IEC 60194:2015

Superseded

Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Printed board design, manufacture and assembly - Terms and definitions

Available format(s): Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

Superseded date: 13-12-2017

Language(s): English - French

Published date: 15-04-2015

Publisher: International Electrotechnical Committee

Table of Contents - (Show below) - (Hide below)

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 A
5 B
6 C
7 D
8 E
9 F
10 G
11 H
12 I
13 J
14 K
15 L
16 M
17 N
18 O
19 P
20 Q
21 R
22 S
23 T
24 U
25 V
26 W
27 X
28 Y
29 Z
Annex A (informative) - Principles and use of the
classification code
Annex B (informative) - Abbreviations
Bibliography

Abstract - (Show below) - (Hide below)

IEC 60194:2015 defines the terminology used in the field of printed circuit boards and printed circuit board assembly products. The main changes with respect to the previous edition are the following:
- Some two hundred terms and definitions have been updated, where applicable, and
- another two hundred new terms and definitions have been added.

General Product Information - (Show below) - (Hide below)

Committee	TC 91
Development Note	Stability date: 2022. (04/2015)
Document Type	Standard
ISBN
Pages
Published
Publisher	International Electrotechnical Committee
Status	Superseded
Supersedes	IEC 60194:2006

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
UNE 20902:1993	Identical
CEI 52-39 : 2003	Identical
DIN IEC 60194:1992-11	Identical
CEI EN 60194 : 2009	Identical
I.S. EN 60194:2006	Identical
UNE-EN 60194:2006	Identical
CEI 52 : 1ED 1991	Identical
BS EN 60194:2006	Identical
UNE 20524-2:1977	Identical
NEN EN IEC 60194 : 2006	Identical
BS 4727-1:GRP11(1991) : 1991	Identical
NEN IEC 60194 : 1999	Identical
DIN EN 60194:2007-03	Identical
PN EN 60194 : 2010	Identical
EN 60194:2006	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

BS EN 60249-1:1993	BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: BASE MATERIALS FOR PRINTED CIRCUITS - TEST METHODS
BS EN 61249-2-39:2013	Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
07/30174325 DC : 0	BS EN 61249-2-41 - MATERIALS FOR PRINTED CIRCUIT BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EXPOIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
BS EN 62137-3:2012	Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
CEI EN 62137-1-4 : 2010	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
I.S. EN 62137-1-5:2009	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
11/30253280 DC : 0	BS EN 62326-20 ED.1 - ELECTRONIC CIRCUIT BOARD FOR HIGH-BRIGHTNESS LEDS
BS EN 60603-2:1998 (published 2006-06)	Connectors for frequencies below 3 MHz for use with printed boards Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features
PD IEC/TS 62878-2-1:2015	Device embedded substrate Guidelines. General description of technology
BS EN 61249-4-15:2009	Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
09/30211071 DC : 0	BS EN 61249-2-30 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXCIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINMATE OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
BS EN 61182-2-2:2012	Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
BS EN 61249-2-26:2005	Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
BS EN 61249-2-23:2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-23: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS, ECONOMIC GRADE, COPPER-CLAD
02/211157 DC : DRAFT DEC 2002	IEC 61249-4-12 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
07/30164989 DC : 0	EN 61249-2-36 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-36: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
06/30153524 DC : DRAFT JULY 2006	EN 62137-1-3 - SURFACE-MOUNT TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
07/30164973 DC : 0	EN 61249-2-31 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-31: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 4.1 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
07/30164993 DC : 0	EN 61249-2-37 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
03/107475 DC : 0	IEC 61249-6-3 ED.1.0 - MATERIALS FOR INTERCONNECTION STRUCTURES - PART 6-3: SECTIONAL SPECIFICATION FOR REINFORCEMENTS - WOVEN FIBREGLASS FABRICS
BS EN 61249-4-19:2013	Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
06/30153520 DC : DRAFT JULY 2006	EN 62468 - THE MARKING FOR PRESENCE AND ABSENCE OF THE SPECIFIED CHEMICAL SUBSTANCE IN MATERIALS, COMPONENTS AND MOUNTED BOARDS IN ELECTRICAL AND ELECTRONIC EQUIPMENT
BS 123400-003:2001	SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEXIBLE SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITHOUT THROUGH-CONNECTIONS
05/30133599 DC : DRAFT MAY 2005	IEC 62137-1-2 - SURFACE MOUNT TECHNOLOGY - ENVIRONMENTAL ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
CEI EN 61249-2-39 : 2014	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-39: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE EPOXIDE AND NON-EPOXIDE, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
BS EN 61192-1:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
BS 9761:1977	SPECIFICATION FOR PRINTED CIRCUITS OF ASSESSED QUALITY: SECTIONAL SPECIFICATION FOR MULTILAYER PRINTED CIRCUITS
BS EN 61249-2-43:2016	Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
BS EN 61188-5-1:2002	PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - ATTACHMENT (LAND/JOINT) CONSIDERATIONS - ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
BS PD ISO/IEC PAS 60127-8 : 2014	MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
07/30164985 DC : 0	BS EN 61249-2-34 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-34: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - NON-HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 3.7 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
07/30169763 DC : 0	BS EN 62515 - EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA
CEI EN 61249-2-2 : 2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-2: REINFORCED BASE MATERIALS, CLAD AND UNCLAD PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEETS, HIGH ELECTRICAL GRADE, COPPER-CLAD
BS EN 123200:1992	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED THROUGH HOLES
15/30331587 DC : 0	BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
BS 123800:2001	SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - FLEXIBLE MULTILAYER PRINTED BOARDS WITH THROUGH-CONNECTIONS
02/206695 DC : DRAFT JUN 2002	IEC 61249-2-1. ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES - PART 2-1: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEET, ECONOMIC GRADE, COPPER CLAD
CEI EN 61249-2-5 : 2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 2-5: REINFORCED BASE MATERIALS, CLAD AND UNCLAD BROMINATED EPOXIDE CELLULOSE PAPER REINFORCED CORE / WOVEN E-GLASS REINFORCED SURFACES LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
BS EN 61249-2-2:2005	Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
BS EN IEC 61189-5-503:2017	Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
I.S. EN 62739-3:2017	TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS
BS EN 61249-2-8:2003	Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Reinforced base materials clad and unclad. Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
03/100395 DC : DRAFT APR 2003	EN 175101-809 - DETAIL SPECIFICATION - TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2,54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75 101-801, WITH ASSESSED QUALITY
BS 123100:2001	SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - RIGID SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITH PLAIN HOLES
IEC 61249-2-5:2003	Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
EN IEC 61249-2-47:2018	Materials for printed boards and other interconnecting structures – Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 60326-3:1991	Printed boards - Part 3: Design and use of printed boards
CEI EN 61760-1 : 2007	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
CEI EN 61249-4-11 : 2006	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
I.S. EN 62137-1-4:2009	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
I.S. EN 61193-1:2002	QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
I.S. EN 61249-2-22:2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
I.S. EN 62326-20:2016	PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
I.S. EN 61192-1:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
IEC 62090:2017	Product package labels for electronic components using bar code and two-dimensional symbologies
CEI EN 61249-2-40 : 2014	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE, MODIFIED, NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
I.S. EN 61249-2-2:2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-2: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEETS, HIGH ELECTRICAL GRADE, COPPER-CLAD
CEI EN 61249-4-12 : 2006	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
CEI EN 61249-2-11 : 2005	MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-11: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES RENFORCEES EN POLYIMIDE ET TISSU DE VERRE DE TYPE E EPOXYDE BROME MODIFIE OU NON MODIFIE, D'INFLAMMABILITE DEFINIE (ESSAI DE COMBUSTION VERTICALE), PLAQUEES CUIVRE
I.S. EN 61249-2-44:2016	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-44: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
I.S. EN 61249-2-30:2013	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINATE OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD (IEC 61249-2-30:2012 (EQV))
I.S. EN 123100:1994	SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES
IEC 60249-3-3:1991	Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
IEC 61189-5-503:2017	Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
I.S. EN 61191-2:2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
BS EN 16602-70-10:2015	SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS
BS EN 61191-3:2017	Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
IEC 61249-2-1:2005	Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
IEC 61193-1:2001	Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
IEC 62326-1:2002	Printed boards - Part 1: Generic specification
IEC 61182-2:2006	Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
IEC 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
BS EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
EN 62326-1:2002	Printed boards - Part 1: Generic specification
EN 61189-11 : 2013	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS
EN 61249-4-5:2005	Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
EN 123600:1996	Sectional Specification: Flex-rigid multilayer printed boards with through connections
EN 61249-2-37:2009	Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
EN 62137-1-2:2007	Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
EN 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
EN 160100 : 1997	CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OFASSESSED QUALITY (SECTIONAL SPECIFICATION)
EN 61192-3:2003	Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
EN 61249-2-43:2016	Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
EN 62137-1-4:2009	Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
EN 60127-4:2005/A2:2013	Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
EN 61189-2-719:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
EN 61249-4-19:2013	Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
EN 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61249-4-15 : 2009	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
EN 61249-2-1:2005	Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
EN 62090:2017	Product package labels for electronic components using bar code and two- dimensional symbologies
EN 62137-1-3:2009	Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
EN 62137-1-5:2009	Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
EN 61189-5-503:2017	Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
EN 61182-2-2:2012	Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
EN 123300 : 1992 AMD 1 1995	SECTIONAL SPECIFICATION: MULTILAYER PRINTED BOARDS
EN 62878-1-1:2015	Device embedded substrate - Part 1-1: Generic specification - Test methods
EN 61249-2-26:2005	Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
I.S. EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
EN 61249-2-44:2016	Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
EN 62739-2:2016	Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
EN 61249-4-16:2009	Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
EN 61193-3:2013	Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
EN 61191-3:2017	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
I.S. EN 61249-2-6:2005/AC:2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
CEI EN 61249-2-37 : 2010	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
BS EN 61249-4-18:2013	Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
BS EN 61249-4-16:2009	Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
BS EN 61249-2-1:2005	Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
02/210157 DC : DRAFT OCT 2002	IEC 61249-2-23 ED.1 - MATERIALS FOR INTERCONNECTION STRUCTURES - PART 2-23: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - SECTION 23: NON-HALOGENATED PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEET, ECONOMIC GRADE, COPPER CLAD
I.S. EN 61249-2-23:2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-23: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS, ECONOMIC GRADE, COPPER-CLAD
05/30133278 DC : DRAFT MAY 2005	IEC 62137-1-1 - SURFACE MOUNT TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
BS EN 61249-2-6:2003	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
DIN EN 60097:1993-09	Grid systems for printed circuits (IEC 60097:1991); German version EN 60097:1993
CEI EN 61249-4-16 : 2010	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
I.S. EN 16602-70-11:2015	SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS
11/30252859 DC : 0	BS EN 61189-3-913 ED.1 - TEST METHODS FOR ELECTRONIC CIRCUIT BOARD FOR HIGH-BRIGHTNESS LEDS
BS EN 61249-2-42:2010	Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
BS EN 61249-4-12:2005	Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
BS EN 62326-20:2016	Printed boards Printed circuit boards for high-brightness LEDs
BS EN 61249-4-5:2005	Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability
01/205138 DC : 0	IEC 61249-4-1 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - SECTION 1: EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
09/30206176 DC : DRAFT JUNE 2009	BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
CEI EN 62137-1-5 : 2010	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
BS CECC 23300-800(1990) : AMD 7366	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: CAPABILITY DETAIL SPECIFICATION; MULTILAYER PRINTED BOARDS
BS EN 61189-11:2013	Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys
BS EN 62326-1:2002	Printed boards Generic specification
12/30254697 DC : 0	BS ISO 16525-9 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 9: DETERMINATION OF HIGH-SPEED SIGNAL-TRANSMISSION CHARACTERISTICS
BS 6221-11:1991	PRINTED WIRING BOARDS - SPECIFICATION FOR FLEX-RIGID MULTILAYER PRINTED BOARDS WITH THROUGH CONNECTIONS
07/30165180 DC : 0	BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE
BS 123100-003:2001	SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - RIGID SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITH PLAIN HOLES
11/30243259 DC : 0	BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
BS CECC23100-800(1990) : AMD 7360	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: CAPABILITY DETAIL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES
17/30352677 DC : 0	BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN
NF EN 61191-6 : 2010	PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD
BS EN 62739-2:2016	Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
I.S. EN 61249-2-43:2016	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
BS EN 62878-1-1:2015	DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
BS 9760:1977	SPECIFICATION FOR PRINTED CIRCUITS OF ASSESSED QUALITY:GENERIC DATA AND METHODS OF TEST:CAPABILITY APPROVAL PROCEDURE AND RULES
EN IEC 61249-2-46:2018	Materials for printed boards and other interconnecting structures – Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
BS EN 61249-2-10:2003	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-10: REINFORCED BASE MATERIALS CLAD AND UNCLAD - CYANATE ESTER, BROMINATED EPOXIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
BS CECC23300(1989) : 1989 AMD 7364	SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: MULTILAYER PRINTED BOARDS
I.S. EN 61249-2-1:2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-1: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS, ECONOMIC GRADE, COPPER CLAD
I.S. EN 61193-3:2013	QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING (IEC 61193-3:2013 (EQV))
BS EN 60068-2-83:2011	Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
14/30314209 DC : 0	BS EN 61189-2-719 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-719: TEST METHODS FOR PRINTED BOARD AND ASSEMBLY MATERIALS - RELATIVE PERMITTIVITY AND LOSS TANGENT (500 MHZ TO 10 GHZ)
NF EN 62137-1-5 : 2009	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
02/207116 DC : DRAFT JUN 2002	IEC 61249-2-2. ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES - PART 2-2: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE, HIGH ELECTRICAL GRADE, COPPER CLAD
BS ISO 16525-9:2014	ADHESIVES - TEST METHODS FOR ISOTROPIC ELECTRICALLY CONDUCTIVE ADHESIVES - PART 9: DETERMINATION OF HIGH-SPEED SIGNAL-TRANSMISSION CHARACTERISTICS
BS EN 160100:1998	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION: CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OF ASSESSED QUALITY
BS EN 62739-3:2017	Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
BS EN 61249-2-30:2013	Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
BS EN 61249-2-21:2003	Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
BS EN 61249-2-40:2013	Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
BS EN 62137-1-5:2009	Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
CEI EN 62739-1 : 2014	TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING
BS EN 61249-2-37:2009	Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
09/30186180 DC : 0	BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
CEI EN 61249-2-23 : 2005	MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-23: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES RENFORCEES DE PAPIER CELLULOSE PHENOLIQUE NON HALOGENE, DE QUALITE ECONOMIQUE, PLAQUEES CUIVRE
BS 5830(1979) : 1979	SPECIFICATION FOR GRID SYSTEM FOR PRINTED CIRCUITS
BS EN 61249-2-9:2003	Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Reinforced base materials clad and unclad. Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
BS EN 61249-2-5:2003	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-5: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER REINFORCED CORE/WOVEN E-GLASS REINFORCED SURFACES LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
RC.AERO 54402 : 1975	QUALITY CONTROL PROCEDURE FOR SINGLE-LAYER SCREEN PRINTED ON CERAMIC SUBSTRATES
I.S. EN 61249-2-8:2003	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-8: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED BROMINATED EPOXIDE WOVEN FIBREGLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
CEI EN 61249-2-30 : 2014	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
IEC TR 60664-2-1:2011	Insulation coordination for equipment within low-voltage systems - Part 2-1: Application guide - Explanation of the application of the IEC 60664 series, dimensioning examples and dielectric testing
NF EN 61193-3 : 2013	QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING
IEC 61249-2-45:2018	Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
CEI EN 61249-2-22 : 2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
IEC 61249-2-11:2003	Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
IEC 60097:1991	Grid systems for printed circuits
I.S. EN 61249-2-36:2009	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-36: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
I.S. EN 61192-3:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
I.S. EN 16602-70-10:2015	SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS
I.S. EN 60603-2:1998	CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 2: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS WITH ASSESSED QUALITY, FOR PRINTED BOARDS, FOR BASIC GRID OF 2,54 MM (0,1 IN) WITH COMMON MOUNTING FEATURES
CEI EN 61189-2-719 : 1ED 2017	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-719: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES - RELATIVE PERMITTIVITY AND LOSS TANGENT (500 MHZ TO 10 GHZ)
IEC 61190-1-3:2017	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
CEI EN 61249-2-35 : 2010	MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-35: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES EN TISSU DE VERRE DE TYPE E EPOXYDE MODIFIE, PLAQUEES CUIVRE, D'INFLAMMABILITE DEFINIE (ESSAI DE COMBUSTION VERTICALE) POUR LES ASSEMBLAGES SANS PLOMB
CEI EN 62878-1-1 : 2016	DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
CEI EN 61249-4-14 : 2010	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
I.S. EN 61193-2:2007	QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES
I.S. EN 123300:1994	SECTIONAL SPECIFICATION: MULTILAYER PRINTED BOARDS
I.S. EN 61249-4-12:2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
I.S. EN 62739-2:2016	TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING
I.S. EN 61189-2-719:2016	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-719: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES - RELATIVE PERMITTIVITY AND LOSS TANGENT (500 MHZ TO 10 GHZ)
CEI EN 61249-2-41 : 2011	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
I.S. EN 61249-2-39:2013	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-39: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE EPOXIDE AND NON-EPOXIDE, WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY (IEC 61249-2-39:2012 (EQV))
BS EN 60127-4 : 2005	MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
I.S. EN 62137-1-2:2007	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
I.S. EN 60664-3:2017	INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
CEI EN 60068-2-58 : 2016	ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
I.S. EN IEC 61249-2-45:2018	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-45: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NONHALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY (1.0W/M K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
IEC PAS 62137-3:2008	Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
I.S. EN 60068-2-83:2011	ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV))
I.S. EN 61249-2-9:2003	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
I.S. EN 61249-2-35:2009	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
IPC 1756 : 2010	MANUFACTURING PROCESS DATA MANAGEMENT
I.S. EN 123500:1994	SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
I.S. EN 61249-2-38:2009	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
I.S. EN 61249-4-1:2008	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
I.S. EN 61189-3-719:2016	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING
I.S. EN IEC 61190-1-3:2018	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC TR 61189-3-914:2017	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
IEC 61249-2-21:2003	Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
I.S. EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61249-2-31:2009	Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
I.S. EN 61190-1-3:2007	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 61182-1:1994	Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form
IEC 60664-3:2016 RLV	Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
IEC 61249-2-9:2003	Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
DD IEC/PAS 61249-3-1:2007	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 3-1: COPPER-CLAD LAMINATES FOR FLEXIBLE BOARDS (ADHESIVE AND NON-ADHESIVE TYPES)
IEC 62739-3:2017	Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
IEC 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 61249-4-14:2009	Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC 62137-1-3:2008	Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
IEC 61249-4-5:2005	Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
IEC 61249-2-26:2005	Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
I.S. EN 61191-4:2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61191-3:2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
EN 61760-3:2010	Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
OVE/ONORM EN 61760-1 : 2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
BS EN 60603-3:1998	CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 3: TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING CONTACTS SPACED AT 2,54 MM (0,100 IN) CENTRES AND STAGGERED TERMINATIONS AT THAT SAME SPACING
09/30179135 DC : 0	BS EN 61249-2-42 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROAMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
EN IEC 61249-2-45:2018	Materials for printed boards and other interconnecting structures – Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
EN 60664-3:2017	Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
BS EN 60068-2-58 : 2015	ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
07/30164977 DC : 0	EN 61249-2-32 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-32: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 3.7 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
07/30164981 DC : 0	EN 61249-2-33 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-33: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - NON-HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 4.1 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
I.S. EN 62739-1:2013	TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013 (EQV))
BS EN 61249-2-35:2009	Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
BS EN 61193-2:2007	Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
17/30355504 DC : 0	BS EN 61189-2-630 ED.1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-630: TEST METHODS FOR BASE MATERIALS FOR RIGID PRINTED BOARDS - MOISTURE ABSORPTION AFTER PRESSURE VESSEL CONDITIONING
15/30318681 DC : 0	BS EN 61190-1-3 ED 3.0 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
BS EN 60603-4:1998	CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 4: TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING CONTACTS SPACED AT 1,91 MM (0,075 IN) CENTRES AND STAGGERED TERMINATIONS AT THAT SAME SPACING
BS EN 61249-2-38:2009	Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
02/211156 DC : DRAFT DEC 2002	IEC 61249-4-11 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
DD IEC PAS 62137-3 : DRAFT 2008	ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
14/30312344 DC : 0	PD IEC/PAS 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
I.S. EN 61249-4-15:2009	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
IEC 61249-2-32:2009	Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
BS 123000:2001	SYSTEM OF QUALITY ASSESSMENT - GENERIC SPECIFICATION - PRINTED BOARDS
BS EN 61189-2-719:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)
BS 123400:2001	SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - FLEXIBLE SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITHOUT THROUGH-CONNECTIONS
CEI 109-5 : 2011	INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 2-1: APPLICATION GUIDE - EXPLANATION OF THE APPLICATION OF THE IEC 60664 SERIES, DIMENSIONING EXAMPLES AND DIELECTRIC TESTING
PD IEC/TR 61189-3-914:2017	Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
IEC 61249-2-40:2012	Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
BS EN 61249-4-17:2009	Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
BS EN 61190-1-2:2014	Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly
BS EN 61192-4:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
BS EN 123500:1992	SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
BS EN 61249-4-1:2008	Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
07/30164961 DC : 0	BS EN 61249-4-15 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
07/30169578 DC : 0	BS EN 61188-7 - PRINTED BOARD AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: SECTIONAL REQUIREMENTS - ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION
NF EN 60068-2-83 : 2012	ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
BS EN 62137-1-2:2007	Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
05/30133283 DC : DRAFT MAY 2005	IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
BS EN 62739-1:2013	Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
BS 123700-003:2001	SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEX-RIGID DOUBLE-SIDED PRINTED BOARDS WITH THROUGH-CONNECTIONS
BS EN 123100:1992	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLE S
BS 123600:2001	SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - FLEX-RIGID MULTILAYER PRINTED BOARDS WITH THROUGH-CONNECTIONS
BS 6221-6:1982	PRINTED WIRING BOARDS - SPECIFICATION FOR MULTILAYER PRINTED WIRING BOARDS
BS EN 62090:2017	Product package labels for electronic components using bar code and two- dimensional symbologies
07/30164965 DC : 0	BS EN 61249-4-16 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
10/30235541 DC : 0	BS EN 61249-4-19 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPEG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
BS EN 62137-1-1:2007	Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
BS EN 61760-1:2006	Surface mounting technology Standard method for the specification of surface mounting components (SMDs)
BS EN 61760-3:2010 (published 2010-06)	Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering
13/30284118 DC : 0	BS EN 61249-2-44 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-44: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
BS 6221-5:1982	PRINTED WIRING BOARDS - SPECIFICATION FOR SINGLE AND DOUBLE SIDED RIGID PRINTED BOARDS WITH PLATED-THROUGH HOLES
I.S. EN 61182-2-2:2012	PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV))
I.S. EN 61191-6:2010	PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD
16/30338234 DC : 0	BS EN 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
IEC 60326-9:1991	Printed boards - Part 9: Specification for flexible multilayer printed boards with through connections
16/30336979 DC : 0	BS EN 60664-3 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
BS 6221-7:1982	PRINTED WIRING BOARDS - METHOD FOR SPECIFYING SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED WIRING BOARDS WITHOUT THROUGH CONNECTIONS
BS EN 60068-2-77:1999	ENVIRONMENTAL TESTING - TEST METHODS - BODY STRENGTH AND IMPACT SHOCK
PD IEC/TS 62878-2-3:2015	Device embedded substrate Guidelines. Design guide
BS CECC23100(1989) : 1989 AMD 7358	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES
BS EN 61193-3:2013	QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING
IEC 61249-2-34:2009	Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
I.S. EN 61249-2-41:2010	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
BS EN 61190-1-3 : 2007	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
I.S. EN 61190-1-2:2014	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
I.S. EN 123000:1994	GENERIC SPECIFICATION: PRINTED BOARDS
IEC 61189-2-630:2018	Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
IEC PAS 61249-3-1:2007	Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
CEI EN 62326-1 : 2002	PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
IPC 1752 : A-2	MATERIALS DECLARATION MANAGEMENT
CEI EN 60068-2-77 : 2001	ENVIRONMENTAL TESTING - PART 2-77: TESTS BODY STRENGTH AND IMPACT SHOCK
IEC TS 62878-2-3:2015	Device embedded substrate - Part 2-3: Guidelines - Design guide
NF EN 61760-3 : 2010	SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
IEC 60571-1:1990	Electronic equipment used on rail vehicles. Part 1: General requirements and tests for electronic equipment
CEI EN 60068-2-83 : 2012	ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
IEC 60321-3:1990	Auxiliary printed board information. Part 3: Guidelines for artwork
IEC 61249-2-33:2009	Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
I.S. EN 60068-2-77:1999	ENVIRONMENTAL TESTING - PART 2-77: TESTS - TEST 77: BODY STRENGTH AND IMPACT SHOCK
NF EN 62090 : 2003	PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
EN 175101-809:2004/corrigendum Jun. 2005	DETAIL SPECIFICATION: TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2,54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75 101-801, WITH ASSESSED QUALITY
IEC 61249-4-19:2013	Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC TR 62866:2014	Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
BS EN 61191-4:2017	Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV	Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types
IEC 62739-2:2016	Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
IEC 62137-4:2014	Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
IEC 60068-2-83:2011	Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
IEC 61249-4-16:2009	Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC 61249-2-41:2010	Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
UNE-EN 60664-3:2004	Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
BS 6221-4:1982	PRINTED WIRING BOARDS - METHOD FOR SPECIFYING SINGLE AND DOUBLE SIDED PRINTED WIRING BOARDS WITH PLAIN HOLES
BS 6221-3:1991	PRINTED WIRING BOARDS - GUIDE FOR THE DESIGN AND USE OF PRINTED WIRING BOARDS
BS 6221-3:1984	METHODS OF TEST - GUIDE FOR THE DESIGN AND USE OF PRINTED WIRING BOARDS
OVE/ONORM EN 60068-2-20 : 2009	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
EN 60249-1 : 1993 COR 1994	BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS
BS 6221-2:1991	PRINTED WIRING BOARDS - METHODS OF TEST
CEI EN 61249-4-19 : 2014	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HICH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
10/30235537 DC : 0	BS EN 61249-4-18 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPEG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPEG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
BS EN 61249-2-22:2005	Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
BS 4584-103.3:1992	METAL-CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - SPECIAL MATERIALS USED IN CONNECTION WITH PRINTED CIRCUITS - SPECIFICATION FOR PERMANENT POLYMER COATING MATERIALS (SOLDER RESIST) FOR USE IN THE FABRICATION OF PRINTED BOARDS
CEI EN 61249-2-21 : 2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-21: REINFORCED BASE MATERIALS, CLAD AND UNCLAD NON-HALOGENATED EPOXIDE WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
BS EN 60603-9:1998	CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 9: TWO-PART CONNECTORS FOR PRINTED BOARDS, BACKPANELS AND CABLE CONNECTORS, BASIC GRID OF 2,54 MM (0,1 IN)
BS 123500:2001	SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - FLEXIBLE SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITH THROUGH-CONNECTIONS
BS 123700:2001	SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - FLEX-RIGID DOUBLE-SIDED PRINTED BOARDS WITH THROUGH-CONNECTIONS
96/204228 DC : DRAFT APR 1996	IEC 61182-10 - PRINTED BOARD ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 10: ELECTRONIC DATA HIERARCHY
CEI EN 60097 : 1998	GRID SYSTEMS FOR PRINTED CIRCUITS
IEC 60664-3 REDLINE : 3ED 2016	INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
BS 123200:2001	SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - RIGID DOUBLE-SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES
CEI EN 61249-4-17 : 2010	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
96/205776 DC : DRAFT MAY 1996	BS CECC 200021 - PROCESS ASSESSMENT SCHEDULE FOR MASS LAMINATION PANELS
09/30210900 DC : 0	BS EN 61249-2-40 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE, MODIFIED, NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
BS EN 61182-7:1996	PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM
BS 123500-003:2001	SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEXIBLE SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITH THROUGH-CONNECTIONS
CEI EN 62137-1-3 : 2009	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
I.S. EN 61249-4-16:2009	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
CEI EN 61249-2-1 : 2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-1: REINFORCED BASE MATERIALS, CLAD AND UNCLAD PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS,ECONOMIC GRADE, COPPER CLAD
BS 123800-003:2001	SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEXIBLE MULTILAYER PRINTED BOARDS WITH THROUGH-CONNECTIONS
CEI EN 61249-4-15 : 2010	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
RC.AERO 54406 : 1978	REPAIR AND MODIFICATION OF PRINTED WIRING BOARDS FOR AEROSPACE USE
DIN IEC 60326-4:1993-09	PRINTED BOARDS - PART 4: SPECIFICATION FOR SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES
EN 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
09/30201049 DC : 0	BS EN 61249-2-41 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASED MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
BS EN 61191-6:2010	PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD
BS EN 175101-802:2000 (published 2000-04)	Harmonized system of quality assessment for electronic components. Detail specification Two-part connectors for printed boards for high number of contacts with basic grid of 2,54 mm on 3 or 4 rows
I.S. EN IEC 61249-2-46:2018	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-46: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY (1.0W/M K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
BS CECC23000(1989) : 1989 AMD 7145	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERAL SPECIFICATION: PRINTED BOARDS
BS EN 61189-3-719:2016	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING
13/30284114 DC : 0	BS EN 61249-2-43 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGEN EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
BS EN 62137-1-4:2009	Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
09/30201707 DC : 0	BS EN 60664-3+A1 ED.2 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
CEI EN 61189-5-503 : 1ED 2017	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
BS EN 61190-1-1:2002	Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
07/30164997 DC : 0	EN 61249-2-38 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
BS CECC23500(1990) : 1990 AMD 7369	SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
BS EN 61249-2-11:2003	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-11: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - POLYIMIDE, BROMINATED EPOXIDE MODIFIED OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
BS EN 61192-3:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
BS CECC23200(1989) : 1989 AMD 7361	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED THROUGH HOLES
14/30317095 DC : 0	BS EN 62739-2 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING
BS EN 61249-2-41:2010	Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
BS EN 123000:1992	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: PRINTED BOARDS
BS EN 123400:1992	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS
PD IEC/TS 62878-2-4:2015	Device embedded substrate Guidelines. Test element groups (TEG)
BS CECC23400(1990) : 1990 AMD 7367	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS
07/30153508 DC : 0	BS EN 61249-2-35 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
02/210156 DC : DRAFT OCT 2002	IEC 61249-2-26 ED.1 - MATERIALS FOR INTERCONNECTION STRUCTURES - PART 2-26: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - SECTION 26: NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
09/30211075 DC : 0	BS EN 61249-2-39 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-39: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE EPOXCIDE AND NON-EPOXICDE, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
BS 6221-9:1991	PRINTED WIRING BOARDS - SPECIFICATION FOR FLEXIBLE MULTILAYER BOARDS WITH THROUGH CONNECTIONS
BS EN 60068-2-20:2008	Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads
BS CECC23200-800(1990) : AMD 7363	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: CAPABILITY DETAIL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES
02/211158 DC : DRAFT DEC 2002	IEC 61249-4-5 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
09/30178203 DC : 0	BS EN 61193-3, ED.1 - QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING
IEC 61249-2-10:2003	Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
05/30133287 DC : DRAFT MAY 2005	IEC 61190-1-3 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
BS 123600-003:2001	SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEX-RIGID MULTILAYER PRINTED BOARDS WITH THROUGH-CONNECTIONS
CEI EN 61249-2-26 : 2005	MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-26: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES RENFORCEES EN TISSU DE VERRE DE TYPE EPOXYDE TISSE/NON TISSE, NON-HALOGENE, D'INFLAMMABILITE DEFINIE (ESSAI DE COMBUSTION VERTICALE), PLAQUEES CUIVRE
NF EN 62137-1-4 : 2009	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
I.S. EN 62090:2017	PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
CEI EN 61249-2-42 : 2011	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN / WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
I.S. EN 61182-7:1998	PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM
I.S. EN 61760-3:2010	SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
I.S. EN IEC 61249-2-47:2018	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-47: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY (2.0W/M K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
NF EN 62137-1-3 : 2009	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
CEI EN 61191-4 : 2005	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61192-2:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES
I.S. EN 60068-2-20:2008	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
CEI EN 62137-1-1 : 2008	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
I.S. EN 61249-4-19:2013	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
I.S. EN 61249-4-17:2009	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
NF EN 61190-1-3 : 2008 AMD 1 2010	Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications
IEC TS 62878-2-4:2015	Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
I.S. EN 61192-4:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES
I.S. EN 62137-1-3:2009	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
IEC 61249-2-47:2018	Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
I.S. EN 61188-5-1:2002	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
IEC 60326-10:1991	Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections
IEC 60326-11:1991	Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections
I.S. EN 62878-1-1:2015	DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61249-2-35:2008	Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
BS 123200-003:2001	SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - RIGID DOUBLE-SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES
IEC 62137-1-5:2009	Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
IEC 61189-2-719:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
IEC 61191-6:2010	Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
ISO 16525-9:2014	Adhesives Test methods for isotropic electrically conductive adhesives Part 9: Determination of high-speed signal-transmission characteristics
IEC 61249-2-30:2012	Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
IEC 61249-2-37:2008	Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 61249-2-44:2016	Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 61182-2-2:2012	Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
BS 123300-003:2001	SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - RIGID MULTILAYER PRINTED BOARDS
15/30327712 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
BS EN 61191-2:2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
IEC 62137-1-4:2009	Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
IEC 60068-2-77:1999	Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
PD IEC/TR 62866:2014	Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
11/30255124 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 61249-2-22:2005	Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
IEC 62137-1-2:2007	Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
IEC 62739-1:2013	Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
IEC 61192-1:2003	Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 61249-4-15:2009	Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC 61249-2-36:2008	Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 61193-3:2013	Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
IEC 61192-5:2007	Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
IEC 61249-2-42:2010	Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61189-3-719:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
IEC 61189-11:2013	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
IEC 61249-4-12:2005	Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
IEC 61249-2-39:2012	Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 61192-4:2002	Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
IEC 61192-2:2003	Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
IEC 61249-2-23:2005	Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
IEC 62137-3:2011	Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
IEC 61249-2-8:2003	Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
IEC 61249-2-38:2008	Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 61760-3:2010	Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
IEC 62137-1-1:2007	Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
IEC 61182-7:1995	Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
12/30262664 DC : DRAFT APR 2012	BS EN 62588 - MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
BS IEC 61182-2:2006	PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2: GENERIC REQUIREMENTS
IEC 61249-4-1:2008	Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
IEC 61191-3:2017	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC 61193-2:2007	Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
EN 61182-7 : 1995	PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM
EN 62137-1-1 : 2007	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
EN 62739-1 : 2013	TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013)
EN 16602-70-10:2015	Space product assurance - Qualification of printed circuit boards
EN 16602-70-11:2015	Space product assurance - Procurement of printed circuit boards
02/211159 DC : DRAFT DEC 2002	IEC 61249-4-2 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-2: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
BS EN 62137-1-3:2009	Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
I.S. EN 61249-2-37:2009	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
IEC 61192-3:2002	Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
PD IEC/TR 60664-2-1:2011	Insulation coordination for equipment within low-voltage systems Application guide. Explanation of the application of the IEC 60664 series, dimensioning examples and dielectric testing
BS EN 61249-2-36:2009	Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
BS EN 62137-4:2014	Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
BS EN 61193-1:2002	QUALITY ASSESSMENT SYSTEMS - REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
I.S. EN 62137-4:2014	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
CEI EN 61249-2-38 : 2009	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
CEI EN 61249-4-1 : 2010	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
CEI EN 61249-2-6 : 2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
BS EN 61249-4-14:2009	Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
BS EN 60603-10:1998	CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 10: TWO-PART CONNECTORS FOR PRINTED BOARDS FOR BASIC GRID OF 2,54 MM (0,1 IN), INVERTED TYPE
BS EN 60603-8:1998	CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 8: TWO-PART CONNECTORS FOR PRINTED BOARDS FOR BASIC GRID OF 2,54 MM (0,1 IN), WITH SQUARE MALE CONTACTS OF 0,63 MM X 0, 63 MM
BS EN 61192-5:2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
I.S. EN 61249-4-11:2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
04/30123452 DC : DRAFT OCT 2004	IEC 61249-2-22 ED 1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED NONHALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
BS EN 61192-2:2003	Workmanship requirements for soldered electronic assemblies Surface-mount assemblies
CEI EN 62137-1-2 : 2008	SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
CEI EN 62137-3 : 2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
07/30164957 DC : 0	BS EN 61249-4-14 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
BS 123300:2001	SYSTEM OF QUALITY ASSESSMENT - SECTIONAL SPECIFICATION - RIGID MULTILAYER PRINTED BOARDS
BS 6221-8:1982	PRINTED WIRING BOARDS - METHOD FOR SPECIFYING SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED WIRING BOARDS WITH THROUGH CONNECTIONS
BS 6221-10:1991	PRINTED WIRING BOARDS - SPECIFICATION FOR FLEX-RIGID DOUBLE-SIDED PRINTED BOARDS WITH THROUGH CONNECTIONS
07/30164969 DC : 0	EN 61249-4-17 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
IEC 61249-2-46:2018	Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
I.S. EN 61249-2-42:2010	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
I.S. EN 61249-4-14:2009	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
IEC 61189-3-913:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
I.S. EN 60249-1:1994	BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS
I.S. EN 61249-2-26:2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-26: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
I.S. EN 61189-11:2013	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS (IEC 61189-11:2013 (EQV))
BS EN 175101-809:2004	Harmonized system of quality assessment for electronic components. Detail specification Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality
12/30258438 DC : 0	BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
16/30333617 DC : 0	BS EN 62090 - PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
05/30138801 DC : DRAFT SEP 2005	IEC 60068-2-20 ED 5 - BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2-20: TEST - TEST T - TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF LEADED DEVICES
BS EN 61249-4-11:2005	Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability