UNE-EN ISO 9455-17:2024
Current
The latest, up-to-date edition.
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2024)
Hardcopy , PDF
Spanish, Castilian, English
30-10-2024
This document specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specifiedin ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead free solders as agreed between user and supplier (ISO 9453).NOTE This test method is also applicable to fluxes for use with lead containing and lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
| Committee |
CTN 14
|
| DocumentType |
Standard
|
| Pages |
34
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| ISO 9455-17:2024 | Identical |
| EN ISO 9455-17:2024 | Identical |
| EN ISO 9455-17:2024 | Equivalent |
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