BS EN 60191-6-5 - GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE - DESIGN GUIDE FOR FINE-PITCH BALL GRID (FBGA)

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Hardcopy , PDF

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English

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British Standards Institution

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Nominal package dimension
6 Outline drawings and principle dimensions
7 Dimensions

BS EN 60191-6-5

Committee	EPL/47
DocumentType	Draft
Pages	22
PublisherName	British Standards Institution
Status	Current

IEC 60191-6:2009

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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BS EN 60191-6-5 - GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE - DESIGN GUIDE FOR FINE-PITCH BALL GRID (FBGA)

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Abstract

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Standards Referencing This Book

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