FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Apparatus
5 Procedure
5.1 General
5.2 Sequence of inspection
5.3 Inspection control
5.4 Re-inspection
5.5 Exclusions
5.6 Magnification
5.7 Format and conventions
5.8 Interpretations
6 Thin film element inspection
6.1 Operating metallization non-conformances - 'high
magnification'
6.2 Passivation non-conformances 'high magnification'
6.3 Glassivation non-conformances, 'high magnification'
6.4 Substrate non-conformances 'high magnification'
6.5 Foreign material non-conformances 'low magnification'
6.6 Thin film resistor non-conformances, 'high
magnification'
6.7 Laser trimmed thin film resistor non-conformances,
'high magnification'
6.8 Multilevel thin film non-conformances, 'high
magnification'
6.9 Coupling (air) bridge non-conformances 'high
magnification'
7 Planar thick film element inspection
7.1 Operating metallization non-conformances 'low
magnification'
7.2 Substrate non-conformances, 'low magnification'
7.3 Thick film resistor non-conformances, 'low
magnification'
7.4 Trimmed thick film resistor non-conformances, 'low
magnification'
7.5 Multilevel thick film non-conformances, 'low
magnification'
7.6 All thin film capacitors and overlay capacitors used
in GaAs microwave devices, 'low magnification'
8 Active and passive elements
9 Element attachment (assembly), 'magnification 10x to 60x'
9.1 Solder connections (general appearance)
9.2 Element attachment requirements
9.3 Leaded and leadless element attachment
9.4 Dual-in-line integrated circuit attachment (butt joints)
9.5 Axial and radial leaded components (lap joints)
9.6 Components with feet (combined butt and lap joints)
9.7 Leadless chip carriers
10 Element orientation
11 Separation
12 Bond inspection, magnification 30x to 60x
12.1 Ball bonds
12.2 Wire wedge bonds
12.3 Tailless bonds (crescent)
12.4 Compound bond
12.5 Beam lead
12.6 Mesh bonding
12.7 Ribbon bonds
12.8 General
13 Internal leads (e.g. wires, ribbons, beams, wire loops,
ribbon loops, beams, etc.), 'magnification 10x to 60x'
14 Screw tabs and through-hole mounting, magnification 3x
to 10x
15 Connector and feedthrough centre contact soldering,
magnification 10x to 30x
16 Package conditions, solder assemblies, lead frame
attachments, conformal coating, 'magnification 10x to 60x'
16.1 Package conditions
16.2 Lead frame attachment
16.3 Conformal coating
17 Non-planar element inspection
17.1 General non-planar element non-conformances, 'low
magnification'
17.2 Foreign material non-conformances 'low magnification'
17.3 Ceramic chip capacitor non-conformances 'low
magnification'
17.4 Tantalum chip capacitor non-conformances, 'low
magnification'
17.5 Parallel plate chip capacitor non-conformances, 'low
magnification'
17.6 Inductor and transformer non-conformances, 'low
magnification'
17.7 Chip resistor non-conformances, 'low magnification'
18 Surface acoustic wave (SAW) element inspection
18.1 Operating metallization non-conformances 'low
magnification'
18.2 Substrate material non-conformances 'low magnification'
18.3 Foreign material non-conformances 'low magnification'
19 Summary
20 Radiographic inspection
20.1 Requirements
21 Particle impact noise detection (PIND) test
21.1 General
21.2 Equipment
21.3 Test procedure
21.4 Failure criteria
21.5 Lot acceptance
21.6 The detail specification
Figures
Table 1