IEC 61760-1:2006

FOREWORD
INTRODUCTION
1 Scope and object
  1.1 Scope
  1.2 Object
2 Normative references
3 Terms and definitions
4 Requirements for component design and component
  specifications
  4.1 General requirement
  4.2 Packaging
  4.3 Labelling of product packaging
  4.4 Component marking
  4.5 Storage and transportation
  4.6 Component outline and design
  4.7 Mechanical stress
  4.8 Component reliability assurance
  4.9 Additional requirements for compatibility with
      lead-free soldering
5 Specification of assembly process conditions
  5.1 General
  5.2 Securing the component on the substrate prior
      to soldering
  5.3 Mounting methods
  5.4 Cleaning (where applicable)
  5.5 Removal and/or replacement of SMDs
6 Typical process conditions
  6.1 Soldering processes, temperature/time profiles
  6.2 Typical cleaning conditions for assemblies
7 Requirements for components and component specifications
  related to suitability with various mounting processes
  7.1 General
  7.2 Wettability
  7.3 Resistance to dissolution of metallization
  7.4 Resistance to soldering heat
  7.5 Resistance to cleaning solvent
  7.6 Soldering profiles
  7.7 Bonding strength test for the component glue interface
      test
Bibliography

IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.