• IEC 60747-1:2006+AMD1:2010 CSV

    Current The latest, up-to-date edition.

    Semiconductor devices - Part 1: General

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English, English - French

    Published date:  23-08-2010

    Publisher:  International Electrotechnical Committee

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    Abstract - (Show below) - (Hide below)

    IEC 60747-1:2006+A1:2010 gives the general requirements applicable to the discrete semiconductor devices and integrated circuits covered by the other parts of IEC 60747 and IEC 60748 (see Annex A). This consolidated version consists of the second edition (2006) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.

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    Committee TC 47
    Development Note Supersedes IEC 60147-2A, IEC 60147-0A, IEC 60147-0D, IEC 60147-2H IEC 60147-1A, IEC 60147-2E, IEC 60147-2J and IEC 60147-1G. (07/2004) Also numbered as BIS IS 14901-1. (04/2011) Stability Date: 2020. (10/2012)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 62747:2014 Terminology for voltage-sourced converters (VSC) for high-voltage direct current (HVDC) systems
    AAMI IEC TIR 60878 : 2003 GRAPHICAL SYMBOLS FOR ELECTRICAL EQUIPMENT IN MEDICAL PRACTICE
    BS EN 61747-5 : 1998 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS
    13/30264591 DC : 0 BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
    PD IEC/TR 60878:2015 Graphical symbols for electrical equipment in medical practice
    BS EN 62341-1-1 : 2009 ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAYS - PART 1-1: GENERIC SPECIFICATIONS
    13/30270189 DC : 0 BS EN 60747-6 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 6: THYRISTORS
    07/30161967 DC : 0 BS EN 60747-8 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 8: FIELD-EFFECT TRANSISTORS
    11/30234042 DC : 0 BS EN 62595-1-1 ED.1 - LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION
    I.S. EN 62047-4:2010 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS
    08/30180398 DC : 0 BS EN 60747-16-5 - SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS
    CEI EN 62341-1-1 : 2011 ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAYS - PART 1-1: GENERIC SPECIFICATIONS
    DIN IEC 60747-2:2001-02 SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 2: RECTIFIER DIODES
    BS EN 190100 : 1993 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: DIGITAL MONOLITHIC INTEGRATED CIRCUITS
    BS QC 720102:1997 BLANK DETAIL SPECIFICATION FOR LASER DIODE MODULES WITH PIGTAIL FOR FIBRE OPTIC SYSTEMS AND SUBSYSTEMS
    BS IEC 62679-1-1:2014 (published 2014-07) Electronic paper displays Terminology
    BS QC750116(2000) : 2000 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION
    BS EN 60749 : 1999 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS
    BS IEC 60747-14.2 : 2000 SEMICONDUCTOR DEVICES - PART 14-2: SEMICONDUCTOR SENSORS - HALL ELEMENTS
    BS EN 60747-16-10 : 2004 DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS
    BS EN 62047-4 : 2010 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS
    BS EN 60747-16-5:2013 Semiconductor devices Microwave integrated circuits. Oscillators
    I.S. EN 60749-34:2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING
    14/30311054 DC : 0 BS EN 60747-4: AMD 1 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 4: MICROWAVE DIODES AND TRANSISTORS
    BS IEC 60747-14.1 : 2010 SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS
    07/30172404 DC : DRAFT DEC 2007 BS EN 62047-9 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
    BS IEC 60748-2 : 1997 SEMICONDUCTORS DEVICES - INTEGRATED CIRCUITS - DIGITAL INTEGRATED CIRCUITS
    BS EN 60749-34 : 2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING
    NF EN 62341-1-1 : 2010 ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAYS - PART 1-1: GENERIC SPECIFICATIONS
    BS 6493-2.1(1985) : 1985 SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - GENERAL
    CEI EN 60747-16-3 : 2009 SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
    BS IEC 60747-8-4 : 2004 DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 8-4: METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSISTORS (MOSFETS) FOR POWER SWITCHING APPLICATIONS)
    BS IEC 60747-5-4:2006 Semiconductor devices. Discrete devices Optoelectronic devices. Semiconductor lasers
    BS EN 165000-1 : 1996 FILM AND HYBRID INTEGRATED CIRCUITS - GENERIC SPECIFICATION - PART 1: CAPABILITY APPROVAL PROCEDURE
    CEI EN 60146-2 : 2001 SEMICONDUCTOR CONVERTERS - PART 2: SELF-COMMUTATED SEMICONDUCTOR CONVERTERS INCLUDING DIRECT D.C. CONVERTERS
    CEI EN 60747-15 : 2012 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
    BS EN 60747-16-3 : 2002 SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
    I.S. EN 62751-1:2014 POWER LOSSES IN VOLTAGE SOURCED CONVERTER (VSC) VALVES FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS - PART 1: GENERAL REQUIREMENTS
    I.S. EN 60286-4:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS (IEC 60286-4:2013 (EQV))
    IEC 60747-8:2010 Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
    IEC 60417-1:2002 Graphical symbols for use on equipment - Part 1: Overview and application
    IEC 61747-5:1998 Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods
    IEC 60749-34:2010 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
    EN 60747-5-2:2001/A1:2002 DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 5-2: OPTOELECTRONIC DEVICES - ESSENTIAL RATINGS AND CHARACTERISTICS
    EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
    EN 61747-5 : 1998 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS
    EN 60747-5-3:2001/A1:2002 DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 5-3: OPTOELECTRONIC DEVICES - MEASURING METHODS
    EN 62747:2014/AC:2015 TERMINOLOGY FOR VOLTAGE-SOURCED CONVERTERS (VSC) FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS (IEC 62747:2014)
    EN 60286-4:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS (IEC 60286-4:2013)
    EN 60749-34:2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING
    BS EN 61751 : 1998 LASER MODULES USED FOR TELECOMMUNICATION - RELIABILITY ASSESSMENT
    BS EN 61709:2017 Electric components. Reliability. Reference conditions for failure rates and stress models for conversion
    BS EN 60417-1:1999 GRAPHICAL SYMBOLS FOR USE ON EQUIPMENT - PART 1: OVERVIEW AND APPLICATION
    BS IEC 60747-3 : 2013 SEMICONDUCTOR DEVICES - PART 3: DISCRETE DEVICES: SIGNAL, SWITCHING AND REGULATOR DIODES
    BS EN 60146-2:2000 Semiconductor convertors. General requirements and line commutated convertors Self-commutated semiconductor converters including direct d.c. converters
    15/30330421 DC : 0 BS EN 60747-16-4 ED 1.0/A2 - SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES
    15/30330417 DC : 0 BS EN 60747-16-3 ED 1.0/A2 - SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
    IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
    07/30164950 DC : 0 IEC 60747-7 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 7: BIPOLAR TRANSISTORS (BTRS)
    DIN EN 190000:1996-05 GENERIC SPECIFICATION - MONOLITHIC INTEGRATED CIRCUITS
    I.S. EN 62747:2014-2015-10 TERMINOLOGY FOR VOLTAGE-SOURCED CONVERTERS (VSC) FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS
    BS IEC 60747-14-5:2010 Semiconductor devices Semiconductor sensors. PN-junction semiconductor temperature sensor
    BS IEC 60747-6:2016 Semiconductor devices Discrete devices. Thyristors
    CEI EN 61643-341 : 2002 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 341: SPECIFICATION FOR THYRISTOR SURGE SUPPRESSOR (TSS)
    06/30153491 DC : DRAFT JULY 2006 EN 60748-2-20 - SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 2-20: DIGITAL INTEGRATED CIRCUITS - FAMILY SPECIFICATION - LOW VOLTAGE INTEGRATED CIRCUITS
    BS IEC 60748-5 : 1997 SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - SEMICUSTOM INTEGRATED CIRCUITS
    07/30170374 DC : DRAFT AUG 2007 BS EN 61751-2 - LASER MODULES USED FOR TELECOMMUNICATIONS - RELIABILITY ASSESSMENT - PART 2: TECHNICAL REPORT ON LASER MODULE DEGRADATION
    15/30310531 DC : 0 BS EN 61709 ED 3.0 - ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
    CEI EN 60747-16-10 : 2005 SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS
    BS IEC 60747-9 : 2007 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 9: INSULATED-GATE BIPOLAR TRANSISTORS (IGBTS)
    02/207672 DC : DRAFT JULY 2002 IEC 60749-34 ED.1 - POWER CYCLING
    I.S. HD 60027-2:2003 LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS
    NF EN 61988-5 : 2010 PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION
    I.S. EN 62572-3:2016 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
    I.S. EN 60027-2:2007 LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS
    I.S. EN 60747-16-10:2004 SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS
    BS EN 60747-16-1 : 2002 SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
    IEC 62751-1:2014+AMD1:2018 CSV Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems - Part 1: General requirements
    IEC 60747-9:2007 Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs)
    CEI EN 61988-5 : 2011 PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION
    CEI EN 61747-1 : 2004 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
    BS IEC 60747-7:2010 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 7: BIPOLAR TRANSISTORS
    IEC 61747-1-1:2014 Liquid crystal display devices - Part 1-1: Generic - Generic specification
    I.S. EN 60146-1-1:2010 SEMICONDUCTOR CONVERTERS - GENERAL REQUIREMENTS AND LINE COMMUTATED CONVERTERS - PART 1-1: SPECIFICATION OF BASIC REQUIREMENTS
    EN 61709:2017 Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
    IEC 60747-7-5:2005 Semiconductor devices - Discrete devices - Part 7-5: Bipolar transistors for power switching applications
    IEC 60747-7:2010 Semiconductor devices - Discrete devices - Part 7: Bipolar transistors
    I.S. EN 60747-16-1:2002 SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
    IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
    IEC 60748-1:2002 Semiconductor devices - Integrated circuits - Part 1: General
    IEC 60747-4-2:2000 Semiconductor devices - Discrete devices - Part 4-2: Microwave diodes and transistors - Integrated-circuit microwave amplifiers - Blank detail specification
    IEC 60748-23-2:2002 Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests
    IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
    IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
    IEC 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
    IEC 60747-5-3:1997+AMD1:2002 CSV Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods
    DIN EN 60146-2 : 2001 SEMICONDUCTOR CONVERTORS - PART 2: SELF-COMMUTATED SEMICONDUCTOR CONVERTORS INCLUDING DIRECT D.C. CONVERTORS
    VDE 0558-2 : 2001 SEMICONDUCTOR CONVERTORS - PART 2: SELF-COMMUTATED SEMICONDUCTOR CONVERTORS INCLUDING DIRECT D.C. CONVERTORS
    I.S. EN 61751:1999 LASER MODULES USED FOR TELECOMMUNICATION - RELIABILITY ASSESSMENT
    09/30209939 DC : 0 BS EN 60749-34 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING
    01/206102 DC : DRAFT JUL 2001 IEC 60747-8-12 ED.1 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 8-12: 8-12: METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSISTORS POWER SWITCHING APPLICATIONS
    BS EN 62595-1-1 : 2013 LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION
    07/30162213 DC : 0 BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
    12/30251416 DC : 0 BS EN 62747 - TERMINOLOGY FOR VOLTAGE-SOURCED CONVERTERS (VSC) FOR HVDC SYSTEMS
    08/30181401 DC : DRAFT APR 2008 BS IEC 60747-14-1 - SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS
    BS IEC 60747-14-4:2011 (published 2011-02) Semiconductor devices. Discrete devices Semiconductor accelerometers
    I.S. EN 60747-15:2012 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV))
    06/30151323 DC : DRAFT JUN 2006 BS IEC 61988-5 - PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION
    15/30323391 DC : 0 BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS PART 3: LASER MODULES USED FOR TELECOMMUNICATION
    BS IEC 60747-16.2 : 2001 SEMICONDUCTOR DEVICES - PART 16-2: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY PRESCALERS
    13/30277892 DC : 0 BS EN 62572-3 ED 2.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
    BS IEC 60747-4 : 2007 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 4: MICROWAVE DIODES AND TRANSISTORS
    I.S. EN 62148-15:2014 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 15: DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER PACKAGES
    11/30252972 DC : 0 BS EN 61747-10-1 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL
    CEI EN 60749-34 : 2012 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING
    BS EN 62751-1:2014 Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems General requirements
    07/30172155 DC : DRAFT OCT 2007 BS EN 62047-5 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES
    02/205627 DC : DRAFT APR 2002 IEC 60747-14-4. ED.1.0 - DISCRETE SEMICONDUCTOR DEVICES - PART 14-4: SEMICONDUCTOR ACCELEROMETERS
    BS 6062-4(1991) : 1991 AMD 9687 PACKAGING OF ELECTRONIC COMPONENTS FOR AUTOMATIC HANDLING - SPECIFICATION FOR STICK MAGAZINES FOR DUAL-IN-LINE PACKAGES
    IEC 60747-3:2013 Semiconductor devices - Part 3: Discrete devices: Signal, switching and regulator diodes
    BS IEC 60748-23-1:2002 Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification
    BS IEC 62341-1-1 : 2009 ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAYS - PART 1-1: GENERIC SPECIFICATIONS
    BS EN 120000 : 1996 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERAL SPECIFICATION: SEMICONDUCTOR OPTOELECTRONIC AND LIQUID CRYSTAL DEVICES
    BS QC 763000(1990) : AMD 6754 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION
    BS IEC 60748-11 : 2000 SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 11: SECTIONAL SPECIFICATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS
    05/30137514 DC : DRAFT AUG 2005 IEC 60747-14-4 - DISCRETE SEMICONDUCTOR DEVICES - PART 14-4: SEMICONDUCTOR ACCELEROMETERS
    BS EN 60747-15:2012 Semiconductor devices. Discrete devices Isolated power semiconductor devices
    I.S. EN 62751-2:2014 POWER LOSSES IN VOLTAGE SOURCED CONVERTER (VSC) VALVES FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS - PART 2: MODULAR MULTILEVEL CONVERTERS
    17/30343732 DC : 0 BS EN 60747-9 - SEMICONDUCTOR DEVICES - PART 9: DISCRETE DEVICES - INSULATED-GATE BIPOLAR TRANSISTORS (IGBTS)
    IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
    BS IEC 61747-1 : 1998 AMD 10788 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - GENERIC SPECIFICATION
    BS QC790100(1991) : 1991 AMD 10586 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS
    IEC 61709:2017 RLV Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
    IEC 60747-8-4:2004 Discrete semiconductor devices - Part 8-4: Metal-oxide-semiconductor field-effect transistors (MOSFETs) for power switching applications
    BS PD IEC TR 60146-1-2 : 2011 SEMICONDUCTOR CONVERTERS - GENERAL REQUIREMENTS AND LINE COMMUTATED CONVERTERS - PART 1-2: APPLICATION GUIDE
    EN 62751-1:2014 POWER LOSSES IN VOLTAGE SOURCED CONVERTER (VSC) VALVES FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS - PART 1: GENERAL REQUIREMENTS (IEC 62751-1:2014)
    EN 60747-16-4:2004/A2:2017 SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES (IEC 60747-16-4:2004/A2:2017)
    I.S. EN 60417-1:2002 GRAPHICAL SYMBOLS FOR USE ON EQUIPMENT - PART 1: OVERVIEW AND APPLICATION
    IEC TR 60878:2015 Graphical symbols for electrical equipment in medical practice
    BS PD IEC TR 60601-4-3 : 2015 MEDICAL ELECTRICAL EQUIPMENT - PART 4-3: GUIDANCE AND INTERPRETATION - CONSIDERATIONS OF UNADDRESSED SAFETY ASPECTS IN THE THIRD EDITION OF IEC 60601-1 AND PROPOSALS FOR NEW REQUIREMENTS
    BS EN 62751-2:2014 (published 2014-11) Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems Modular multilevel converters
    IEC 62679-1-1:2014 Electronic paper displays - Part 1-1: Terminology
    IEC 60748-11:1990 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
    IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
    IEC 61709 : 3.0 ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
    IEC 60747-10:1991 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
    I.S. EN 61747-5:1999 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS
    IEC 60748-4:1997 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
    IEC 61988-5:2009 Plasma display panels - Part 5: Generic specification
    EN 61643-341 : 2001 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - SPECIFICATION FOR THYRISTOR SUPPRESSORS (TSS)
    EN 60747-16-5:2013 SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013)
    BS IEC 60747-14.3 : 2009 SEMICONDUCTOR DEVICES - PART 14-3: SEMICONDUCTOR SENSORS - PRESSURE SENSORS
    07/30169405 DC : 0 BS EN 60747-16-3 AMD1 - SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
    12/30268616 DC : 0 BS EN 61747-1-1 - LIQUID CRYSTAL DISPLAY DEVICES - PART 1-1: GENERIC - GENERIC SPECIFICATION
    12/30244653 DC : 0 BS EN 62679-1 - ELECTRONIC PAPER DISPLAY - PART 1:TERMINOLOGY AND GENERIC SPECIFICATION
    01/205674 DC : DRAFT JUL 2001 IEC 60747-16-10 ED.1 - TECHNOLOGY APPROVAL SCHEDULE FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS
    BS EN 60747-5-2 : 2001 DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 5-2: OPTOELECTRONIC DEVICES - ESSENTIAL RATINGS AND CHARACTERISTICS
    13/30287348 DC : 0 BS EN 60747-2 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 2: RECTIFIER DIODES
    11/30252977 DC : 0 BS EN 61747-10-2 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-2: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - ENVIRONMENTAL AND ENDURANCE
    BS IEC 60747-8:2000 Discrete semiconductor devices and integrated circuits Field-effect transistors - Additional ratings and characteristics and amds in the measuring methods for power switching field effect transistors.
    13/30277884 DC : 0 BS EN 62148-15 ED 2.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 15: DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER PACKAGES
    17/30355780 DC : DRAFT SEP 2017 BS EN 60747-18-2 - SEMICONDUCTOR DEVICES - PART 18-2: SEMICONDUCTOR BIO SENSORS - EVALUATION PROCESS OF LENS-FREE CMOS PHOTONIC ARRAY SENSOR PACKAGE MODULE
    BS EN 62572-3 : 2016 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
    BS EN 60747-5-3 : 2001 DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 5-3: OPTOELECTRONIC DEVICES - MEASURING METHODS
    12/30253588 DC : 0 BS EN 62751-2 - DETERMINATION OF POWER LOSSES IN VOLTAGE SOURCED CONVERTER (VSC) VALVES FOR HVDC SYSTEMS - PART 2: MODULAR MULTILEVEL CONVERTERS
    13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
    BS EN 62047-5 : 2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES
    CEI EN 60747-16-1 : 2009 SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
    BS QC760200(1992) : 1992 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - SECTIONAL SPECIFICATION FOR FILM INTEGRATED CIRCUITS AND HYBRID FILM INTEGRATED CIRCUITS CAPABILITY
    BS EN 61988-5 : 2009 PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION
    06/30156472 DC : DRAFT SEP 2006 BS EN 60146-1-1 - SEMICONDUCTOR CONVERTERS - GENERAL REQUIREMENTS AND LINE COMMUTATED CONVERTERS - PART 1-1: SPECIFICATION OF BASIC REQUIREMENTS
    BS IEC 60748-1 : 2002 SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 1: GENERAL
    BS IEC 60747-7-5 : 2005 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 7-5: BIPOLAR TRANSISTORS FOR POWER SWITCHING APPLICATIONS
    14/30311058 DC : 0 BS EN 60747-16-1:AMD 2 - SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
    04/30118741 DC : DRAFT AUG 2004 IEC 60747-4 ED 2 - SEMICONDUCTOR DEVICES DISCRETE DEVICES - PART 4: MICROWAVE DIODES AND TRANSISTORS
    BS EN 61643-341 : 2001 LOW VOLTAGE SURGE PROTECTIVE DEVICES - SPECIFICATION FOR THYRISTOR SURGE SUPPRESSORS (TSS)
    04/30113287 DC : DRAFT MAY 2004 IEC 60747-9 ED.2 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 9: INSULATED GATE BIPOLAR TRANSISTORS (IGBTS)
    04/30114936 DC : DRAFT JUN 2004 EN 50439 - RAILWAY APPLICATIONS - RELIABILITY TESTS FOR HIGH POWER SEMICONDUCTORS DEVICES - PART 1: STANDARD BASE-PLATE MODULES
    BS EN 62148-15 : 2014 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 15: DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER PACKAGES
    NF EN 60027-2 : 2007 LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS
    BS EN 60286-4 : 2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS
    BS EN 61747-1 : 2000 LIQUID CRYSTAL AND SOLID STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
    CEI EN 60286-4 : 2014 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS
    IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
    I.S. EN 60146-2:2003 SEMICONDUCTOR CONVERTERS - PART 2: SELF-COMMUTATED SEMICONDUCTOR CONVERTERS INCLUDING DIRECT D.C. CONVERTERS
    I.S. EN 62047-5:2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES
    I.S. EN 61709:2017 ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
    I.S. EN 165000-1:1998 FILM AND HYBRID INTEGRATED CIRCUITS - PART 1: GENERIC SPECIFICATION CAPABILITY APPROVAL PROCEDURE
    I.S. EN 60747-16-5:2013 SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013 (EQV))
    HD 60027-2 : 200S1 LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS
    IEC 60747-2:2016 Semiconductor devices - Part 2: Discrete devices - Rectifier diodes
    CEI EN 60146-1-1 : 2013 SEMICONDUCTOR CONVERTERS - GENERAL REQUIREMENTS AND LINE COMMUTATED CONVERTERS - PART 1-1: SPECIFICATION OF BASIC REQUIREMENTS
    I.S. EN 62341-1-1:2009 ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAYS - PART 1-1: GENERIC SPECIFICATIONS
    IEC TR 60146-1-2:2011 Semiconductor converters - General requirements and line commutated converters - Part 1-2: Application guide
    IEC 61747-10-2:2014 Liquid crystal display devices - Part 10-2: Environmental, endurance and mechanical test methods - Environmental and endurance
    IEC 60747-16-2:2001+AMD1:2007 CSV Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
    IEC 60747-4:2007+AMD1:2017 CSV Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
    IEC 60747-6:2016 Semiconductor devices - Part 6: Discrete devices - Thyristors
    EN 62751-2:2014 POWER LOSSES IN VOLTAGE SOURCED CONVERTER (VSC) VALVES FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS - PART 2: MODULAR MULTILEVEL CONVERTERS (IEC 62751-2:2014)
    EN 60747-5-1:2001/A2:2002 DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 5-1: OPTOELECTRONIC DEVICES - GENERAL
    IEC 61751:1998 Laser modules used for telecommunication - Reliability assessment
    IEC 62595-1-1:2013 LCD backlight unit - Part 1-1: Generic specification
    IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 CSV Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    IEC 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    IEC 62341-1-1:2009 Organic light emitting diode (OLED) displays - Part 1-1: Generic specifications
    UNE-EN 60749-34:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
    IEC 60146-2:1999 Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters
    IEC 60146-1-1:2009 Semiconductor converters - General requirements and line commutated converters - Part 1-1: Specification of basic requirements
    IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    IEC 62751-2:2014 Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems - Part 2: Modular multilevel converters
    IEC 62148-15:2014 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages
    IEC 62047-4:2008 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
    IEC 60747-5-2:1997+AMD1:2002 CSV Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics
    EN 61751:1998 LASER MODULES USED FOR TELECOMMUNICATION - RELIABILITY ASSESSMENT
    EN 62047-4 : 2010 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS
    EN 62595-1-1 : 2013 LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION (IEC 62595-1-1:2013)
    CEI EN 62595-1-1 : 2014 LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION
    07/30164953 DC : 0 IEC 60747-14-5 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 14-5: SEMICONDUCTOR SENSORS - PN-JUNCTION SEMICONDUCTOR TEMPERATURE SENSOR
    DIN IEC 60747-5:1988-12 SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 5: OPTOELECTRONIC DEVICES
    05/30135225 DC : DRAFT JUN 2005 IEC 60749-9 ED 2 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 9: INSULATED-GATE BIPOLAR TRANSISTORS (IGBTS)
    08/30181404 DC : DRAFT APR 2008 BS IEC 60747-14-3 - SEMICONDUCTOR DEVICES - PART 14-3: SEMICONDUCTOR SENSORS - PRESSURE SENSORS
    CEI EN 60747-16-5 : 2014 SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS
    CEI EN 62047-4 : 2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS
    13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
    BS PD IEC TR 62572-2 : 2008 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 2: LASER MODULE DEGRADATION
    EN 62148-15:2014 Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages
    12/30252799 DC : 0 BS EN 62751-1-1 - DETERMINATION OF POWER LOSSES IN VOLTAGE SOURCED CONVERTERS (VSC) FOR HV DC SYSTEMS - PART 1: GENERAL REQUIREMENTS
    09/30183239 DC : 0 BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
    BS QC760100(1991) : 1991 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. SEMICONDUCTOR DEVICES. INTEGRATED CIRCUITS. FILM AND HYBRID INTEGRATED CIRCUITS: QUALIFICATION APPROVAL
    BS EN 60747-5-1:2001 (published 2003-01) Discrete semiconductor devices and integrated circuits. Optoelectronic devices General
    BS QC 750000(1986) : 1986 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - DISCRETE SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION
    EN 60747-16-3:2002/A2:2017 SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS (IEC 60747-16-3:2002/A2:2017)
    07/30169412 DC : 0 BS EN 60747-16-4 AMD1 - SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES
    BS IEC 60747-4.2 : 2000 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION
    NFC 03 002 : 2002 LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS
    BS EN 60747-16-4 : 2004 SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES
    07/30148822 DC : 0 BS IEC 62047-4 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATIONS FOR MEMS
    BS EN 60146-1-1 : 2010 SEMICONDUCTOR CONVERTERS - GENERAL REQUIREMENTS AND LINE COMMUTATED CONVERTERS - PART 1-1: SPECIFICATION OF BASIC REQUIREMENTS
    BS IEC 60748-23-2:2002 Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Internal visual inspection and special tests
    I.S. EN 60747-16-3:2002 SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
    I.S. EN 62595-1-1:2013 LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION (IEC 62595-1-1:2013 (EQV))
    IEC 60747-14-1:2010 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
    IEC TR 62572-2:2008 Fibre optic active components and devices - Reliability standards - Part 2: Laser module degradation
    BIS IS 15934-5 : 2011 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS
    NFC 96 002 : 2001 SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 2: RECTIFIER DIODES
    IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
    IEC 60748-23-1:2002 Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
    I.S. EN 61988-5:2009 PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION
    I.S. EN 60747-16-4:2004 SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES
    EN 60747-16-1:2002/A2:2017 SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017)
    IEC 61643-341:2001 Components for low-voltage surge protective devices - Part 341: Specification for thyristor surge suppressors (TSS)
    BS EN 45510-2-2 : 1999 GUIDE FOR THE PROCUREMENT OF POWER STATION EQUIPMENT - ELECTRICAL EQUIPMENT - UNINTERRUPTIBLE POWER SUPPLIES
    IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
    EN 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
    EN 60747-16-10:2004 SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS
    EN 61988-5 : 2009 PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION
    EN 62341-1-1 : 2009 ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAYS - PART 1-1: GENERIC SPECIFICATIONS
    EN 62047-5 : 2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES
    EN 61747-1:1999/A1:2003 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
    EN 60146-1-1:2010 SEMICONDUCTOR CONVERTERS - GENERAL REQUIREMENTS AND LINE COMMUTATED CONVERTERS - PART 1-1: SPECIFICATION OF BASIC REQUIREMENTS
    EN 60417-1:2002 GRAPHICAL SYMBOLS FOR USE ON EQUIPMENT - PART 1: OVERVIEW AND APPLICATION
    EN 165000-1:1996 Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure
    IEC 61709:2017 Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
    EN 60146-2 : 2000 SEMICONDUCTOR CONVERTERS - PART 2: SELF-COMMUTATED SEMICONDUCTOR CONVERTERS INCLUDING DIRECT D.C. CONVERTERS
    EN 60749 : 99 AMD 2 2001 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60050-131:2002 International Electrotechnical Vocabulary (IEV) - Part 131: Circuit theory
    IEC 60050-702:1992 International Electrotechnical Vocabulary (IEV) - Part 702: Oscillations, signals and related devices
    IEC 60134:1961 Rating systems for electronic tubes and valves and analogous semiconductor devices
    IEC 60319:1999 Presentation and specification of reliability data for electronic components
    IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60469-1:1987 Pulse techniques and apparatus. Part 1: Pulse terms and definitions
    IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    ISO 9000:2015 Quality management systems Fundamentals and vocabulary
    IEC 60050-521:2002 International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
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