UNE-EN IEC 62878-2-603:2025
Current
Current
The latest, up-to-date edition.
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (Endorsed by Asociación Española de Normalización in May of 2025.)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-05-2025
Publisher
€64.00
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This document specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as Known Good Module.
| Committee |
CTN 203/SC 91-119
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Current
|
| Standards | Relationship |
| BS EN IEC 62878-2-603:2025 | Equivalent |
| I.S. EN IEC 62878-2-603:2025 | Equivalent |
| EN IEC 62878-2-603:2025 | Identical |
| BS AU 50-3.3:1980 | Identical |
| IEC 62878-2-603:2025 | Identical |
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