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  • IPC 9202 : 0

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE

    Available format(s):  Hardcopy

    Superseded date:  15-11-2022

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 Scope/Introduction
    2 APPLICABLE DOCUMENTS
    3 TEST SPECIMENS
    4 SAMPLE SIZES
    5 APPARATUS AND MATERIALS
    6 PROCESSING OF TEST VEHICLES
    7 SPECIMEN PREPARATION FOR TESTING
    8 TEST METHODOLOGY
    9 ACCEPTANCE CRITERIA
    10 REPORTING
    11 NOTES
    12 HELPFUL REFERENCES

    Abstract - (Show below) - (Hide below)

    Explains changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions that grossly affect reliability.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in IPC C 103, IPC C 108 & IPC C 1000. (11/2011)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IPC 9203 : 0 USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE
    IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    NASA GSFC STD 8002 : 2015 STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC A 52-G : 2006 CLEANLINESS AND RESIDUE EVALUATION TEST BOARD
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC A 24 : LATEST SURFACE INSULATION RESISTANCE
    IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
    IPC WP 008 : 0 SETTING UP ION CHROMATOGRAPHY CAPABILITY
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