WL 5.4111 : 1998
Current
Current
The latest, up-to-date edition.
AEROSPACE - STRUCTURAL ADHESIVE FILMS ON A MODIFIED EP BASIS - STANDARD CURING TEMPERATURE 175 DEGREES C, APPLICABLE FROM -55 DEGREES C TO 135 DEGREES C
Published date
12-01-2013
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Das Dokument gilt für Klebfolien der Härtungsklasse 175 grad C, die zur Herstellung tragender Strukturen aus metallischen Fügeteilen bei Temperaturen von -55 grad C bis 135 grad C in der Luft- und Raumfahrt eingesetzt werden.
| DevelopmentNote |
Partially supersedes 1973 versions of WL 5.4101-1 & -2 (06/2002)
|
| DocumentType |
Standard
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| DIN 65074:1999-03 | AEROSPACE - ADHESIVE FILMS AND PRIMERS FOR STRUCTURAL ASSEMBLIES - TECHNICAL SPECIFICATION |
| DIN 29970:1998-09 | AEROSPACE - HONEYCOMB CORES OF POLYAMIDE PAPER, PHENOLIC RESIN COATED - TECHNICAL SPECIFICATION |
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