Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (Endorsed by Asociación Española de Normalización in March of 2025.)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-03-2025

Publisher

Asociación Española de Normalización

€82.00

Excluding VAT

This International Standard specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of the IEC 61191-1, and IEC 61191-3.

Committee	CTN 203/SC 91-119
DocumentType	Standard
Pages	40
PublisherName	Asociación Española de Normalización
Status	Current

Standards	Relationship
I.S. EN IEC 61188-6-3:2025	Equivalent
BS EN IEC 61188-6-3:2025	Equivalent
EN IEC 61188-6-3:2025	Identical
IEC 61188-6-3:2024	Identical

Summarise

ChatGPT Perplexity

€82.00

Excluding VAT

Product format

I agree to the DRM document license rules apply against the PDF selection made.

Please confirm that you agree to the document license rules for this document.

I agree to the document license rules .

Please confirm that you agree to the document license rules for this document.

Shopping Cart

UNE-EN IEC 61188-6-3:2025

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (Endorsed by Asociación Española de Normalización in March of 2025.)

Shopping Cart

UNE-EN IEC 61188-6-3:2025

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (Endorsed by Asociación Española de Normalización in March of 2025.)

Abstract

General Product Information

International Equivalents

Industry

Sub-Industry