09/30211762 DC : 0
Current
Current
The latest, up-to-date edition.
BS EN 60191-6-5 - GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE - DESIGN GUIDE FOR FINE-PITCH BALL GRID (FBGA)
Available format(s)
Hardcopy , PDF
Language(s)
English
Publisher
€22.71
Excluding VAT
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Nominal package dimension
6 Outline drawings and principle dimensions
7 Dimensions
BS EN 60191-6-5
| Committee |
EPL/47
|
| DocumentType |
Draft
|
| Pages |
22
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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