UNI EN ISO 9453 : 2014

Superseded

Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS

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Superseded date: 17-02-2021

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Published date: 31-12-2013

Publisher: Ente Nazionale Italiano di Unificazione (UNI)

Table of Contents - (Show below) - (Hide below)

Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Chemical composition
5 Forms of delivery
6 Sampling and analysis
7 Marking, labelling and packaging
Annex A (informative) - Comparison between alloy numbers
in ISO 9453 and short names and chemical
compositions according to IEC 61190-1-3
Annex B (informative) - Patented alloys and patent holder list
Bibliography

Abstract - (Show below) - (Hide below)

Defines the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

General Product Information - (Show below) - (Hide below)

Committee	U28.00
Development Note	Supersedes UNI EN 29453. (09/2007)
Document Type	Standard
ISBN
Pages
Published
Publisher	Ente Nazionale Italiano di Unificazione (UNI)
Status	Superseded
Superseded By	UNI EN ISO 9453:2021
Supersedes	UNI EN ISO 9453 : 2007

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
ONORM EN ISO 9453 : 2014	Identical
NS EN ISO 9453 : 2014	Identical
SN EN ISO 9453 : 2014	Identical
BS EN ISO 9453:2014	Identical
I.S. EN ISO 9453:2014	Identical
DIN EN ISO 9453 E : 2014	Identical
NEN EN ISO 9453 : 2014	Identical
ISO 9453:2014	Identical
DIN EN ISO 9453:2014-12	Identical
EN ISO 9453:2014	Identical
NBN EN ISO 9453 : 2014	Identical
UNE-EN ISO 9453:2015	Identical
NF EN ISO 9453 : 2014	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

UNI 11528 : 2014	GAS PLANTS OVER 35 KW - DESIGN, INSTALLATION AND COMMISSIONING

Standards Referencing This Book - (Show below) - (Hide below)

ISO 3677:2016	Filler metal for soldering and brazing — Designation
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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