• IEC TS 62878-2-3:2015

    Current The latest, up-to-date edition.

    Device embedded substrate - Part 2-3: Guidelines - Design guide

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  27-03-2015

    Publisher:  International Electrotechnical Committee

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    Abstract - (Show below) - (Hide below)

    IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

    General Product Information - (Show below) - (Hide below)

    Development Note Stability date: 2018. (03/2015)
    Document Type Technical Specification
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    PD IEC/TS 62878-2-1:2015 Device embedded substrate Guidelines. General description of technology
    EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
    PD IEC/TS 62878-2-4:2015 Device embedded substrate Guidelines. Test element groups (TEG)
    IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
    I.S. EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 62421:2007 Electronics assembly technology - Electronic modules
    IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
    IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
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