Identical

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UNE-EN IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)

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UNE-EN IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)

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