BS EN 62747:2014
|
Terminology for voltage-sourced converters (VSC) for high-voltage direct current (HVDC) systems |
AAMI IEC TIR 60878 : 2003
|
GRAPHICAL SYMBOLS FOR ELECTRICAL EQUIPMENT IN MEDICAL PRACTICE |
BS EN 61747-5:1998
|
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
13/30264591 DC : 0
|
BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
PD IEC/TR 60878:2015
|
Graphical symbols for electrical equipment in medical practice |
BS EN 62341-1-1:2009
|
Organic light emitting diode (OLED) displays Generic specifications |
13/30270189 DC : 0
|
BS EN 60747-6 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 6: THYRISTORS |
07/30161967 DC : 0
|
BS EN 60747-8 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 8: FIELD-EFFECT TRANSISTORS |
11/30234042 DC : 0
|
BS EN 62595-1-1 ED.1 - LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION |
I.S. EN 62047-4:2010
|
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS |
08/30180398 DC : 0
|
BS EN 60747-16-5 - SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
CEI EN 62341-1-1 : 2011
|
ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAYS - PART 1-1: GENERIC SPECIFICATIONS |
DIN IEC 60747-2:2001-02
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 2: RECTIFIER DIODES |
BS EN 190100:1993
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: DIGITAL MONOLITHIC INTEGRATED CIRCUITS |
BS QC 720102:1997
|
BLANK DETAIL SPECIFICATION FOR LASER DIODE MODULES WITH PIGTAIL FOR FIBRE OPTIC SYSTEMS AND SUBSYSTEMS |
BS IEC 62679-1-1:2014 (published 2014-07)
|
Electronic paper displays Terminology |
BS QC750116(2000) : 2000
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION |
BS EN 60749:1999
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS |
BS IEC 60747-14.2 : 2000
|
SEMICONDUCTOR DEVICES - PART 14-2: SEMICONDUCTOR SENSORS - HALL ELEMENTS |
BS EN 60747-16-10:2004
|
DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS |
BS EN 62047-4 : 2010
|
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS |
BS EN 60747-16-5:2013
|
Semiconductor devices Microwave integrated circuits. Oscillators |
I.S. EN 60749-34:2010
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
14/30311054 DC : 0
|
BS EN 60747-4: AMD 1 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 4: MICROWAVE DIODES AND TRANSISTORS |
BS IEC 60747-14.1 : 2010
|
SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS |
07/30172404 DC : DRAFT DEC 2007
|
BS EN 62047-9 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS |
BS IEC 60748-2:1997
|
SEMICONDUCTORS DEVICES - INTEGRATED CIRCUITS - DIGITAL INTEGRATED CIRCUITS |
BS EN 60749-34:2010
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
NF EN 62341-1-1 : 2010
|
ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAYS - PART 1-1: GENERIC SPECIFICATIONS |
BS 6493-2.1:1985
|
Semiconductor devices. Integrated circuits General |
CEI EN 60747-16-3 : 2009
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
BS IEC 60747-8-4:2004
|
DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 8-4: METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSISTORS (MOSFETS) FOR POWER SWITCHING APPLICATIONS) |
BS IEC 60747-5-4:2006
|
Semiconductor devices. Discrete devices Optoelectronic devices. Semiconductor lasers |
BS EN 165000-1:1996
|
FILM AND HYBRID INTEGRATED CIRCUITS - GENERIC SPECIFICATION - PART 1: CAPABILITY APPROVAL PROCEDURE |
CEI EN 60146-2 : 2001
|
SEMICONDUCTOR CONVERTERS - PART 2: SELF-COMMUTATED SEMICONDUCTOR CONVERTERS INCLUDING DIRECT D.C. CONVERTERS |
CEI EN 60747-15 : 2012
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
BS EN 60747-16-3 : 2002
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
I.S. EN 62751-1:2014
|
POWER LOSSES IN VOLTAGE SOURCED CONVERTER (VSC) VALVES FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS - PART 1: GENERAL REQUIREMENTS |
I.S. EN 60286-4:2013
|
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS (IEC 60286-4:2013 (EQV)) |
IEC 60747-8:2010
|
Semiconductor devices - Discrete devices - Part 8: Field-effect transistors |
IEC 60417-1:2002
|
Graphical symbols for use on equipment - Part 1: Overview and application |
IEC 61747-5:1998
|
Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
IEC 60749-34:2010
|
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
EN 60747-5-2:2001/A1:2002
|
DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 5-2: OPTOELECTRONIC DEVICES - ESSENTIAL RATINGS AND CHARACTERISTICS |
EN 60747-15:2012
|
Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
EN 61747-5:1998
|
Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
EN 60747-5-3:2001/A1:2002
|
DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 5-3: OPTOELECTRONIC DEVICES - MEASURING METHODS |
EN 62747:2014/AC:2015
|
TERMINOLOGY FOR VOLTAGE-SOURCED CONVERTERS (VSC) FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS (IEC 62747:2014) |
EN 60286-4:2013
|
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
EN 60749-34:2010
|
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
OVE/ONORM EN 60027-2 : 2007
|
LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
BS EN 61751:1998
|
LASER MODULES USED FOR TELECOMMUNICATION - RELIABILITY ASSESSMENT |
BS EN 61709:2017
|
Electric components. Reliability. Reference conditions for failure rates and stress models for conversion |
BS EN 60417-1:1999
|
GRAPHICAL SYMBOLS FOR USE ON EQUIPMENT - PART 1: OVERVIEW AND APPLICATION |
BS IEC 60747-3:2013
|
SEMICONDUCTOR DEVICES - PART 3: DISCRETE DEVICES: SIGNAL, SWITCHING AND REGULATOR DIODES |
BS EN 60146-2:2000
|
Semiconductor convertors. General requirements and line commutated convertors Self-commutated semiconductor converters including direct d.c. converters |
15/30330421 DC : 0
|
BS EN 60747-16-4 ED 1.0/A2 - SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
15/30330417 DC : 0
|
BS EN 60747-16-3 ED 1.0/A2 - SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
IEC 60747-14-4:2011
|
Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers |
07/30164950 DC : 0
|
IEC 60747-7 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 7: BIPOLAR TRANSISTORS (BTRS) |
DIN EN 190000:1996-05
|
GENERIC SPECIFICATION - MONOLITHIC INTEGRATED CIRCUITS |
I.S. EN 62747:2014-2015-10
|
TERMINOLOGY FOR VOLTAGE-SOURCED CONVERTERS (VSC) FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS |
BS IEC 60747-14-5:2010
|
Semiconductor devices Semiconductor sensors. PN-junction semiconductor temperature sensor |
BS IEC 60747-6:2016
|
Semiconductor devices Discrete devices. Thyristors |
CEI EN 61643-341 : 2002
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 341: SPECIFICATION FOR THYRISTOR SURGE SUPPRESSOR (TSS) |
06/30153491 DC : DRAFT JULY 2006
|
EN 60748-2-20 - SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 2-20: DIGITAL INTEGRATED CIRCUITS - FAMILY SPECIFICATION - LOW VOLTAGE INTEGRATED CIRCUITS |
BS IEC 60748-5:1997
|
SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - SEMICUSTOM INTEGRATED CIRCUITS |
07/30170374 DC : DRAFT AUG 2007
|
BS EN 61751-2 - LASER MODULES USED FOR TELECOMMUNICATIONS - RELIABILITY ASSESSMENT - PART 2: TECHNICAL REPORT ON LASER MODULE DEGRADATION |
15/30310531 DC : 0
|
BS EN 61709 ED 3.0 - ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION |
CEI EN 60747-16-10 : 2005
|
SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS |
BS IEC 60747-9:2007
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 9: INSULATED-GATE BIPOLAR TRANSISTORS (IGBTS) |
02/207672 DC : DRAFT JULY 2002
|
IEC 60749-34 ED.1 - POWER CYCLING |
I.S. HD 60027-2:2003
|
LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
NF EN 61988-5 : 2010
|
PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION |
I.S. EN 62572-3:2016
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
I.S. EN 60027-2:2007
|
LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
I.S. EN 60747-16-10:2004
|
SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS |
BS EN 60747-16-1 : 2002
|
SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
IEC 62751-1:2014+AMD1:2018 CSV
|
Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems - Part 1: General requirements |
IEC 60747-9:2007
|
Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs) |
CEI EN 61988-5 : 2011
|
PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION |
CEI EN 61747-1 : 2004
|
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |
BS IEC 60747-7:2010
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 7: BIPOLAR TRANSISTORS |
IEC 61747-1-1:2014
|
Liquid crystal display devices - Part 1-1: Generic - Generic specification |
I.S. EN 60146-1-1:2010
|
SEMICONDUCTOR CONVERTERS - GENERAL REQUIREMENTS AND LINE COMMUTATED CONVERTERS - PART 1-1: SPECIFICATION OF BASIC REQUIREMENTS |
EN 61709:2017
|
Electric components - Reliability - Reference conditions for failure rates and stress models for conversion |
IEC 60747-7-5:2005
|
Semiconductor devices - Discrete devices - Part 7-5: Bipolar transistors for power switching applications |
IEC 60747-7:2010
|
Semiconductor devices - Discrete devices - Part 7: Bipolar transistors |
I.S. EN 60747-16-1:2002
|
SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
IEC 60747-14-3:2009
|
Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors |
IEC 60748-1:2002
|
Semiconductor devices - Integrated circuits - Part 1: General |
IEC 60747-4-2:2000
|
Semiconductor devices - Discrete devices - Part 4-2: Microwave diodes and transistors - Integrated-circuit microwave amplifiers - Blank detail specification |
IEC 60748-23-2:2002
|
Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests |
IEC 60286-4:2013
|
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV
|
Semiconductor devices - Mechanical and climatic test methods |
IEC 62047-5:2011
|
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches |
IEC 60747-5-3:1997+AMD1:2002 CSV
|
Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods |
DIN EN 60146-2 : 2001
|
SEMICONDUCTOR CONVERTORS - PART 2: SELF-COMMUTATED SEMICONDUCTOR CONVERTORS INCLUDING DIRECT D.C. CONVERTORS |
VDE 0558-2 : 2001
|
SEMICONDUCTOR CONVERTORS - PART 2: SELF-COMMUTATED SEMICONDUCTOR CONVERTORS INCLUDING DIRECT D.C. CONVERTORS |
BS 6493-1.5:1992
|
SEMICONDUCTOR DEVICES - PART 1: DISCRETE DEVICES - SECTION 1.5: RECOMMENDATIONS FOR OPTOELECTRONIC DEVICES |
BS CECC 90300:1988
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION: INTERFACE MONOLITHIC INTEGRATED CIRCUITS |
I.S. EN 61751:1999
|
LASER MODULES USED FOR TELECOMMUNICATION - RELIABILITY ASSESSMENT |
09/30209939 DC : 0
|
BS EN 60749-34 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
01/206102 DC : DRAFT JUL 2001
|
IEC 60747-8-12 ED.1 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 8-12: 8-12: METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSISTORS POWER SWITCHING APPLICATIONS |
BS EN 62595-1-1:2013
|
LCD backlight unit Generic specification |
07/30162213 DC : 0
|
BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
12/30251416 DC : 0
|
BS EN 62747 - TERMINOLOGY FOR VOLTAGE-SOURCED CONVERTERS (VSC) FOR HVDC SYSTEMS |
08/30181401 DC : DRAFT APR 2008
|
BS IEC 60747-14-1 - SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS |
BS IEC 60747-14-4:2011
|
Semiconductor devices. Discrete devices Semiconductor accelerometers |
I.S. EN 60747-15:2012
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV)) |
06/30151323 DC : DRAFT JUN 2006
|
BS IEC 61988-5 - PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION |
15/30323391 DC : 0
|
BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
BS IEC 60747-16.2 : 2001
|
SEMICONDUCTOR DEVICES - PART 16-2: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY PRESCALERS |
13/30277892 DC : 0
|
BS EN 62572-3 ED 2.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
BS IEC 60747-4 : 2007
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 4: MICROWAVE DIODES AND TRANSISTORS |
I.S. EN 62148-15:2014
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 15: DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER PACKAGES |
11/30252972 DC : 0
|
BS EN 61747-10-1 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL |
CEI EN 60749-34 : 2012
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
BS EN 62751-1:2014
|
Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems General requirements |
07/30172155 DC : DRAFT OCT 2007
|
BS EN 62047-5 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES |
02/205627 DC : DRAFT APR 2002
|
IEC 60747-14-4. ED.1.0 - DISCRETE SEMICONDUCTOR DEVICES - PART 14-4: SEMICONDUCTOR ACCELEROMETERS |
BS 6062-4(1991) : 1991 AMD 9687
|
PACKAGING OF ELECTRONIC COMPONENTS FOR AUTOMATIC HANDLING - SPECIFICATION FOR STICK MAGAZINES FOR DUAL-IN-LINE PACKAGES |
IEC 60747-3:2013
|
Semiconductor devices - Part 3: Discrete devices: Signal, switching and regulator diodes |
BS IEC 60748-23-1:2002
|
Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification |
BS IEC 62341-1-1 : 2009
|
ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAYS - PART 1-1: GENERIC SPECIFICATIONS |
BS EN 120000:1996
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERAL SPECIFICATION: SEMICONDUCTOR OPTOELECTRONIC AND LIQUID CRYSTAL DEVICES |
BS QC 763000(1990) : AMD 6754
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION |
BS IEC 60748-11:2000
|
Semiconductor devices. Integrated circuits Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
05/30137514 DC : DRAFT AUG 2005
|
IEC 60747-14-4 - DISCRETE SEMICONDUCTOR DEVICES - PART 14-4: SEMICONDUCTOR ACCELEROMETERS |
BS EN 60747-15:2012
|
Semiconductor devices. Discrete devices Isolated power semiconductor devices |
I.S. EN 62751-2:2014
|
POWER LOSSES IN VOLTAGE SOURCED CONVERTER (VSC) VALVES FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS - PART 2: MODULAR MULTILEVEL CONVERTERS |
17/30343732 DC : 0
|
BS EN 60747-9 - SEMICONDUCTOR DEVICES - PART 9: DISCRETE DEVICES - INSULATED-GATE BIPOLAR TRANSISTORS (IGBTS) |
IEC 60747-14-2:2000
|
Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements |
BS IEC 61747-1 : 1998 AMD 10788
|
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - GENERIC SPECIFICATION |
BS QC790100(1991) : 1991 AMD 10586
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS |
IEC 61709:2017 RLV
|
Electric components - Reliability - Reference conditions for failure rates and stress models for conversion |
IEC 60747-8-4:2004
|
Discrete semiconductor devices - Part 8-4: Metal-oxide-semiconductor field-effect transistors (MOSFETs) for power switching applications |
PD IEC/TR 60146-1-2:2011
|
Semiconductor converters. General requirements and line commutated converters Application guide |
EN 62751-1:2014
|
Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems - Part 1: General requirements |
EN 60747-16-4:2004/A2:2017
|
SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES (IEC 60747-16-4:2004/A2:2017) |
I.S. EN 60417-1:2002
|
GRAPHICAL SYMBOLS FOR USE ON EQUIPMENT - PART 1: OVERVIEW AND APPLICATION |
IEC TR 60878:2015
|
Graphical symbols for electrical equipment in medical practice |
PD IEC/TR 60601-4-3:2015
|
MEDICAL ELECTRICAL EQUIPMENT - PART 4-3: GUIDANCE AND INTERPRETATION - CONSIDERATIONS OF UNADDRESSED SAFETY ASPECTS IN THE THIRD EDITION OF IEC 60601-1 AND PROPOSALS FOR NEW REQUIREMENTS |
BS EN 62751-2:2014 (published 2014-11)
|
Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems Modular multilevel converters |
IEC 62679-1-1:2014
|
Electronic paper displays - Part 1-1: Terminology |
IEC 60748-11:1990
|
Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
IEC 60747-5-4:2006
|
Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers |
IEC 61709 : 3.0
|
ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION |
IEC 60747-10:1991
|
Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
I.S. EN 61747-5:1999
|
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
IEC 60748-4:1997
|
Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits |
IEC 61988-5:2009
|
Plasma display panels - Part 5: Generic specification |
EN 61643-341:2001
|
Components for low-voltage surge protective devices - Part 341: Specification for thyristor surge suppressors (TSS) |
EN 60747-16-5:2013
|
Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators |
BS IEC 60747-14.3 : 2009
|
SEMICONDUCTOR DEVICES - PART 14-3: SEMICONDUCTOR SENSORS - PRESSURE SENSORS |
07/30169405 DC : 0
|
BS EN 60747-16-3 AMD1 - SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
12/30268616 DC : 0
|
BS EN 61747-1-1 - LIQUID CRYSTAL DISPLAY DEVICES - PART 1-1: GENERIC - GENERIC SPECIFICATION |
12/30244653 DC : 0
|
BS EN 62679-1 - ELECTRONIC PAPER DISPLAY - PART 1:TERMINOLOGY AND GENERIC SPECIFICATION |
01/205674 DC : DRAFT JUL 2001
|
IEC 60747-16-10 ED.1 - TECHNOLOGY APPROVAL SCHEDULE FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS |
BS EN 60747-5-2:2001
|
DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 5-2: OPTOELECTRONIC DEVICES - ESSENTIAL RATINGS AND CHARACTERISTICS |
13/30287348 DC : 0
|
BS EN 60747-2 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 2: RECTIFIER DIODES |
11/30252977 DC : 0
|
BS EN 61747-10-2 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-2: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - ENVIRONMENTAL AND ENDURANCE |
BS IEC 60747-8:2000
|
Discrete semiconductor devices and integrated circuits Field-effect transistors - Additional ratings and characteristics and amds in the measuring methods for power switching field effect transistors. |
13/30277884 DC : 0
|
BS EN 62148-15 ED 2.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 15: DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER PACKAGES |
17/30355780 DC : DRAFT SEP 2017
|
BS EN 60747-18-2 - SEMICONDUCTOR DEVICES - PART 18-2: SEMICONDUCTOR BIO SENSORS - EVALUATION PROCESS OF LENS-FREE CMOS PHOTONIC ARRAY SENSOR PACKAGE MODULE |
BS EN 62572-3:2016
|
Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication |
BS EN 60747-5-3:2001
|
DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 5-3: OPTOELECTRONIC DEVICES - MEASURING METHODS |
12/30253588 DC : 0
|
BS EN 62751-2 - DETERMINATION OF POWER LOSSES IN VOLTAGE SOURCED CONVERTER (VSC) VALVES FOR HVDC SYSTEMS - PART 2: MODULAR MULTILEVEL CONVERTERS |
13/30264600 DC : 0
|
BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
BS EN 62047-5:2011
|
Semiconductor devices. Micro-electromechanical devices RF MEMS switches |
CEI EN 60747-16-1 : 2009
|
SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
BS QC 760200:1992
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - SECTIONAL SPECIFICATION FOR FILM INTEGRATED CIRCUITS AND HYBRID FILM INTEGRATED CIRCUITS CAPABILITY |
BS EN 61988-5:2009
|
PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION |
06/30156472 DC : DRAFT SEP 2006
|
BS EN 60146-1-1 - SEMICONDUCTOR CONVERTERS - GENERAL REQUIREMENTS AND LINE COMMUTATED CONVERTERS - PART 1-1: SPECIFICATION OF BASIC REQUIREMENTS |
BS IEC 60748-1:2002
|
Semiconductor devices. Integrated circuits General |
BS IEC 60747-7-5:2005
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 7-5: BIPOLAR TRANSISTORS FOR POWER SWITCHING APPLICATIONS |
14/30311058 DC : 0
|
BS EN 60747-16-1:AMD 2 - SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
04/30118741 DC : DRAFT AUG 2004
|
IEC 60747-4 ED 2 - SEMICONDUCTOR DEVICES DISCRETE DEVICES - PART 4: MICROWAVE DIODES AND TRANSISTORS |
BS EN 61643-341:2001
|
LOW VOLTAGE SURGE PROTECTIVE DEVICES - SPECIFICATION FOR THYRISTOR SURGE SUPPRESSORS (TSS) |
04/30113287 DC : DRAFT MAY 2004
|
IEC 60747-9 ED.2 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 9: INSULATED GATE BIPOLAR TRANSISTORS (IGBTS) |
04/30114936 DC : DRAFT JUN 2004
|
EN 50439 - RAILWAY APPLICATIONS - RELIABILITY TESTS FOR HIGH POWER SEMICONDUCTORS DEVICES - PART 1: STANDARD BASE-PLATE MODULES |
BS EN 62148-15:2014
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 15: DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER PACKAGES |
NF EN 60027-2 : 2007
|
LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
BS EN 60286-4:2013
|
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS |
BS EN 61747-1:2000
|
LIQUID CRYSTAL AND SOLID STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |
CEI EN 60286-4 : 2014
|
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS |
IEC 60747-14-5:2010
|
Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor |
I.S. EN 60146-2:2003
|
SEMICONDUCTOR CONVERTERS - PART 2: SELF-COMMUTATED SEMICONDUCTOR CONVERTERS INCLUDING DIRECT D.C. CONVERTERS |
I.S. EN 62047-5:2011
|
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES |
I.S. EN 61709:2017
|
ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION |
I.S. EN 165000-1:1998
|
FILM AND HYBRID INTEGRATED CIRCUITS - PART 1: GENERIC SPECIFICATION CAPABILITY APPROVAL PROCEDURE |
I.S. EN 60747-16-5:2013
|
SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013 (EQV)) |
HD 60027-2 : 200S1
|
LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
IEC 60747-2:2016
|
Semiconductor devices - Part 2: Discrete devices - Rectifier diodes |
CEI EN 60146-1-1 : 2013
|
SEMICONDUCTOR CONVERTERS - GENERAL REQUIREMENTS AND LINE COMMUTATED CONVERTERS - PART 1-1: SPECIFICATION OF BASIC REQUIREMENTS |
I.S. EN 62341-1-1:2009
|
ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAYS - PART 1-1: GENERIC SPECIFICATIONS |
IEC TR 60146-1-2:2011
|
Semiconductor converters - General requirements and line commutated converters - Part 1-2: Application guide |
IEC 61747-10-2:2014
|
Liquid crystal display devices - Part 10-2: Environmental, endurance and mechanical test methods - Environmental and endurance |
IEC 60747-16-2:2001+AMD1:2007 CSV
|
Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers |
IEC 60747-4:2007+AMD1:2017 CSV
|
Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors |
IEC 60747-6:2016
|
Semiconductor devices - Part 6: Discrete devices - Thyristors |
EN 62751-2:2014
|
Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems - Part 2: Modular multilevel converters |
EN 60747-5-1:2001/A2:2002
|
DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - PART 5-1: OPTOELECTRONIC DEVICES - GENERAL |
IEC 61751:1998
|
Laser modules used for telecommunication - Reliability assessment |
IEC 62595-1-1:2013
|
LCD backlight unit - Part 1-1: Generic specification |
IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 CSV
|
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters |
IEC 62572-3:2016
|
Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication |
IEC 61747-1:1998+AMD1:2003 CSV
|
Liquid crystal and solid-state display devices - Part 1: Generic specification |
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV
|
Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches |
IEC 62341-1-1:2009
|
Organic light emitting diode (OLED) displays - Part 1-1: Generic specifications |
UNE-EN 60749-34:2011
|
Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling |
IEC 60146-2:1999
|
Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters |
IEC 60146-1-1:2009
|
Semiconductor converters - General requirements and line commutated converters - Part 1-1: Specification of basic requirements |
IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV
|
Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers |
IEC 62751-2:2014
|
Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems - Part 2: Modular multilevel converters |
IEC 62148-15:2014
|
Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages |
IEC 62047-4:2008
|
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS |
IEC 60747-5-2:1997+AMD1:2002 CSV
|
Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics |
EN 61751:1998
|
Laser modules used for telecommunication - Reliability assessment |
EN 62047-4:2010
|
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS |
EN 62595-1-1:2013
|
LCD backlight unit - Part 1-1: Generic specification |
CEI EN 62595-1-1 : 2014
|
LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION |
07/30164953 DC : 0
|
IEC 60747-14-5 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 14-5: SEMICONDUCTOR SENSORS - PN-JUNCTION SEMICONDUCTOR TEMPERATURE SENSOR |
DIN IEC 60747-5:1988-12
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 5: OPTOELECTRONIC DEVICES |
05/30135225 DC : DRAFT JUN 2005
|
IEC 60749-9 ED 2 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 9: INSULATED-GATE BIPOLAR TRANSISTORS (IGBTS) |
08/30181404 DC : DRAFT APR 2008
|
BS IEC 60747-14-3 - SEMICONDUCTOR DEVICES - PART 14-3: SEMICONDUCTOR SENSORS - PRESSURE SENSORS |
CEI EN 60747-16-5 : 2014
|
SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
CEI EN 62047-4 : 2011
|
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS |
13/30264596 DC : 0
|
BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
BS PD IEC TR 62572-2 : 2008
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 2: LASER MODULE DEGRADATION |
EN 62148-15:2014
|
Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages |
12/30252799 DC : 0
|
BS EN 62751-1-1 - DETERMINATION OF POWER LOSSES IN VOLTAGE SOURCED CONVERTERS (VSC) FOR HV DC SYSTEMS - PART 1: GENERAL REQUIREMENTS |
09/30183239 DC : 0
|
BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
BS QC 760100:1991
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. SEMICONDUCTOR DEVICES. INTEGRATED CIRCUITS. FILM AND HYBRID INTEGRATED CIRCUITS: QUALIFICATION APPROVAL |
BS EN 60747-5-1:2001 (published 2003-01)
|
Discrete semiconductor devices and integrated circuits. Optoelectronic devices General |
BS QC 750000(1986) : 1986
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - DISCRETE SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION |
EN 60747-16-3:2002/A2:2017
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS (IEC 60747-16-3:2002/A2:2017) |
07/30169412 DC : 0
|
BS EN 60747-16-4 AMD1 - SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
BS IEC 60747-4.2 : 2000
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES - MICROWAVE DIODES AND TRANSISTORS - INTEGRATED-CIRCUIT MICROWAVE AMPLIFIERS - BLANK DETAIL SPECIFICATION |
NFC 03 002 : 2002
|
LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 2: TELECOMMUNICATIONS AND ELECTRONICS |
BS EN 60747-16-4 : 2004
|
SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
07/30148822 DC : 0
|
BS IEC 62047-4 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATIONS FOR MEMS |
BS EN 60146-1-1:2010
|
Semiconductor converters. General requirements and line commutated converters Specification of basic requirements |
BS IEC 60748-23-2:2002
|
Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Internal visual inspection and special tests |
I.S. EN 60747-16-3:2002
|
SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
I.S. EN 62595-1-1:2013
|
LCD BACKLIGHT UNIT - PART 1-1: GENERIC SPECIFICATION (IEC 62595-1-1:2013 (EQV)) |
IEC 60747-14-1:2010
|
Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors |
IEC TR 62572-2:2008
|
Fibre optic active components and devices - Reliability standards - Part 2: Laser module degradation |
BIS IS 15934-5 : 2011
|
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
NFC 96 002 : 2001
|
SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 2: RECTIFIER DIODES |
IEC 60748-2:1997
|
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits |
IEC 60748-23-1:2002
|
Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification |
I.S. EN 61988-5:2009
|
PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION |
I.S. EN 60747-16-4:2004
|
SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
EN 60747-16-1:2002/A2:2017
|
SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017) |
IEC 61643-341:2001
|
Components for low-voltage surge protective devices - Part 341: Specification for thyristor surge suppressors (TSS) |
BS EN 45510-2-2:1999
|
GUIDE FOR THE PROCUREMENT OF POWER STATION EQUIPMENT - ELECTRICAL EQUIPMENT - UNINTERRUPTIBLE POWER SUPPLIES |
IEC 60747-15:2010
|
Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
EN 62572-3:2016
|
Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication |
EN 60747-16-10:2004
|
Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits |
EN 61988-5 : 2009
|
PLASMA DISPLAY PANELS - PART 5: GENERIC SPECIFICATION |
EN 62341-1-1:2009
|
Organic light emitting diode (OLED) displays - Part 1-1: Generic specifications |
EN 62047-5:2011
|
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches |
EN 61747-1:1999/A1:2003
|
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |
EN 60146-1-1:2010
|
Semiconductor converters - General requirements and line commutated converters - Part 1-1: Specification of basic requirements |
EN 60417-1:2002
|
GRAPHICAL SYMBOLS FOR USE ON EQUIPMENT - PART 1: OVERVIEW AND APPLICATION |
EN 165000-1:1996
|
Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure |
IEC 61709:2017
|
Electric components - Reliability - Reference conditions for failure rates and stress models for conversion |
EN 60146-2:2000
|
Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters |
EN 60749 : 99 AMD 2 2001
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS |