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  • UNI EN ISO 9455-16 : 2013

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD

    Available format(s): 

    Superseded date:  04-03-2020

    Language(s): 

    Published date:  31-12-2012

    Publisher:  Ente Nazionale Italiano di Unificazione (UNI)

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    1 Scope
    2 Normative references
    3 Symbols
    4 Principle
    5 Reagents
    6 Apparatus
    7 Test pieces
    8 Procedure
    9 Reference value using standard flux
    10 Presentation of results
    11 Calculation and expression of results
    12 Test report
    Annex A (normative) - Method for the preparation
            of standard rosin (colophony) based liquid
            fluxes having 25% (by mass) non-volatile
            content
    Annex B (normative) - Method for the production
            of test pieces with a controlled-contaminated
            surface for the wetting balance test (artificial
            sulfidation method)

    Abstract - (Show below) - (Hide below)

    Describes a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Ente Nazionale Italiano di Unificazione (UNI)
    Status Superseded
    Superseded By
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    View more information

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