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  • PD IEC/TS 62878-2-1:2015

    Current The latest, up-to-date edition.

    Device embedded substrate Guidelines. General description of technology

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  30-04-2015

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms, definitions and abbreviations
    4 Technology of device embedded substrate
    5 Jisso mounting and interconnection
    6 Naming of each section
    Bibliography

    Abstract - (Show below) - (Hide below)

    Defines the basics of device embedding substrate.

    Scope - (Show below) - (Hide below)

    This part of IEC 62878 describes the basics of device embedding substrate.

    This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

    The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Document Type Standard
    Publisher British Standards Institution
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
    IEC 62421:2007 Electronics assembly technology - Electronic modules
    IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
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