UNE-EN IEC 62148-21:2021
Current
The latest, up-to-date edition.
Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (Endorsed by Asociación Española de Normalización in July of 2021.)
Hardcopy , PDF
English
01-07-2021
This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative.The purpose of this document is to specify adequately the electrical interface of PIC packagescomposed of optical transmitters and receivers that enable mechanical and electricalinterchangeability of PIC packages.
| Committee |
CTN 212/SC 86
|
| DocumentType |
Standard
|
| Pages |
23
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Current
|
| Standards | Relationship |
| BS AU 117:1965 | Identical |
| IEC 62148-21:2021 | Identical |
| EN IEC 62148-21:2021 | Identical |
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