07/30169763 DC : 0
Current
Current
The latest, up-to-date edition.
BS EN 62515 - EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA
Available format(s)
Hardcopy , PDF
Language(s)
English
Publisher
€22.71
Excluding VAT
BS EN 62515
| Committee |
EPL/501
|
| DocumentType |
Draft
|
| Pages |
31
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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