• I.S. EN ISO 9453:2014

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS (ISO 9453:2014)

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  30-04-2021

    Language(s):  English

    Published date:  01-01-2014

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Introduction
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Chemical composition
    5 Forms of delivery
    6 Sampling and analysis
    7 Marking, labelling and packaging
    Annex A (informative) - Comparison between alloy numbers
            in ISO 9453 and short names and chemical
            compositions according to IEC 61190-1-3
    Annex B (informative) - Patented alloys and patent holder list
    Bibliography

    Abstract - (Show below) - (Hide below)

    Defines the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes I.S. EN 29453. (11/2006)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Withdrawn
    Superseded By
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    ISO 3677:2016 Filler metal for soldering and brazing — Designation
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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