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  • IEC 60191-6:2009

    Current The latest, up-to-date edition.

    Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  26-11-2009

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Design rules
    5 Dimensions to be specified
    6 Notes
    Annex A (informative) - Illustration of the rules
    Annex B (informative) - Optional table format
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 60191-6:2009 gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4. This third edition of IEC 60191-6 cancels and replaces the second edition, published in 2004 and constitutes a technical revision. This edition includes the following significant changes with respect to the previous edition:
    a) scope is modified to cover all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8;
    b) editorial modifications on several pages; and
    c) technical revision to ball grid array package (BGA) especially its geometrical drawing format. (two types of BGA would unify as one type as a result of revising drawing format.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47D
    Development Note Stability Date: 2020. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS IEC 60191-1 : 2007 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
    CEI EN 60191-6-17 : 2012 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA)
    13/30284025 DC : 0 BS EN 60191-6-13 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA)
    08/30175763 DC : DRAFT JAN 2008 BS EN 60191-6-18 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
    CEI EN 60191-6-5 : 2002 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-5: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH BALL GRID ARRAY (FBGA)
    I.S. EN 61837-3:2015 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 3: METAL ENCLOSURES
    CEI EN 60191-6-13 : 2009 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINEPITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA)
    CEI EN 60191-6-1 : 2003 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GULL-WING LEAD TERMINALS
    BS EN 61240:2012 Piezoelectric devices. Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection. General rules
    CEI EN 61760-1 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    BS EN 60191-6-18 : 2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
    I.S. EN 60191-6-17:2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA)
    EN 61837-2:2011/A1:2014 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 2: CERAMIC ENCLOSURES (IEC 61837-2:2011/A1:2014)
    EN 60191-6-20:2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ)
    EN 60191-6-13 : 2016 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA) (IEC 60191-6-13:2016)
    EN 60191-6-18 : 2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
    EN 61837-3:2015 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 3: METAL ENCLOSURES (IEC 61837-3:2015)
    EN 60191-6-17 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA)
    EN 61240 : 2017 PIEZOELECTRIC DEVICES - PREPARATION OF OUTLINE DRAWINGS OF SURFACE-MOUNTED DEVICES (SMD) FOR FREQUENCY CONTROL AND SELECTION - GENERAL RULES (IEC 61240:2016)
    EN 60191-6-1 : 2001 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GULL-WING LEAD TERMINALS
    NF EN 60191-6-18 : 2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
    11/30248240 DC : 0 BS EN 60191-6-22 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-22: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR SEMICONDUCTOR PACKAGES - SILICON FINE-PITCH BALL GRID ARRAY AND SILICON FINE-PITCH LAND GRID ARRAY (S-FBGA AND S-FLGA)
    BS EN 60191-6-5 : 2001 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMI-CONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH BALL GRID ARRAY (FBGA)
    05/30132033 DC : DRAFT APR 2005 IEC 60191-6-13 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP TYPE SOCKET FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA)
    BS EN 60191-6-21 : 2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
    17/30352677 DC : 0 BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN
    CEI EN 60191-6-4 : 2004 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)
    I.S. EN 60191-1:2007 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
    BS EN 60191-6-12 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDELINES FOR FINE-PITCH LAND GRID ARRAY (FLGA)
    I.S. EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
    IEC 61837-3:2015 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures
    CEI EN 60191-6-3 : 2001 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAD FLAT PACKS (QFP)
    08/30190026 DC : 0
    I.S. EN 60191-6-20:2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ)
    CEI EN 60191-1 : 2008 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
    NF EN 60191-6-21 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
    BS EN 60191-6-2 : 2002 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-2: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR 1,50 MM, 1,27 MM AND 1,00 MM PITCH BALL AND COLUMN TERMINAL PACKAGES
    BS EN 60191-6-1 : 2001 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GULL-WING LEAD TERMINALS
    NF EN 60191-6-20 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ)
    13/30278807 DC : 0 BS EN 61837-3 - SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTI0N - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 3: METAL ENCLOSURE
    CEI EN 60191-6-18 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
    CEI EN 60191-6-22 : 2014 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-22: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR SEMICONDUCTOR PACKAGES SILICON FINE-PITCH BALL GRID ARRAY AND SILICON FINE-PITCH LAND GRID ARRAY (S-FBGA AND S-FLGA)
    CEI EN 60191-6-21 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
    BS EN 61760-1 : 2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    09/30211762 DC : 0 BS EN 60191-6-5 - GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE - DESIGN GUIDE FOR FINE-PITCH BALL GRID (FBGA)
    CEI EN 60191-6-12 : 2012 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDELINES FOR FINE-PITCH LAND GRID ARRAY (FLGA)
    BS EN 60191-6-3 : 2001 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAD FLAT PACKS (QFP)
    I.S. EN 60191-6-5:2002 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-5: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH BALL GRID ARRAY (FBGA)
    I.S. EN 60191-6-13:2016 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA)
    I.S. EN 60191-6-18:2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
    CEI EN 61240 : 2013 PIEZOELECTRIC DEVICES - PREPARATION OF OUTLINE DRAWINGS OF SURFACE-MOUNTED DEVICES (SMD) FOR FREQUENCY CONTROL AND SELECTION - GENERAL RULES
    IEC 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
    EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    CEI EN 60191-6-20 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ)
    I.S. EN 61837-2:2011 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 2: CERAMIC ENCLOSURES
    09/30200401 DC : 0 BS EN 61240 ED.2 - PIEZOELECTRIC DEVICES - PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED DEVICES (SMD) FOR FREQUENCY CONTROL AND SELECTION - GENERAL RULES
    BS EN 60191-6-17 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA)
    BS EN 60191-6-20 : 2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ)
    I.S. EN 60191-6-21:2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
    15/30323430 DC : 0 BS EN 61240 - PIEZOELECTRIC DEVICES - PREPARATION OF OUTLINE DRAWINGS OF SURFACE-MOUNTED DEVICES (SMD) FOR FREQUENCY CONTROL AND SELECTION - GENERAL RULES
    05/30129010 DC : DRAFT FEB 2005 IEC 60191-1 ED.2 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
    I.S. EN 61240:2017 PIEZOELECTRIC DEVICES - PREPARATION OF OUTLINE DRAWINGS OF SURFACE-MOUNTED DEVICES (SMD) FOR FREQUENCY CONTROL AND SELECTION - GENERAL RULES
    BS EN 61837-3:2015 Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections Metal enclosures
    IEC 60191-6-12:2011 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
    IEC 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
    IEC 60191-6-1:2001 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    IEC 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
    IEC 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
    IEC 61240:2016 Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
    IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    IEC 60191-6-13:2016 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
    EN 60191-6-22 : 2013 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-22: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR SEMICONDUCTOR PACKAGES SILICON FINE-PITCH BALL GRID ARRAY AND SILICON FINE-PITCH LAND GRID ARRAY (S-FBGA AND S-FLGA) (IEC 60191-6-22:2012)
    09/30200395 DC : 0 BS EN 61837-2 ED. 2 - SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 2: CERAMIC ENCLOSURES
    BS EN 60191-6-22 : 2013 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-22: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR SEMICONDUCTOR PACKAGES SILICON FINE-PITCH BALL GRID ARRAY AND SILICON FINE-PITCH LAND GRID ARRAY (S-FBGA AND S-FLGA)
    BS EN 60191-6-13:2016 Mechanical standardization of semiconductor devices Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
    10/30215537 DC : 0 BS EN 60191-6-12 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH LAND GRID ARRAY (FLGA) - RECTANGULAR TYPE
    08/30190030 DC : 0 BS EN 60191-6-21 ED.1 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
    BS EN 60191-6-4 : 2003 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)
    07/30155531 DC : 0 BS EN 60191-6-17 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: DESIGN GUIDE FOR STACKED PACKAGES AND INDIVIDUAL STACKABLE PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY PACKAGES (FBGA/FLGA)
    I.S. EN 60191-6-4:2003 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)
    I.S. EN 60191-6-1:2002 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES DESIGN GUIDE FOR GULL-WING LEAD TERMINALS
    BS EN 61837-2 : 2011 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 2: CERAMIC ENCLOSURES
    I.S. EN 60191-6-22:2013 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-22: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR SEMICONDUCTOR PACKAGES SILICON FINE-PITCH BALL GRID ARRAY AND SILICON FINE-PITCH LAND GRID ARRAY (S-FBGA AND S-FLGA) (IEC 60191-6-22:2012 (EQV))
    I.S. EN 60191-6-12:2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDELINES FOR FINE-PITCH LAND GRID ARRAY (FLGA)
    IEC 60191-6-4:2003 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
    IEC 60191-6-3:2000 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
    IEC 60191-6-22:2012 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
    EN 60191-1 : 2007 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
    EN 60191-6-21 : 2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
    EN 60191-6-5 : 2001 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-5: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH BALL GRID ARRAY (FBGA)
    EN 60191-6-4 : 2003 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)
    EN 60191-6-12:2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDELINES FOR FINE-PITCH LAND GRID ARRAY (FLGA)
    EN 60191-6-3:2000 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAD FLAT PACKS (QFP)

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
    ISO 2692:2014 Geometrical product specifications (GPS) Geometrical tolerancing Maximum material requirement (MMR), least material requirement (LMR) and reciprocity requirement (RPR)
    ISO 1101:2017 Geometrical product specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run-out
    IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
    IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
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