UNE-EN IEC 62878-1:2019
Current
The latest, up-to-date edition.
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (Endorsed by Asociación Española de Normalización in January of 2020.)
Hardcopy , PDF
English
01-01-2020
This part of IEC 62878 specifies the generic requirements and test methods for device embedded substrates. The basic test methods for printed wiring substrate materials and substrates themselves are specified in IEC 61189-3.This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
| Committee |
CTN 203/SC 91-119
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-7460-6
|
| Pages |
30
|
| ProductNote |
THIS STANDARD ALSO REFERS TO :JPCA-EB01
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62878-1:2019 | Identical |
| EN IEC 62878-1:2019 | Identical |
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