UNI EN ISO 9453:2021
Current
Current
The latest, up-to-date edition.
Soft solder alloys - Chemical compositions and forms
Published date
18-02-2021
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This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
| DocumentType |
Standard
|
| PublisherName |
Ente Nazionale Italiano di Unificazione (UNI)
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN ISO 9453:2020 | Identical |
| ISO 9453:2020 | Identical |
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