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IPC SM 782 : A1993 AMD 2 1999

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Superseded date

01-02-2005

Published date

12-01-2013

1.0 SCOPE
     1.1 Purpose
     1.2 Performance Classification
     1.3 Assembly Types
     1.4 Presentation
     1.5 Profile Tolerances
     1.6 Land Pattern Determination
2.0 APPLICABLE DOCUMENTS
     2.1 IPC
     2.2 Electronic Industries Association
     2.3 Joint Industry Standards (IPC)
     2.4 American Society of Mechanical Engineers
3.0 DESIGN REQUIREMENTS
     3.1 Terms and Definitions
     3.2 Component Acronyms
     3.3 Dimensioning Systems
     3.4 Design for Producibility
     3.5 Environmental Constraints
     3.6 Design Rules
     3.7 Outer Layer Finishes
4.0 QUALITY AND RELIABILITY VALIDATION
     4.1 Validation Techniques
     4.2 Test Patterns-In-Process Validator
     4.3 Stress Testing
5.0 TESTABILITY
     5.1 Testing Considerations
     5.2 Nodal Access
     5.3 Full Nodal Access
     5.4 Limited Nodal Access
     5.5 No Nodal Access
     5.6 Clam Shell Fixtures Impact
     5.7 Printed Board Test Characteristics
6.0 PACKAGING AND INTERCONNECTING STRUCTURE TYPES
     6.1 General Considerations
     6.2 Organic-Base Material P&IS
     6.3 Non-Organic Base Materials
     6.4 Supporting-Plane P&I Structures
     6.5 Constraining Core P&I Structures
7.0 ASSEMBLY CONSIDERATIONS FOR SURFACE MOUNT TECHNOLOGY
     (SMT)
     7.1 SMT Assembly Process Sequence
     7.2 Substrate Preparation Adhesive, Solder Paste
     7.3 Component Placement
     7.4 Soldering
     7.5 Cleaning
     7.6 Repair/Rework
8.0 DISCRETE COMPONENTS
     8.1 Chip Resistors
     8.2 Chip Capacitors
     8.3 Inductors
     8.4 Tantalum Capacitors
     8.5 Metal Electrode Face (MELF) Components
     8.6 Small Outline Transistor (SOT)
     8.7 Small Outline Transistor (SOT)
     8.8 Small Outline Diode (SOD)
     8.9 Small Outline Transistor (SOT)
     8.10 Small Outline Transistor (SOT)
     8.11 Modified Through-Hole Component (TO)
9.0 COMPONENTS WITH GULLWING LEADS ON TWO SIDES
     9.1 Small Outline Integrated Circuits (SOIC)
     9.2 Small Outline Integrated Circuits (SSOIC)
     9.3 Small Outline Package Integrated Circuit
          (SOPIC)
     9.4 Thin Small Outline Package
     9.5 Ceramic Flat Pack (CFP)
10.0 COMPONENTS WITH J LEADS ON TWO SIDES
     10.1 Small Outline Integrated Circuits with J Leads
          (SOJ)-7.63 mm [0.300] Body Size
     10.2 Small Outline Integrated Circuits with J Leads
          (SOJ)-8.88 mm [0.350] Body Size
     10.3 Small Outline Integrated Circuits with J Leads
          (SOJ)-10.12 mm [0.400] Body Size
     10.4 Small Outline Integrated Circuits with J Leads
          (SOJ)-11.38 mm [0.450] Body Size
11.0 COMPONENTS WITH GULLWING LEADS ON FOUR SIDES
     11.1 Plastic Quad Flat Pack (PQFP)
     11.2 Shink Quad Flat Pack (SQFP), Square
     11.3 Shrink Quad Flat Pack (SQFP), Rectangular
     11.4 Ceramic Quad Flat Pack (CQFP)
12.0 COMPONENTS WITH J LEADS ON FOUR SIDES
     12.1 Plastic Leaded Chip Carrier (PLCC), Square
     12.2 Plastic Leaded Chip Carrier (PLCC), Rectangular
     12.3 Leadless Ceramic Chip Carrier (LCC)
13.0 MODIFIED DUAL-IN-LINE PIN (DIP) COMPONENTS
     13.1 DIP
14.0 COMPONENTS WITH BALL GRID ARRAY CONTACTS
     14.1 Plastic Ball Grid Array
     14.2 1.27 mm Pitch Rectangular PBGA JEDEC
          MS-028
Figures
Tables

Covers land patterns for all types of passive and active components, including resistors, capacitors, MELFs, SOTs, SOPs, SOICs, TSOPs, QFPs, LCCS, PLCCS, and most recently, BGAs. Also included are EIA/JEDEC registered components, land pattern guidelines for wave or reflow soldering, a sophisticated dimensioning system, via location guidelines and V-groove scoring.

DevelopmentNote
Reprinted version includes Amendments 1 and 2 (02/2000) Included in Manuals IPC M 103, IPC M 105, IPC M 106 & the IPC E 500 Collection. (09/2003)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Superseded

I.S. EN 61188-5-2:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
IEC PAS 62050:2004 Board level drop test method of components for handheld electronic products
EN 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
EN 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
IPC 2224 : 0 SECTIONAL STANDARD FOR DESIGN OF PWBS FOR PC CARDS
IPC A 610 SPANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ROMANIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 2225 : 0 SECTIONAL DESIGN STANDARD FOR ORGANIC MULTICHIP MODULES (MCM-L) AND MCM-L ASSEMBLIES
IPC A 610 CZECH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC SM 780 : 0 COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING
IPC D 330 : 1992 DESIGN GUIDE MANUAL
IPC TA 723 : 1991 TECHNOLOGY ASSESSMENT HANDBOOK ON SURFACE MOUNTING
IPC A 610 GERMAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HINDI : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ESTONIAN : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 POLISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 DUTCH : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 KOREAN : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ITALIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC EM 782 : 1996 SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD SPREADSHEET
IPC A 610 SWEDISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HUNGARIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC D 949 : 1987 RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR,
IPC A 610 TURKISH : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 JAPANESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 RUSSIAN : D ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 VIETNAMESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC SM 784 : 0 GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION
IPC J STD 013 : 0 IMPLEMENTATION OF BALL GRID ARRAY AND OTHER HIGH DENSITY TECHNOLOGY
IEC 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
DD IEC PAS 62050 : DRAFT 2004 BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
I.S. EN 61188-5-6:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
IPC J STD 027 : 0 MECHANICAL OUTLINE STANDARD FOR FLIP CHIP AND CHIP SIZE CONFIGURATIONS
BS EN 61188-5-6:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
IPC 1902 : 1998 GRID SYSTEMS FOR PRINTED CIRCUITS
BS EN 61188-5-2:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components

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