BS EN 60603-3 : 1998
|
CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 3: TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING CONTACTS SPACED AT 2,54 MM (0,100 IN) CENTRES AND STAGGERED TERMINATIONS AT THAT SAME SPACING |
I.S. EN 61249-2-6:2005/AC:2005
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MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
09/30179135 DC : 0
|
BS EN 61249-2-42 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROAMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
10/30235537 DC : 0
|
BS EN 61249-4-18 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPEG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPEG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
EN IEC 61249-2-45 : 2018
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-45: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY (1.0W/M K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY (IEC 61249-2-45:2018) |
CEI EN 61249-2-37 : 2010
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
EN 60664-3:2017
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION (IEC 60664-3:2016) |
BS EN 60068-2-58 : 2015
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
07/30164977 DC : 0
|
EN 61249-2-32 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-32: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 3.7 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
07/30174325 DC : 0
|
BS EN 61249-2-41 - MATERIALS FOR PRINTED CIRCUIT BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EXPOIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 61249-2-22 : 2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
BS 4584-103.3:1992
|
METAL-CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - SPECIAL MATERIALS USED IN CONNECTION WITH PRINTED CIRCUITS - SPECIFICATION FOR PERMANENT POLYMER COATING MATERIALS (SOLDER RESIST) FOR USE IN THE FABRICATION OF PRINTED BOARDS |
07/30164981 DC : 0
|
EN 61249-2-33 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-33: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - NON-HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 4.1 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
BS EN 61249-4-18 : 2013
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
BS EN 61249-4-16 : 2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
BS EN 62137-3:2012 (published 2012-03)
|
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints |
I.S. EN 62739-1:2013
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013 (EQV)) |
CEI EN 62137-1-4 : 2010
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST |
BS EN 62137-1-3 : 2009
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST |
CEI EN 61249-2-21 : 2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-21: REINFORCED BASE MATERIALS, CLAD AND UNCLAD NON-HALOGENATED EPOXIDE WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
BS EN 60603-9 : 1998
|
CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 9: TWO-PART CONNECTORS FOR PRINTED BOARDS, BACKPANELS AND CABLE CONNECTORS, BASIC GRID OF 2,54 MM (0,1 IN) |
BS 123500(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - FLEXIBLE SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITH THROUGH-CONNECTIONS |
BS 123700(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - FLEX-RIGID DOUBLE-SIDED PRINTED BOARDS WITH THROUGH-CONNECTIONS |
96/204228 DC : DRAFT APR 1996
|
IEC 61182-10 - PRINTED BOARD ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 10: ELECTRONIC DATA HIERARCHY |
BS EN 61249-2-35 : 2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 61193-2 : 2007
|
QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES |
17/30355504 DC : 0
|
BS EN 61189-2-630 ED.1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-630: TEST METHODS FOR BASE MATERIALS FOR RIGID PRINTED BOARDS - MOISTURE ABSORPTION AFTER PRESSURE VESSEL CONDITIONING |
15/30318681 DC : 0
|
BS EN 61190-1-3 ED 3.0 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
BS EN 60603-4 : 1998
|
CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 4: TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING CONTACTS SPACED AT 1,91 MM (0,075 IN) CENTRES AND STAGGERED TERMINATIONS AT THAT SAME SPACING |
BS EN 61249-2-38 : 2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 61249-2-1 : 2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-1: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS, ECONOMIC GRADE, COPPER CLAD |
02/210157 DC : DRAFT OCT 2002
|
IEC 61249-2-23 ED.1 - MATERIALS FOR INTERCONNECTION STRUCTURES - PART 2-23: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - SECTION 23: NON-HALOGENATED PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEET, ECONOMIC GRADE, COPPER CLAD |
BS 6221-3(1984) : AMD 6472
|
METHODS OF TEST - GUIDE FOR THE DESIGN AND USE OF PRINTED WIRING BOARDS |
I.S. EN 61249-2-23:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-23: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS, ECONOMIC GRADE, COPPER-CLAD |
05/30133278 DC : DRAFT MAY 2005
|
IEC 62137-1-1 - SURFACE MOUNT TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST |
I.S. EN 62137-1-5:2009
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS - PART 1-5: MECHANICAL SHEAR FATIGUE TEST |
11/30253280 DC : 0
|
BS EN 62326-20 ED.1 - ELECTRONIC CIRCUIT BOARD FOR HIGH-BRIGHTNESS LEDS |
BS EN 60603-2:1998 (published 2006-06)
|
Connectors for frequencies below 3 MHz for use with printed boards Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features |
BS PD IEC TS 62878-2-1 : 2015
|
DEVICE EMBEDDED SUBSTRATE - PART 2-1: GUIDELINES - GENERAL DESCRIPTION OF TECHNOLOGY |
I.S. EN 61249-2-37:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS PD IEC TR 60664-2-1 : 2011
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 2-1: APPLICATION GUIDE - EXPLANATION OF THE APPLICATION OF THE IEC 60664 SERIES, DIMENSIONING EXAMPLES AND DIELECTRIC TESTING |
BS EN 61249-2-36 : 2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-36: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 62137-4 : 2014
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
CEI EN 60097 : 1998
|
GRID SYSTEMS FOR PRINTED CIRCUITS |
IEC 60664-3 REDLINE : 3ED 2016
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
BS 123200(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - RIGID DOUBLE-SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES |
CEI EN 61249-4-17 : 2010
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
96/205776 DC : DRAFT MAY 1996
|
BS CECC 200021 - PROCESS ASSESSMENT SCHEDULE FOR MASS LAMINATION PANELS |
02/211156 DC : DRAFT DEC 2002
|
IEC 61249-4-11 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) |
DD IEC PAS 62137-3 : DRAFT 2008
|
ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
14/30312344 DC : 0
|
PD IEC/PAS 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
I.S. EN 61249-4-15:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
IEC 61249-2-32:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-32: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATE SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL TO OR LESS THAN 3,7 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
BS 123000(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - GENERIC SPECIFICATION - PRINTED BOARDS |
BS EN 61189-2-719:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz) |
BS 123400(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - FLEXIBLE SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITHOUT THROUGH-CONNECTIONS |
BS EN 61249-2-6 : 2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
DIN EN 60097:1993-09
|
Grid systems for printed circuits (IEC 60097:1991); German version EN 60097:1993 |
CEI EN 61249-4-16 : 2010
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
I.S. EN 16602-70-11:2015
|
SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS |
BS EN 61193-1 : 2002
|
QUALITY ASSESSMENT SYSTEMS - REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES |
I.S. EN 62137-4:2014
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
CEI EN 61249-2-38 : 2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
CEI EN 61249-4-1 : 2010
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
CEI EN 61249-2-6 : 2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
BS EN 61249-4-14 : 2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
09/30210900 DC : 0
|
BS EN 61249-2-40 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE, MODIFIED, NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 61182-7:1996
|
PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM |
BS 123500-003(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEXIBLE SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITH THROUGH-CONNECTIONS |
CEI 109-5 : 2011
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 2-1: APPLICATION GUIDE - EXPLANATION OF THE APPLICATION OF THE IEC 60664 SERIES, DIMENSIONING EXAMPLES AND DIELECTRIC TESTING |
BS PD IEC TR 61189-3-914 : 2017
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-914: TEST METHOD FOR THERMAL CONDUCTIVITY OF PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS - GUIDELINES |
IEC 61249-2-40:2012
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - HIGH PERFORMANCE, NONHALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 61249-4-17 : 2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
BS EN 61190-1-2:2014
|
Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly |
BS EN 61192-4 : 2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES |
BS EN 123500 : 1992
|
SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS |
BS EN 62326-20 : 2016
|
PRINTED BOARDS - PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS |
BS EN 61249-4-5 : 2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
01/205138 DC : 0
|
IEC 61249-4-1 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - SECTION 1: EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
09/30206176 DC : DRAFT JUNE 2009
|
BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
CEI EN 62137-1-5 : 2010
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST |
BS EN 61182-2-2 : 2012
|
PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION |
BS EN 61249-2-26 : 2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-26: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
BS EN 61249-2-23 : 2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-23: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS, ECONOMIC GRADE, COPPER-CLAD |
02/211157 DC : DRAFT DEC 2002
|
IEC 61249-4-12 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) |
07/30164989 DC : 0
|
EN 61249-2-36 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-36: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
06/30153524 DC : DRAFT JULY 2006
|
EN 62137-1-3 - SURFACE-MOUNT TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST |
BS EN 60603-10 : 1998
|
CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 10: TWO-PART CONNECTORS FOR PRINTED BOARDS FOR BASIC GRID OF 2,54 MM (0,1 IN), INVERTED TYPE |
BS EN 60603-8 : 1998
|
CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 8: TWO-PART CONNECTORS FOR PRINTED BOARDS FOR BASIC GRID OF 2,54 MM (0,1 IN), WITH SQUARE MALE CONTACTS OF 0,63 MM X 0, 63 MM |
BS EN 61192-5 : 2007
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
I.S. EN 61249-4-11:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
04/30123452 DC : DRAFT OCT 2004
|
IEC 61249-2-22 ED 1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED NONHALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
CEI EN 62137-1-3 : 2009
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST |
I.S. EN 61249-4-16:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
CEI EN 61249-2-1 : 2005
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MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-1: REINFORCED BASE MATERIALS, CLAD AND UNCLAD PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS,ECONOMIC GRADE, COPPER CLAD |
BS 123800-003(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEXIBLE MULTILAYER PRINTED BOARDS WITH THROUGH-CONNECTIONS |
CEI EN 61249-4-15 : 2010
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
RC.AERO 54406 : 1978
|
REPAIR AND MODIFICATION OF PRINTED WIRING BOARDS FOR AEROSPACE USE |
BS EN 61249-4-1 : 2008
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MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
07/30164961 DC : 0
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BS EN 61249-4-15 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
07/30169578 DC : 0
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BS EN 61188-7 - PRINTED BOARD AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: SECTIONAL REQUIREMENTS - ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION |
NF EN 60068-2-83 : 2012
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
BS CECC 23300-800(1990) : AMD 7366
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HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: CAPABILITY DETAIL SPECIFICATION; MULTILAYER PRINTED BOARDS |
BS EN 61189-11:2013 (published 2013-07)
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys |
BS EN 62326-1 : 2002
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PRINTED BOARDS - PART 1: GENERIC SPECIFICATION |
12/30254697 DC : 0
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BS ISO 16525-9 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 9: DETERMINATION OF HIGH-SPEED SIGNAL-TRANSMISSION CHARACTERISTICS |
07/30164973 DC : 0
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EN 61249-2-31 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-31: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 4.1 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
07/30164993 DC : 0
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EN 61249-2-37 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
03/107475 DC : 0
|
IEC 61249-6-3 ED.1.0 - MATERIALS FOR INTERCONNECTION STRUCTURES - PART 6-3: SECTIONAL SPECIFICATION FOR REINFORCEMENTS - WOVEN FIBREGLASS FABRICS |
BS EN 61192-2 : 2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES |
CEI EN 62137-1-2 : 2008
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST |
CEI EN 62137-3 : 2012
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
07/30164957 DC : 0
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BS EN 61249-4-14 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
BS 123300(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - RIGID MULTILAYER PRINTED BOARDS |
DIN IEC 60326-4:1993-09
|
PRINTED BOARDS - PART 4: SPECIFICATION FOR SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES |
EN 60068-2-20 : 2008
|
ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
09/30201049 DC : 0
|
BS EN 61249-2-41 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASED MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 61191-6 : 2010
|
PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD |
BS EN 62137-1-2 : 2007
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST |
05/30133283 DC : DRAFT MAY 2005
|
IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
BS 6221-11:1991
|
PRINTED WIRING BOARDS - SPECIFICATION FOR FLEX-RIGID MULTILAYER PRINTED BOARDS WITH THROUGH CONNECTIONS |
07/30165180 DC : 0
|
BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE |
BS 123100-003(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - RIGID SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITH PLAIN HOLES |
11/30243259 DC : 0
|
BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
BS CECC23100-800(1990) : AMD 7360
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: CAPABILITY DETAIL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES |
17/30352677 DC : 0
|
BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN |
NF EN 61191-6 : 2010
|
PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD |
BS EN 62739-2 : 2016
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING |
BS EN 61249-4-19 : 2013
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
06/30153520 DC : DRAFT JULY 2006
|
EN 62468 - THE MARKING FOR PRESENCE AND ABSENCE OF THE SPECIFIED CHEMICAL SUBSTANCE IN MATERIALS, COMPONENTS AND MOUNTED BOARDS IN ELECTRICAL AND ELECTRONIC EQUIPMENT |
BS 123400-003(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEXIBLE SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITHOUT THROUGH-CONNECTIONS |
BS 4584-1(1983) : 1983 AMD 8050
|
METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - METHODS OF TEST |
05/30133599 DC : DRAFT MAY 2005
|
IEC 62137-1-2 - SURFACE MOUNT TECHNOLOGY - ENVIRONMENTAL ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST |
BS 6221-8:1982
|
PRINTED WIRING BOARDS - METHOD FOR SPECIFYING SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED WIRING BOARDS WITH THROUGH CONNECTIONS |
BS 6221-3(1991) : 1991
|
PRINTED WIRING BOARDS - GUIDE FOR THE DESIGN AND USE OF PRINTED WIRING BOARDS |
BS 6221-10:1991
|
PRINTED WIRING BOARDS - SPECIFICATION FOR FLEX-RIGID DOUBLE-SIDED PRINTED BOARDS WITH THROUGH CONNECTIONS |
07/30164969 DC : 0
|
EN 61249-4-17 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
IEC 61249-2-46:2018
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-46: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY 1,5 W/(M*K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
I.S. EN 61249-2-42:2010
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 175101-802:2000 (published 2000-04)
|
Harmonized system of quality assessment for electronic components. Detail specification Two-part connectors for printed boards for high number of contacts with basic grid of 2,54 mm on 3 or 4 rows |
I.S. EN IEC 61249-2-46:2018
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-46: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY (1.0W/M K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS CECC23000(1989) : 1989 AMD 7145
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERAL SPECIFICATION: PRINTED BOARDS |
BS EN 61189-3-719 : 2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING |
BS EN 62739-1:2013 (published 2013-09)
|
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing |
BS 123700-003(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEX-RIGID DOUBLE-SIDED PRINTED BOARDS WITH THROUGH-CONNECTIONS |
BS EN 123100 : 1992
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLE S |
BS 123600(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - FLEX-RIGID MULTILAYER PRINTED BOARDS WITH THROUGH-CONNECTIONS |
BS 6221-6(1982) : 1982
|
PRINTED WIRING BOARDS - SPECIFICATION FOR MULTILAYER PRINTED WIRING BOARDS |
I.S. EN 61249-2-43:2016
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 62878-1-1 : 2015
|
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
BS 9760:1977
|
SPECIFICATION FOR PRINTED CIRCUITS OF ASSESSED QUALITY:GENERIC DATA AND METHODS OF TEST:CAPABILITY APPROVAL PROCEDURE AND RULES |
EN IEC 61249-2-46 : 2018
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-46: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY (1.5W/M K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY (IEC 61249-2-46:2018) |
BS EN 61249-2-10 : 2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-10: REINFORCED BASE MATERIALS CLAD AND UNCLAD - CYANATE ESTER, BROMINATED EPOXIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
BS CECC23300(1989) : 1989 AMD 7364
|
SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: MULTILAYER PRINTED BOARDS |
CEI EN 61249-2-39 : 2014
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-39: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE EPOXIDE AND NON-EPOXIDE, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 61192-1 : 2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL |
I.S. EN 61249-4-14:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
IEC 61189-3-913:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs |
13/30284114 DC : 0
|
BS EN 61249-2-43 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGEN EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 62137-1-4:2009 (published 2009-03)
|
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test |
09/30201707 DC : 0
|
BS EN 60664-3+A1 ED.2 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
CEI EN 61189-5-503 : 1ED 2017
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
BS EN 61190-1-1 : 2002
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
07/30164997 DC : 0
|
EN 61249-2-38 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS CECC23500(1990) : 1990 AMD 7369
|
SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS |
BS EN 61249-2-11 : 2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-11: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - POLYIMIDE, BROMINATED EPOXIDE MODIFIED OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
BS EN 61192-3 : 2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES |
BS EN 62090 : 2017
|
PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO- DIMENSIONAL SYMBOLOGIES (IEC 62090:2017) |
07/30164965 DC : 0
|
BS EN 61249-4-16 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
10/30235541 DC : 0
|
BS EN 61249-4-19 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPEG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
BS EN 62137-1-1 : 2007
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST |
BS EN 61760-1 : 2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
BS EN 61760-3:2010 (published 2010-06)
|
Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering |
13/30284118 DC : 0
|
BS EN 61249-2-44 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-44: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
I.S. EN 61249-2-1:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-1: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS, ECONOMIC GRADE, COPPER CLAD |
I.S. EN 61193-3:2013
|
QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING (IEC 61193-3:2013 (EQV)) |
BS EN 60068-2-83 : 2011
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
14/30314209 DC : 0
|
BS EN 61189-2-719 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-719: TEST METHODS FOR PRINTED BOARD AND ASSEMBLY MATERIALS - RELATIVE PERMITTIVITY AND LOSS TANGENT (500 MHZ TO 10 GHZ) |
NF EN 62137-1-5 : 2009
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST |
02/207116 DC : DRAFT JUN 2002
|
IEC 61249-2-2. ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES - PART 2-2: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE, HIGH ELECTRICAL GRADE, COPPER CLAD |
BS 9761:1977
|
SPECIFICATION FOR PRINTED CIRCUITS OF ASSESSED QUALITY: SECTIONAL SPECIFICATION FOR MULTILAYER PRINTED CIRCUITS |
BS EN 61249-2-43 : 2016
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 61188-5-1 : 2002
|
PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - ATTACHMENT (LAND/JOINT) CONSIDERATIONS - ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS |
BS PD ISO/IEC PAS 60127-8 : 2014
|
MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
07/30164985 DC : 0
|
BS EN 61249-2-34 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-34: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - NON-HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 3.7 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
07/30169763 DC : 0
|
BS EN 62515 - EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA |
I.S. EN 60249-1:1994
|
BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
I.S. EN 61249-2-26:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-26: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
I.S. EN 61189-11:2013
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS (IEC 61189-11:2013 (EQV)) |
BS CECC23200(1989) : 1989 AMD 7361
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED THROUGH HOLES |
14/30317095 DC : 0
|
BS EN 62739-2 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING |
BS EN 61249-2-41 : 2010
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 123000 : 1992
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: PRINTED BOARDS |
BS EN 123400 : 1992
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS |
BS PD IEC TS 62878-2-4 : 2015
|
DEVICE EMBEDDED SUBSTRATE - PART 2-4: GUIDELINES - TEST ELEMENT GROUPS (TEG) |
BS 6221-5:1982
|
PRINTED WIRING BOARDS - SPECIFICATION FOR SINGLE AND DOUBLE SIDED RIGID PRINTED BOARDS WITH PLATED-THROUGH HOLES |
BS ISO 16525-9 : 2014
|
ADHESIVES - TEST METHODS FOR ISOTROPIC ELECTRICALLY CONDUCTIVE ADHESIVES - PART 9: DETERMINATION OF HIGH-SPEED SIGNAL-TRANSMISSION CHARACTERISTICS |
BS EN 160100 : 1998
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION: CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OF ASSESSED QUALITY |
BS EN 62739-3 : 2017
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS |
BS EN 61249-2-30 : 2013
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINATE OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
BS EN 61249-2-21 : 2003
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 2-21: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
BS EN 61249-2-40 : 2013
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE, NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEADFREE ASSEMBLY |
NBR IEC 62326-1 : 2007
|
PRINTED BOARDS - PART 1: GENERIC SPECIFICATION |
BS EN 62137-1-5:2009
|
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test |
CEI EN 62739-1 : 2014
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING |
BS EN 61249-2-37 : 2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
09/30186180 DC : 0
|
BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
CEI EN 61249-2-2 : 2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-2: REINFORCED BASE MATERIALS, CLAD AND UNCLAD PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEETS, HIGH ELECTRICAL GRADE, COPPER-CLAD |
BS EN 123200 : 1992
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED THROUGH HOLES |
15/30331587 DC : 0
|
BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
BS 123800(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - FLEXIBLE MULTILAYER PRINTED BOARDS WITH THROUGH-CONNECTIONS |
BS EN 175101-809:2004 (published 2004-04)
|
Harmonized system of quality assessment for electronic components. Detail specification Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality |
12/30258438 DC : 0
|
BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
16/30333617 DC : 0
|
BS EN 62090 - PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES |
BS CECC23400(1990) : 1990 AMD 7367
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS |
07/30153508 DC : 0
|
BS EN 61249-2-35 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
02/210156 DC : DRAFT OCT 2002
|
IEC 61249-2-26 ED.1 - MATERIALS FOR INTERCONNECTION STRUCTURES - PART 2-26: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - SECTION 26: NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
09/30211075 DC : 0
|
BS EN 61249-2-39 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-39: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE EPOXCIDE AND NON-EPOXICDE, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
I.S. EN 61182-2-2:2012
|
PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
I.S. EN 61191-6:2010
|
PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD |
16/30338234 DC : 0
|
BS EN 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
IEC 60326-9:1991
|
Printed boards - Part 9: Specification for flexible multilayer printed boards with through connections |
16/30336979 DC : 0
|
BS EN 60664-3 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
BS 6221-7:1982
|
PRINTED WIRING BOARDS - METHOD FOR SPECIFYING SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED WIRING BOARDS WITHOUT THROUGH CONNECTIONS |
BS EN 60068-2-77 : 1999
|
ENVIRONMENTAL TESTING - TEST METHODS - BODY STRENGTH AND IMPACT SHOCK |
BS PD IEC TS 62878-2-3 : 2015
|
DEVICE EMBEDDED SUBSTRATE - PART 2-3: GUIDELINES - DESIGN GUIDE |
BS CECC23100(1989) : 1989 AMD 7358
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES |
BS EN 61193-3 : 2013
|
QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING |
CEI EN 61249-2-23 : 2005
|
MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-23: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES RENFORCEES DE PAPIER CELLULOSE PHENOLIQUE NON HALOGENE, DE QUALITE ECONOMIQUE, PLAQUEES CUIVRE |
BS 5830(1979) : 1979
|
SPECIFICATION FOR GRID SYSTEM FOR PRINTED CIRCUITS |
BS EN 61249-2-9 : 2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - REINFORCED BASE MATERIALS CLAD AND UNCLAD - BISMALEIMIDE/TRIAZINE, MODIFIED EPOXIDE OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
BS EN 61249-2-5 : 2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-5: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER REINFORCED CORE/WOVEN E-GLASS REINFORCED SURFACES LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
02/206695 DC : DRAFT JUN 2002
|
IEC 61249-2-1. ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES - PART 2-1: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEET, ECONOMIC GRADE, COPPER CLAD |
CEI EN 61249-2-5 : 2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 2-5: REINFORCED BASE MATERIALS, CLAD AND UNCLAD BROMINATED EPOXIDE CELLULOSE PAPER REINFORCED CORE / WOVEN E-GLASS REINFORCED SURFACES LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
BS EN 61249-2-2 : 2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-2: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEETS, HIGH ELECTRICAL GRADE, COPPER-CLAD |
05/30138801 DC : DRAFT SEP 2005
|
IEC 60068-2-20 ED 5 - BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2-20: TEST - TEST T - TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF LEADED DEVICES |
BS 6221-9:1991
|
PRINTED WIRING BOARDS - SPECIFICATION FOR FLEXIBLE MULTILAYER BOARDS WITH THROUGH CONNECTIONS |
BS EN 60068-2-20 : 2008
|
ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
BS CECC23200-800(1990) : AMD 7363
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: CAPABILITY DETAIL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES |
02/211158 DC : DRAFT DEC 2002
|
IEC 61249-4-5 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) |
RC.AERO 54402 : 1975
|
QUALITY CONTROL PROCEDURE FOR SINGLE-LAYER SCREEN PRINTED ON CERAMIC SUBSTRATES |
I.S. EN 61249-2-8:2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-8: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED BROMINATED EPOXIDE WOVEN FIBREGLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
CEI EN 61249-2-30 : 2014
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
IEC TR 60664-2-1:2011
|
Insulation coordination for equipment within low-voltage systems - Part 2-1: Application guide - Explanation of the application of the IEC 60664 series, dimensioning examples and dielectric testing |
BS EN IEC 61189-5-503 : 2017
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS (IEC 61189-5-503:2017) |
I.S. EN 62739-3:2017
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS |
BS EN 61249-2-8 : 2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-8: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED BROMINATED EPOXIDE WOVEN FIBREGLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
03/100395 DC : DRAFT APR 2003
|
EN 175101-809 - DETAIL SPECIFICATION - TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2,54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75 101-801, WITH ASSESSED QUALITY |
BS 123100(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - RIGID SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITH PLAIN HOLES |
BS EN 61249-4-11 : 2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
EN IEC 61190-1-3 : 2018
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
09/30178203 DC : 0
|
BS EN 61193-3, ED.1 - QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING |
IEC 61249-2-10:2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-10: REINFORCED BASE MATERIALS CLAD AND UNCLAD - CYANATE ESTER, BROMINATED EPOXIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
05/30133287 DC : DRAFT MAY 2005
|
IEC 61190-1-3 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
BS 123600-003(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEX-RIGID MULTILAYER PRINTED BOARDS WITH THROUGH-CONNECTIONS |
IEC 61249-2-34:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-34: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATE SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL TO OR LESS THAN 3,7 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
IEC 61249-2-5:2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-5: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER REINFORCED CORE/WOVEN E-GLASS REINFORCED SURFACES LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
EN IEC 61249-2-47 : 2018
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-47: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY (2.0W/M K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY (IEC 61249-2-47:2018) |
I.S. EN 61249-2-41:2010
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
NF EN 61193-3 : 2013
|
QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING |
IEC 61249-2-45:2018
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-45: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY 1,0 W/(M*K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
CEI EN 61249-2-22 : 2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
IEC 61249-2-11:2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-11: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - POLYIMIDE, BROMINATED EPOXIDE MODIFIED OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
IEC 60097:1991
|
GRID SYSTEM FOR PRINTED CIRCUITS |
IEC 61249-2-6:2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
I.S. EN 61249-4-18:2013
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
I.S. EN 160100:1998
|
CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OFASSESSED QUALITY (SECTIONAL SPECIFICATION) |
I.S. EN 62137-1-1:2007
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST |
CEI EN 61249-2-26 : 2005
|
MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-26: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES RENFORCEES EN TISSU DE VERRE DE TYPE EPOXYDE TISSE/NON TISSE, NON-HALOGENE, D'INFLAMMABILITE DEFINIE (ESSAI DE COMBUSTION VERTICALE), PLAQUEES CUIVRE |
NF EN 62137-1-4 : 2009
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST |
I.S. EN 62090:2017
|
PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES |
CEI EN 61249-2-42 : 2011
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN / WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 61190-1-3 : 2007
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
I.S. EN 61249-2-36:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-36: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
I.S. EN 61192-3:2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES |
I.S. EN 16602-70-10:2015
|
SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS |
IEC 60326-3:1991
|
Printed boards - Part 3: Design and use of printed boards |
CEI EN 61760-1 : 2007
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
CEI EN 61249-4-11 : 2006
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
I.S. EN 62137-1-4:2009
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST |
I.S. EN 61193-1:2002
|
QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES |
I.S. EN 62137-3:2012
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV)) |
I.S. EN 60097:1993
|
GRID SYSTEMS FOR PRINTED CIRCUITS |
I.S. EN 60127-4:2005
|
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV)) |
I.S. EN 61249-2-40:2013
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE, NONHALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY (IEC 61249-2-40:2012 (EQV)) |
I.S. EN 61192-5:2007
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
I.S. EN 61182-7:1998
|
PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM |
I.S. EN 61760-3:2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
I.S. EN IEC 61249-2-47:2018
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-47: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY (2.0W/M K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
NF EN 62137-1-3 : 2009
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST |
CEI EN 61191-4 : 2005
|
PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
I.S. EN 61190-1-2:2014
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
I.S. EN 60603-2:1998
|
CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 2: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS WITH ASSESSED QUALITY, FOR PRINTED BOARDS, FOR BASIC GRID OF 2,54 MM (0,1 IN) WITH COMMON MOUNTING FEATURES |
CEI EN 61189-2-719 : 1ED 2017
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-719: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES - RELATIVE PERMITTIVITY AND LOSS TANGENT (500 MHZ TO 10 GHZ) |
IEC 61190-1-3:2017
|
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications |
CEI EN 61249-2-35 : 2010
|
MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-35: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES EN TISSU DE VERRE DE TYPE E EPOXYDE MODIFIE, PLAQUEES CUIVRE, D'INFLAMMABILITE DEFINIE (ESSAI DE COMBUSTION VERTICALE) POUR LES ASSEMBLAGES SANS PLOMB |
CEI EN 62878-1-1 : 2016
|
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
CEI EN 61249-4-14 : 2010
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
I.S. EN 61193-2:2007
|
QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES |
I.S. EN 123300:1994
|
SECTIONAL SPECIFICATION: MULTILAYER PRINTED BOARDS |
I.S. EN 61249-4-12:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
I.S. EN 62739-2:2016
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING |
I.S. EN 61189-2-719:2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-719: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES - RELATIVE PERMITTIVITY AND LOSS TANGENT (500 MHZ TO 10 GHZ) |
CEI EN 61249-2-41 : 2011
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
I.S. EN 61249-2-39:2013
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-39: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE EPOXIDE AND NON-EPOXIDE, WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY (IEC 61249-2-39:2012 (EQV)) |
BS EN 60127-4 : 2005
|
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
NBR 5318 : 1987
|
CIRCUITOS IMPRESSOS |
I.S. EN 61249-2-22:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
I.S. EN 62326-20:2016
|
PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
I.S. EN 61192-1:2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
IEC 62090:2017
|
Product package labels for electronic components using bar code and two-dimensional symbologies |
CEI EN 61249-2-40 : 2014
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE, MODIFIED, NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
I.S. EN 61249-2-2:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-2: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEETS, HIGH ELECTRICAL GRADE, COPPER-CLAD |
CEI EN 61249-4-12 : 2006
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
BS EN 60664-3:2017
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION (IEC 60664-3:2016) |
I.S. EN 61249-4-5:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
CEI EN 61249-2-36 : 2010
|
MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-36: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES EN TISSU DE VERRE DE TYPE E EPOXYDE, PLAQUEES CUIVRE, D'INFLAMMABILITE DEFINIE (ESSAI DE COMBUSTION VERTICALE) POUR LES ASSEMBLAGES SANS PLOMB |
CEI EN 61249-4-18 : 2014
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
CEI EN 61249-4-5 : 2006
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
I.S. EN 61189-5-503:2017
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
I.S. EN 61192-2:2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES |
I.S. EN 62137-1-2:2007
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST |
I.S. EN 60664-3:2017
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
CEI EN 60068-2-58 : 2016
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
I.S. EN IEC 61249-2-45:2018
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-45: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NONHALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY (1.0W/M K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
CEI EN 61249-2-11 : 2005
|
MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-11: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES RENFORCEES EN POLYIMIDE ET TISSU DE VERRE DE TYPE E EPOXYDE BROME MODIFIE OU NON MODIFIE, D'INFLAMMABILITE DEFINIE (ESSAI DE COMBUSTION VERTICALE), PLAQUEES CUIVRE |
CEI EN 62137-1-1 : 2008
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST |
I.S. EN 61249-4-19:2013
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
IEC 61189-2-630:2018
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-630: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES - MOISTURE ABSORPTION AFTER PRESSURE VESSEL CONDITIONING |
IEC PAS 61249-3-1:2007
|
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) |
CEI EN 62326-1 : 2002
|
PRINTED BOARDS - PART 1: GENERIC SPECIFICATION |
IPC 1752 : A-2
|
MATERIALS DECLARATION MANAGEMENT |
IEC PAS 62137-3:2008
|
Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints |
I.S. EN 60068-2-83:2011
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV)) |
I.S. EN 61249-2-9:2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
I.S. EN 61249-2-35:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
IPC 1756 : 2010
|
MANUFACTURING PROCESS DATA MANAGEMENT |
I.S. EN 123500:1994
|
SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS |
I.S. EN 61249-2-38:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
I.S. EN 61249-2-44:2016
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-44: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 123300 : 1992
|
SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTION SPECIFICATION - MULTILAYER PRINTED BOARDS |
I.S. EN 61249-4-17:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
NF EN 61190-1-3 : 2008 AMD 1 2010
|
Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications |
CEI EN 60068-2-77 : 2001
|
ENVIRONMENTAL TESTING - PART 2-77: TESTS BODY STRENGTH AND IMPACT SHOCK |
IEC TS 62878-2-3:2015
|
Device embedded substrate - Part 2-3: Guidelines - Design guide |
I.S. EN 61189-3-719:2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING |
I.S. EN 61249-2-30:2013
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINATE OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD (IEC 61249-2-30:2012 (EQV)) |
IEC TS 62878-2-1:2015
|
Device embedded substrate - Part 2-1: Guidelines - General description of technology |
CEI EN 60068-2-20 : 2009
|
ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
CEI EN 61249-2-8 : 2004
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-8: REINFORCED BASE MATERIALS CLAD AND UNCLAD MODIFIED BROMINATED EPOXIDE WOVEN FIBERGLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
NF EN 61760-3 : 2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
IEC 60571-1:1990
|
Electronic equipment used on rail vehicles. Part 1: General requirements and tests for electronic equipment |
I.S. EN IEC 61190-1-3:2018
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
CEI EN 61760-3 : 2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
CEI EN 60068-2-83 : 2012
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
I.S. EN 123100:1994
|
SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES |
IEC 60249-3-3:1991
|
Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
I.S. EN 62326-1:2002
|
PRINTED BOARDS - GENERIC SPECIFICATION |
I.S. EN 123200:1994
|
SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES |
BS EN 61249-2-39 : 2013
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-39: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE EPOXIDE AND NON-EPOXIDE, WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEADFREE ASSEMBLY |
BS 6221-2(1991) : 1991
|
PRINTED WIRING BOARDS - METHODS OF TEST |
11/30252859 DC : 0
|
BS EN 61189-3-913 ED.1 - TEST METHODS FOR ELECTRONIC CIRCUIT BOARD FOR HIGH-BRIGHTNESS LEDS |
BS EN 61249-2-42 : 2010
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS EN 61249-4-12 : 2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
BS EN 61249-4-15 : 2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
09/30211071 DC : 0
|
BS EN 61249-2-30 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXCIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINMATE OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
BS 6221-4(1982) : 1982
|
PRINTED WIRING BOARDS - METHOD FOR SPECIFYING SINGLE AND DOUBLE SIDED PRINTED WIRING BOARDS WITH PLAIN HOLES |
I.S. EN 60068-2-20:2008
|
ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
I.S. EN 123000:1994
|
GENERIC SPECIFICATION: PRINTED BOARDS |
I.S. EN 61249-4-1:2008
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
BS EN 60249-1:1993
|
BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: BASE MATERIALS FOR PRINTED CIRCUITS - TEST METHODS |
02/211159 DC : DRAFT DEC 2002
|
IEC 61249-4-2 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-2: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) |
CEI EN 61249-4-19 : 2014
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HICH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
IEC TS 62878-2-4:2015
|
Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG) |
IEC 60321-3:1990
|
Auxiliary printed board information. Part 3: Guidelines for artwork |
IEC 60664-3:2016
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
I.S. EN 61249-2-21:2004
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-21: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
I.S. EN 175101-809:2004
|
DETAIL SPECIFICATION - TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2.54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75101-801, WITH ASSESSED QUALITY |
IEC 60068-2-58:2015+AMD1:2017 CSV
|
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
I.S. EN 60068-2-58:2015
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
I.S. EN 61190-1-1:2002
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
I.S. EN 61249-2-11:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-11: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - POLYIMIDE, BROMINATED EPOXIDE MODIFIED OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
EN 60068-2-77 : 1999
|
ENVIRONMENTAL TESTING - PART 2-77: TESTS - TEST 77: BODY STRENGTH AND IMPACT SHOCK (IEC 60068-2-77:1999) |
I.S. EN 61192-4:2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES |
I.S. EN 62137-1-3:2009
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST |
IEC 61249-2-47:2018
|
Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(mK) and defined flammability (vertical burning test), copper-clad for lead-free assembly |
I.S. EN 61188-5-1:2002
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS |
IEC 60326-10:1991
|
Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections |
IEC 60326-11:1991
|
Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections |
I.S. EN 62878-1-1:2015
|
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
IEC 61191-1:2013
|
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
IEC 61249-2-33:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-33: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATE SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL TO OR LESS THAN 4,1 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
I.S. EN 60068-2-77:1999
|
ENVIRONMENTAL TESTING - PART 2-77: TESTS - TEST 77: BODY STRENGTH AND IMPACT SHOCK |
IEC TR 61189-3-914:2017
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-914: TEST METHOD FOR THERMAL CONDUCTIVITY OF PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS - GUIDELINES |
IEC 61249-2-21:2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-21: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
I.S. EN 61760-1:2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
IEC 61249-2-31:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-31: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATE SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL TO OR LESS THAN 4,1 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
I.S. EN 61190-1-3:2007
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
IEC 61182-1:1994
|
Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form |
IEC 61189-5-503:2017
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
I.S. EN 61191-2:2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
EN 61191-2:2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017) |
NF EN 62090 : 2003
|
PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES |
EN 175101-809:2004/corrigendum Jun. 2005
|
DETAIL SPECIFICATION: TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2,54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75 101-801, WITH ASSESSED QUALITY |
IEC 60664-3:2016 RLV
|
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
BS EN 16602-70-10 : 2015
|
SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS |
BS EN 61191-3:2017
|
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
IEC 61249-2-1:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-1: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS, ECONOMIC GRADE, COPPER CLAD |
IEC 61190-1-2:2014
|
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
IEC 62326-20:2016
|
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
IEC 61249-4-18:2013
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
IEC 61249-2-35:2008
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
BS 123200-003(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - RIGID DOUBLE-SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES |
IEC 61249-4-19:2013
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
IEC TR 62866:2014
|
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
BS EN 61191-4:2017 (published 2017-11)
|
Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV
|
Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types |
IEC 62739-2:2016
|
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing |
IEC 61249-2-9:2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-9: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
DD IEC PAS 61249-3-1 : 2007
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 3-1: COPPER-CLAD LAMINATES FOR FLEXIBLE BOARDS (ADHESIVE AND NON-ADHESIVE TYPES) |
IEC 62739-3:2017
|
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods |
IEC 61188-5-1:2002
|
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
IEC 61249-4-14:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
IEC 62137-1-3:2008
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST |
IEC 61249-4-5:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
IEC 61249-2-26:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-26: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
IEC 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
IEC 61193-1:2001
|
QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES |
IEC 62326-1:2002
|
Printed boards - Part 1: Generic specification |
IEC 61182-2:2006
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
IEC 61191-4:2017
|
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
BS EN 61191-1 : 2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 61249-4-17:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
BS EN 16602-70-11 : 2015
|
SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS |
IEC 61249-2-43:2016
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
IEC 60603-2:1995
|
Connectors for frequencies below 3 MHz for use with printed boards - Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features |
IEC 61249-2-2:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-2: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS, HIGH ELECTRICAL GRADE, COPPER-CLAD |
IEC 61190-1-1:2002
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
IEC 61249-4-11:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
IEC 62137-1-5:2009
|
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test |
IEC 61189-2-719:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) |
IEC 61191-6:2010
|
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method |
ISO 16525-9:2014
|
Adhesives Test methods for isotropic electrically conductive adhesives Part 9: Determination of high-speed signal-transmission characteristics |
IEC 61249-2-30:2012
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINATE OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
IEC 61249-2-37:2008
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NONHALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
IEC 61249-2-44:2016
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-44: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
IEC 61182-2-2:2012
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
BS 123300-003(2001) : 2001
|
SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - RIGID MULTILAYER PRINTED BOARDS |
15/30327712 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
BS EN 61191-2:2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017) |
IEC 62137-1-4:2009
|
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test |
IEC 60068-2-77:1999
|
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock |
PD IEC/TR 62866:2014
|
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing |
11/30255124 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 61249-2-22:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
IEC 62137-1-2:2007
|
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
IEC 62739-1:2013
|
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing |
IEC 61192-1:2003
|
Workmanship requirements for soldered electronic assemblies - Part 1: General |
IEC 61249-4-15:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
IEC 61249-2-36:2008
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-36: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
IEC 61193-3:2013
|
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
IEC 61192-5:2007
|
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
IEC 61249-2-42:2010
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
IEC 60068-2-20:2008
|
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC 61189-3-719:2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING |
IEC 61189-11:2013
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys |
IEC 61249-4-12:2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
IEC 61249-2-39:2012
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-39: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE EPOXIDE AND NON-EPOXIDE, WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
IEC 61192-4:2002
|
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
IEC 61192-2:2003
|
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
IEC 61249-2-23:2005
|
Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad |
IEC 62137-3:2011
|
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints |
IEC 61249-2-8:2003
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-8: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED BROMINATED EPOXIDE WOVEN FIBREGLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
IEC 61249-2-38:2008
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
IEC 61760-3:2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
IEC 62137-1-1:2007
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST |
IEC 61182-7:1995
|
Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form |
IEC 61760-1:2006
|
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
12/30262664 DC : DRAFT APR 2012
|
BS EN 62588 - MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
BS IEC 61182-2:2006
|
PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2: GENERIC REQUIREMENTS |
IEC 61249-4-1:2008
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
IEC 61191-3:2017
|
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
IEC 61193-2:2007
|
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
IEC 62137-4:2014
|
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices |
IEC 60068-2-83:2011
|
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste |
IEC 61249-4-16:2009
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY |
IEC 61249-2-41:2010
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY |
UNE-EN 60664-3:2004
|
Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution |
EN 61760-1:2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
I.S. EN 61191-4:2017
|
PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
I.S. EN 61191-3:2017
|
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
EN 61760-3 : 2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
EN 62326-1 : 2002
|
PRINTED BOARDS - PART 1: GENERIC SPECIFICATION |
EN 61189-11 : 2013
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS |
EN 61249-4-5 : 2005
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY |
EN 123600 : 1996
|
SECTIONAL SPECIFICATION - FLEX-RIGID MULTILAYER PRINTED BOARDS WITH THROUGH CONNECTIONS |
EN 61249-2-37 : 2009
|
Radio-frequency connectors - Part 53: Sectional specification for RF coaxial connectors with inner diameter of outer conductor 16 mm with screw lock - Characteristic impedance 50 Ohm (Type S7-16) |
EN 62137-1-2 : 2007
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST |
EN 61188-5-1 : 2002
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS |
EN 160100 : 1997
|
CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OFASSESSED QUALITY (SECTIONAL SPECIFICATION) |
EN 61192-3 : 2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES |
EN 61249-2-43 : 2016
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY (IEC 61249-2-43:2016) |
EN 62137-1-4 : 2009
|
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST |
EN 60127-4:2005/A2:2013
|
Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types |
|