• IPC 9201 : A

    Current The latest, up-to-date edition.

    SURFACE INSULATION RESISTANCE HANDBOOK

    Available format(s):  Hardcopy

    Language(s):  Japanese

    Published date:  19-09-2007

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE AND DESIGNATION
       1.1 Scope
       1.2 Purpose
       1.3 How is SIR Testing Used?
    2 APPLICABLE DOCUMENTS
       2.1 IPC
       2.2 Joint Industry Standards
       2.3 International Electrotechnical Commission (IEC)
       2.4 American Society for Testing and Materials (ASTM)
    3 SURFACE INSULATION RESISTANCE
       3.1 Terms and Definitions
            3.1.1 Metal Migration/Filament Formation
            3.1.2 Electrochemical Corrosion
       3.2 Basic Concepts
            3.2.1 Sheet Resistance
            3.2.2 A 'Square'
            3.2.3 Series/Parallel Resistance
            3.2.4 Ohms Per Square
            3.2.5 Conduction Mechanisms
       3.3 Test Factors Affecting Results
            3.3.1 Wiring
            3.3.3 Sample Orientation in the Chamber
            3.3.4 Voltage
            3.3.5 Test Temperature
            3.3.6 Test Humidity
            3.3.7 Rate of Change, Ambient to Elevated
            3.3.8 Test board Design
            3.3.9 Frequency of Measurement
            3.3.10 Conformal Coating
       3.4 Known Process Effects on SIR Levels
            3.4.1 Precleaning
            3.4.2 Developing Process Effects
            3.4.3 Curing Effects
            3.4.4 Hot Air Solder Leveling (HASL)
    4 ASSESSMENT OF SIR TEST METHODS
       4.1 Test Methods - General
            4.1.1 Cyclical Test Environments
            4.1.2 Harsh Static Environments
            4.1.3 Measurement Frequency
       4.2 Description of Test Methods
       4.3 Use of Salt Solutions
       4.4 Acceleration Factors
            4.4.1 Arrhenius Model
            4.4.2 Eyring Model
    5 SETTING UP FOR SIR TESTING
       5.1 Data Acquisition and Associated Hardware
       5.2 Fixturing
            5.2.1 Fixturing Internal to Chamber
            5.2.2 Fixturing External to Chamber
       5.3 Chamber Design and Configuration
       5.4 System Verification and Calibration
            5.4.1 SIR Test Chamber
            5.4.2 The Data Acquisition System
            5.4.3 Test Supplies
            5.4.4 Power Supplies
    6 RUNNING A TEST AND TEST CONSISTENCY
       6.1 Substrate Preparation Important Notes
            6.1.1 Test Specimen Marking
       6.2 Test Specimen Controls
       6.3 Pretest Checks
            6.3.1 Chamber
            6.3.2 Test Specimens
            6.3.3 Sample Randomization and Placement
       6.4 Starting the Test
       6.5 Test Chamber Monitoring
       6.6 Post-Test Operations
       6.7 Data Analysis Example
       6.8 Treatment of 'Anomalous' Data
    7 QUALIFICATION PHASES
       7.1 Materials vs. Process Qualification
       7.2 Determining Acceptance Criteria
            7.2.1 Readings Vs. Visual Examination
            7.2.2 Temperature and Humidity Variations
            7.2.3 Discussion of Test Specimen Design
            7.2.4 Available SIR Test Vehicles
    8 RECOMMENDATIONS FOR PREVENTION OF SIR FAILURES
       8.1 Typical SIR Failures
       8.2 Contingencies
       8.3 Other Recommendations
    9 SIR TESTING ON NONPRINTED BOARD MATERIALS
       9.1 Alternative Substrates
       9.2 Testing Other Printed Board Materials
       9.3 High Resistance Measurements
       9.4 Integrated Circuits (Wafers)
    10 REFERENCES
       10.1 Published Papers
       10.2 Industry Contacts and SIR Equipment Vendors
    APPENDIX A - LITERATURE REVIEW
    APPENDIX B - LISTING OF TEST METHODS AND CRITERIA
    APPENDIX C - SIR TEST VEHICLES

    Abstract - (Show below) - (Hide below)

    Covers the terminology, theories, test procedures and test vehicles of SIR testing, including temperature-humidity (TH) and temperature-humidity-bias (THB).

    General Product Information - (Show below) - (Hide below)

    Development Note Included in IPC C 108. (06/2008) Included in IPC C 1000. (07/2008)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS IEC 61189-5-4 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
    12/30274796 DC : 0 BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX
    12/30274804 DC : 0 BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE
    BS IEC 61189-5-2 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
    IEC 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    EN 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
    EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
    IPC 7093 CHINESE : - DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC 5702 : 0 GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS
    IPC TR 583 : 0 AN IN-DEPTH LOOK AT IONIC CLEANLINESS TESTING
    IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC 9203 : 0 USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE
    IPC MI 660 : 1984 INCOMING INSPECTION OF RAW MATERIALS MANUAL
    IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    12/30274800 DC : 0 BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE
    IPC SA 61 : A POST SOLDER SEMI-AQUEOUS CLEANING HANDBOOK
    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    IEC 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
    IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC 9202 : 0 MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE
    BS EN 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
    BS IEC 61189-5-3 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
    BS EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies
    IPC TR 582 : 0 CLEANING AND CLEANLINESS TESTING PROGRAM FOR PHASE 3 - LOW SOLIDS, FLUXES AND PASTES PROCESSED IN AMBIENT AIR
    I.S. EN 61189-5:2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
    IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
    BS EN ISO 9455-17:2006 Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues
    IPC J STD 030 : A SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS
    BS EN 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies
    BS EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies
    IPC M 108 : LATEST CLEANING GUIDES AND HANDBOOKS MANUAL
    I.S. EN 61189-5-4:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    PD IEC/TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
    IEC 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    ISO 9455-17:2002 Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
    EN ISO 9455-17:2006 Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002)
    IPC TR 476 : A1997 ELECTROCHEMICAL MIGRATION: ELECTRICALLY INDUCED FAILURES IN PRINTED WIRING ASSEMBLIES
    BS ISO 9455-17 : 2002 AMD 16425 SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES
    IPC A 52-G : 2006 CLEANLINESS AND RESIDUE EVALUATION TEST BOARD
    IPC TR 580 : 1989 CLEANING AND CLEANLINESS TEST PROGRAM, PHASE 1 TEST RESULTS
    I.S. EN 61189-5-3:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
    I.S. EN 61189-5-2:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
    IPC TR 581 : 1994 IPC PHASE 3 CONTROLLED ATMOSPHERE SOLDERING STUDY
    PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
    EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
    EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    I.S. EN ISO 9455-17:2006 SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES
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