EN 61188-5-6:2003

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Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

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Published date: 04-04-2003

Publisher: European Committee for Standards - Electrical

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Table of Contents - (Show below) - (Hide below)

INTRODUCTION
1 Scope and object
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 QFJ (square)
  4.1 Introductory remark
  4.2 Component description
  4.3 Component dimensions
  4.4 Solder joint fillet design
  4.5 Land pattern dimensions
5 QFJ (rectangular)
  5.1 Introductory remark
  5.2 Component description
  5.3 Component dimensions
  5.4 Solder joint fillet design
  5.5 Land pattern dimensions
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography
Figures

Abstract - (Show below) - (Hide below)

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

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Committee	CLC/SR 91
Development Note	To be read in conjunction with EN 61188-5-1 (05/2003)
Document Type	Standard
ISBN
Pages
Published
Publisher	European Committee for Standards - Electrical
Status	Current

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Equivalent Standard(s)	Relationship
NF EN 61188-5-6 : 2003	Identical
BS EN 61188-5-6:2003	Identical
NBN EN 61188 5-6 : 2004	Identical
CEI EN 61188-5-6 : 2004	Identical
PN EN 61188-5-6 : 2003	Identical
NEN EN IEC 61188-5-6 : 2003	Identical
DIN EN 61188-5-6:2003-10	Identical
IEC 61188-5-6:2003	Identical
UNE-EN 61188-5-6:2003	Identical
I.S. EN 61188-5-6:2003	Identical

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IPC J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
EN 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 60191-2:2012 DB	Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IPC SM 782 : A1993 AMD 2 1999	SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

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