UTEC 93 023 : 1980
Withdrawn
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
ELECTRONIC COMPONENTS; CONNECTION BY CRIMPING OF WIRES WITH COPPER & COPPER ALLOY CONDUCTOR WITH CROSS-SECTIONAL AREA LESS THAN 10 MM SQUARED; APPLICABLE TO MULTICONTACT COMPONENTS; PROVISIONAL REQUIREMENTS
Withdrawn date
05-06-2000
Published date
12-01-2013
Publisher
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| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Withdrawn
|
| NFC 93 428 : 81 AMD 1 87 | ELECTRONIC COMPONENTS - CONNECTING DEVICES - INSULATION DISPLACEMENT CONNECTORS - TYPE HE 10 - GENERAL REQUIREMENTS |
| NFC 93 521 : 72 AMD 2 77 | ELECTRONIC COMPONENTS - LOW FREQUENCY EQUIPMENT WIRES AND CABLES WITH SOLID OR STRANDED CONDUCTORS - PVC INSULATION AND SHEATH - GENERAL REQUIREMENTS |
| NFL 54 128 : 1974 | HAND CRIMPING TOOL FOR ELECTRICAL CONTACTS - INDENTORS (NEW TYPES) |
| NFC 20 130 : 2004 | CRIMP-TYPE COPPER OR COPPER ALLOY NON-INSULATED LUGS FOR COPPER CONDUCTORS - REQUIREMENTS |
| NFC 20 600 : 1975 | TEST METHODS FOR COMPONENTS - BASIC ENVIRONMENTAL TESTING PROCEDURES - GENERAL |
| NFC 20 604 : 1973 | METHODS OF TEST FOR COMPONENTS - BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST 4B - ACCELERATED DAMP HEAT |
| NFL 54 126 : 1974 | HAND CRIMPING TOOL FOR ELECTRICAL CONTACTS - INDENTORS (OLD TYPES) (RECH.) |
| NFC 93 523 : 1988 | ELECTRONIC COMPONENTS - INSULATED WIRES FOR HIGH TEMPERATURE |
| NFC 20 619 : 1987 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST METHODS - TEST Z/ADBM AND GUIDANCE - CLIMATIC SEQUENCE |
| NFC 93 524 : 1981 | ELECTRONIC COMPONENTS - INSULATED WIRES FOR HIGH TEMPERATURES UP TO ISO GRADE C - GENERAL REQUIREMENTS |
| NFA 03 253 : 72 FD | ALUMINIUM AND ALUMINIUM ALLOYS - COPPER AND COPPER ALLOYS - VICKER HARDNESS - TEST-LOADS RANGING FROM 0.2 TO 120 KGF |
| NFC 93 050 : 1987 | ELECTRONIC COMPONENTS - BASIC ELECTRICAL TESTING PROCEDURES |
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