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IEC 60068-2-20:2008

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

31-12-2021

Language(s)

English, English - French

Published date

21-07-2008

FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test Ta: Solderability of wire and tag terminations
  4.1 Object and general description of the test
      4.1.1 Test methods
      4.1.2 Specimen preparation
      4.1.3 Initial measurements
      4.1.4 Accelerated ageing
  4.2 Method 1: Solder bath
      4.2.1 Description of the solder bath
      4.2.2 Flux
      4.2.3 Procedure
      4.2.4 Test conditions
      4.2.5 Final measurements and requirements
  4.3 Method 2: Soldering iron at 350 degrees C
      4.3.1 Description of soldering irons
      4.3.2 Solder and flux
      4.3.3 Procedure
      4.3.4 Final measurements and requirements
  4.4 Information to be given in the relevant specification
5 Test Tb: Resistance to soldering heat
  5.1 Object and general description of the test
      5.1.1 Test methods
      5.1.2 Initial measurements
  5.2 Method 1: Solder bath
      5.2.1 Description of the solder bath
      5.2.2 Flux
      5.2.3 Procedure
      5.2.4 Test conditions
      5.2.5 De-wetting
  5.3 Method 2: Soldering iron
      5.3.1 Description of soldering iron
      5.3.2 Solder and flux
      5.3.3 Procedure
  5.4 Recovery
  5.5 Final measurements and requirements
  5.6 De-wetting (if applicable)
  5.7 Information to be given in the relevant specification
Annex A (informative) Example of apparatus for accelerated
        steam ageing process
Annex B (normative) Specification for flux constituents
Bibliography

IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following:
- the solder globule test is deleted;
- test conditions and requirements for lead-free solders are added.

Committee
TC 91
DevelopmentNote
Stability Date: 2017. (07/2015)
DocumentType
Standard
Pages
20
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy
Supersedes

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EN 60068-2-44:1995 Environmental testing - Part 2: Tests - Guidance on Test T: Soldering
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CLC/TS 50466:2006 Long duration storage of electronic components - Specification for implementation
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EN 61747-5:1998 Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods
EN 61204-6:2001 Low-voltage power supplies, DC output - Part 6: Requirements for low-voltage power supplies of assessed performance
EN 129000:1993/A1:1995 GENERIC SPECIFICATION - FIXED RF WOUND INDUCTORS
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NF EN 62025-2 : 2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
EN 61051-1:2008 Varistors for use in electronic equipment - Part 1: Generic specification
EN 60252-1 : 2011 AMD 1 2013 AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION (IEC 60252-1:2010/A1:2013)
EN 61811-54:2002 Electromechanical all-or-nothing relays - Part 54: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 15 mm x 7,5 mm base
EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
EN 60738-1:2006/A1:2009 THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
EN 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
EN 62326-4-1:1997 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
EN 60838-2-1:1996/A2:2004 MISCELLANEOUS LAMPHOLDERS - PART 2: PARTICULAR REQUIREMENTS - SECTION 1: LAMPHOLDERS S14 (IEC 60838-2-1:1994/A2:2004)
EN 60512-12-6 : 1996 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering
EN 60115-2:2015 Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors
EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
EN 61248-4:1997 Transformers and inductors for use in electronic and telecommunication equipment - Part 4: Sectional specification for power transformers for switched mode power supplies (SMPS) on the basis of the capability approval procedure
EN 140401:2009 Blank Detail Specification: Fixed low power film surface mount (SMD) resistors
EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
EN 61881-2 : 2012 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE (IEC 61881-2:2012)
EN 140402:2015/A1:2016 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
EN 62319-1:2005 Polymeric thermistors - Directly heated positive step function temperature coefficient - Part 1: Generic specification
EN 60169-21:1997 Radio-frequency connectors - Part 21: Two types of radio-frequency connectors with inner diameter of outer conductor 9,5 mm (0,374 in) with different versions of screw coupling - Characteristic impendance 50 ohms (types SC-A and SC-B)
EN 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IPC S 804 : A1987 PRINTED WIRING BOARDS, SOLDERABILITY TEST METHODS FOR,
EN 117000:1991 Generic Specification: Solid state all-or-nothing relays of assessed quality - Generic data and methods of test
EN 168000 : 1993 AMD 2 1998 GENERIC SPECIFICATION - QUARTZ CRYSTAL UNITS
BS CECC 00802:1991 Harmonized system of quality assessment for electronic components. Guidance document: CECC standard method for the specification of surface mounting components (SMDs) of assessed quality
12/30268003 DC : 0 BS EN 60939-3 - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: HARMONIZED STANDARD FOR PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE
BS EN 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
02/209660 DC : DRAFT OCT 2002 IEC 60512-12-3, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT BASIC TESTING AND MEASUREMENTS - PART 12-3 - TEST 12C: SOLDERABILITY, DE-WETTING
BS EN 61747-5:1998 Liquid crystal and solid-state display devices Environmental, endurance and mechanical test methods
04/30126718 DC : DRAFT DEC 2004 IEC 60189-1 ED.3 - LOW-FREQUENCY CABLES AND WIRES WITH PVC INSULATION AND PVC SHEATH - PART 1: GENERAL TEST AND MEASURING METHODS
13/30278343 DC : 0 BS EN 62246-1 - REED SWITCHES - PART 1: GENERIC SPECIFICATION
17/30352704 DC : 0 BS IEC 62149-10 ED1.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 10: ROF (RADIO OVER FIBER) TRANSCEIVERS FOR MOBILE FRONTHAUL
BS IEC 61196-9:2014 Coaxial communication cables Sectional specification for RF flexible cables
06/30157868 DC : 0 BS EN 60393-1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
NF EN 62246-1-1 : 2013 REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT
BS CECC 43000(1982) : AMD 7315 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION: DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS
UTEC 96 029 : 2011 ELECTRONIC COMPONENTS - LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDE FOR IMPLEMENTATION
03/101947 DC : DRAFT FEB 2003 IEC 60939-1 ED.2.0 - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION
BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
BS EN 60512-12-7:2001 Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Soldering tests Test 12g. Solderability, wetting balance method - Section 7: Test 12g: Solderability, wetting balance method
BS EN 62922:2017 Organic light emitting diode (OLED) panels for general lighting. Performance requirements
15/30332490 DC : 0 BS EN 62211 - INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
02/203604 DC : DRAFT MAR 2002 IEC 61810-1. ED.2 - ELEMENTARY RELAYS - PART 1: SAFETY-RELATED AND GENERAL REQUIREMENTS
BS EN 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies
IEC 61071 REDLINE : 2ED 2017 CAPACITORS FOR POWER ELECTRONICS
07/30165180 DC : 0 BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE
CEI EN 62149-4 : 2011 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION
05/30129049 DC : DRAFT FEB 2005 IEC 62025-2 - HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
EN 60939-3:2015/AC:2016-04 PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE (IEC 60939-3:2015/COR1:2016)
BS EN 61338-1:2005 Waveguide type dielectric resonators Generic specification
BS EN 60512-12-1:2006 Connectors for electronic equipment. Tests and measurements Soldering tests - Test 12a. Solderability, wetting, solder bath method
11/30243259 DC : 0 BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
CEI EN 60384-26-1 : 2011 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ
03/103741 DC : DRAFT FEB 2003 IEC 61338-1 ED.1 - WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
NF EN 61643-311 : 2014 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 311: PERFORMANCE REQUIREMENTS AND TEST CIRCUITS FOR GAS DISCHARGE TUBES (GDT)
BS EN 62326-4:1997 Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
BS EN 62314:2006 Solid-state relays
BS EN 60252:1994 A.C. motor capacitors
BS EN 61169-1:2013 Radio-frequency connectors Generic specification. General requirements and measuring methods
NF EN 60068-3-13 : 2016 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
10/30196657 DC : 0 BS EN 61881-2 - RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE
IEC 60512-12-7:2001 Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method
09/30203267 DC : 0 BS EN 60749-15 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
BS CECC 41200:1979 Harmonized system of quality assurance for electronic components: sectional specification: power potentiometers
BS EN 60068-2-83:2011 Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
NF EN 61643-331 : 2003 COMPOSANTS POUR PARAFOUDRES BASSE TENSION - PARTIE 331: SPECIFICATIONS POUR LES VARISTANCES A OXYDE METALLIQUE (MOV)
17/30336631 DC : 0 BS EN 62246-1-1 - REED SWITCHES - PART 1-1: DETAIL SPECIFICATION - QUALITY ASSESSMENT
10/30234803 DC : 0 BS EN 61169-1 ED.2 - RADIO FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS
NF EN 61020-1 : 2009 ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS EN 60749-15:2010 Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices
14/30296909 DC : 0 BS EN 61643-331 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 331: PERFORMANCE REQUIREMENTS AND TEST METHODS FOR METAL OXIDE VARISTORS (MOV)
BS EN 60862-1:2015 Surface acoustic wave (SAW) filters of assessed quality Generic specification
CEI EN 62739-1 : 2014 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING
I.S. EN 61249-8-7:1999 MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS
12/30274800 DC : 0 BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE
09/30186180 DC : 0 BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
BS EN 60738-1 : 2006 THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
05/30134428 DC : DRAFT JUN 2005
09/30207307 DC : 0 BS EN 60115-2 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: FIXED LOW-POWER NON-WIREWOUND RESISTORS
I.S. EN 61337-1:2005 FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION
CSA E60127.6 : 2003 MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE CARTRIDGE FUSE-LINKS
CAN/CSA-E60127-6-03 (R2017) Miniature Fuses - Part 6: Fuse-Holders for Miniature Cartridge Fuse-Links (Adopted CEI/IEC 127-6:1994, first edition, 1994-04, including Amendment 1:1996, with Canadian deviations) | Coupe-circuit miniatures - Partie 6: Ensembles-porteurs pour cartouches de coupe-circuit miniatures (norme CEI/IEC 127-6:1994 adoptée, première édition, 1994-04, y compris l\'Amendement 1:1996, avec exigences propres au Canada)
I.S. CLC TS 50466:2006 LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
CEI EN 60393-1 : 2010 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
EN IEC 61058-1:2018 Switches for appliances - Part 1: General requirements
NF EN 60684-2 : 2012 FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST
BS EN 61810-1:2015 Electromechanical elementary relays General and safety requirements
NF EN 61881-1 : 2011 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS
IEC 60068-2-44:1995 Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
CEI EN 61810-1 : 2016 ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS
NF EN 61249 8-8 : 1998 MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS
NF EN 62246-1 : 2015 REED SWITCHES - PART 1: GENERIC SPECIFICATION
BS EN 138000:1997 Harmonized system of quality assessment for electronic components. Generic specification: fixed inductors for electromagnetic interference suppression (inductors for which safety tests are required)
CEI EN 60384-26 : 2011 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
IEC 60810:2017 Lamps, light sources and LED packages for road vehicles - Performance requirements
I.S. EN 16602-70-10:2015 SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS
CEI EN 60512-12-1 : 2007 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD
I.S. EN 62435-5:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
I.S. EN 61019-1:2005 SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION
I.S. EN 61071:2007 CAPACITORS FOR POWER ELECTRONICS
I.S. EN 60115-8:2012 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD))
I.S. EN 60115-8-1:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
EN 62884-1:2017 Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement
I.S. EN 61193-3:2013 QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING (IEC 61193-3:2013 (EQV))
BS EN 61058-1 : 2002 SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS
BS EN 60115-1 : 2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 60512-12-1:2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING,
I.S. EN 61058-1:2002 SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS
I.S. EN 60068-2-82:2007 ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS
I.S. EN 61248-4:1998 TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 4: SECTIONAL SPECIFICATION FOR POWER TRANSFORMERS FOR SWITCHED MODE POWER SUPPLIES (SMPS) ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE
I.S. EN 61248-3:1998 TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 3: SECTIONAL SPECIFICATION FOR POWER TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE
BS EN 60127-4 : 2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
I.S. EN 61747-10-1:2013 LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL (IEC 61747-10-1:2013 (EQV))
I.S. EN 60512-12-5:2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-5: SOLDERING TESTS - TEST 12E: RESISTANCE TO SOLDERING HEAT, SOLDERING IRON METHOD
CEI EN 60068-2-58 : 2016 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
I.S. EN 61881-3:2012 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS (IEC 61881-3:2012 (EQV))
I.S. EN 60068-2-83:2011 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV))
IEC 60539-1:2016 Directly heated negative temperature coefficient thermistors - Part 1: Generic specification
I.S. EN 61249-5-4:1999 MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS - SECTION 4: CONDUCTIVE INKS
I.S. EN 60512-12-4:2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD
CEI EN 61881-2 : 2013 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE
VDE 0468-2-69 : 2018 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
UNE-EN ISO 4521:2010 Metallic and other inorganic coatings - Electrodeposited silver and silver alloy coatings for engineering purposes - Specification and test methods (ISO 4521:2008)
NF EN 60400 : 2008 AMD 2 2014 LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS
NF EN 60939-1 : 2011 PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION
NF EN 61189-5 : 2008 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
IEC PAS 61811-55:2000 Electromechanical all-or-nothing relays - Part 55: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 11 mm x 7,5 mm (max.) base
I.S. EN 60368-1:2000 PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
IEC 61196-1-305:2015 Coaxial communication cables - Part 1-305: Mechanical test methods - Solderability and resistance to soldering
I.S. EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
I.S. EN 61196-2:2003 RADIO-FREQUENCY CABLES - PART 2: SECTIONAL SPECIFICATION FOR SEMI-RIGID RADIO-FREQUENCY AND COAXIAL CABLES WITH POLYTETRAFLUOROETHYLENE (PTFE) INSULATION
IEC 60115-8-1:2014 Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
I.S. EN 140100:2008 SECTIONAL SPECIFICATION: FIXED LOW POWER FILM RESISTORS
EN 62922:2017 Organic light emitting diode (OLED) panels for general lighting - Performance Requirements
DIN EN ISO 9455-10:2013-01 Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012)
DIN EN ISO 9455-16:2013-08 SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013)
BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
IEC 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
IEC 61204-6:2000 Low-voltage power supplies, d.c. output - Part 6: Requirements for low-voltage power supplies of assessed performance
IEC 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
IEC 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
UNE-EN ISO 9455-16:2013 Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013)
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
IEC 61338-2:2004 Waveguide type dielectric resonators - Part 2: Guidelines for oscillator and filter applications
I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
EN 61760-3:2010 Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
IEC 60838-1:2016 RLV Miscellaneous lampholders - Part 1: General requirements and tests
DIN EN ISO 27874:2009-01 METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS
IEC 61058-1:2016 RLV Switches for appliances - Part 1: General requirements
DIN EN 61270-1 : 1997 CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL
VDE 0560-800 : 1998 GENERIC SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC A.C. CAPACITORS WITH NON-SOLID ELECTROLYTE FOR USE WITH MOTORS
BIS IS/IEC 61058-1 : 2000(R2007) SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS
DIN VDE 0616-3 : 1992 LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS
DIN EN 137000 : 1998-03 GENERIC SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC A.C. CAPACITORS WITH NON-SOLID ELECTROLYTE FOR USE WITH MOTORS
DIN EN 60938-1 : 2008 FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION
BS 2011-1.1:1989 Environmental testing General and guidance
VDE 0560-22 : 1997 CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL
BS CECC 50000:1987 Harmonized system of quality assessment for electronic components. Generic specification: discrete semiconductor devices
VDE 0557-6 : 2001 LOW-VOLTAGE POWER SUPPLIES, DC OUTPUT - PART 6: REQUIREMENTS FOR LOW-VOLTAGE POWER SUPPLIES OF ASSESSED PERFORMANCE
BS CECC17000(1992) : 1992 AMD 9626 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION - SOLID STATE ALL OR NOTHING RELAYS - GENERIC DATA AND METHODS OF TEST
CEI EN 60068-3-13 : 1ED 2017 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
CEI CLC/TS 50466 : 2006 LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
02/209659 DC : DRAFT OCT 2001 IEC 60512-12-2, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-2 - TEST 12B: SOLDERABILITY, WETTING, IRON METHOD
I.S. EN 62435-2:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
BS EN 61811-52:2002 Electromechanical all-or-nothing relays Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 20 mm x 10 mm base
14/30309692 DC : 0 BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS
I.S. EN 62739-1:2013 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013 (EQV))
BS CECC 64000:1990 Harmonized system of quality assessment for electronic components: generic specification: film resistor networks
BS CECC 41300:1979 Harmonized system of quality assessment for electronic components. Sectional specification: low power single-turn rotary potentiometers
13/30287806 DC : 0 BS EN 60539-1 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
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IEC 61261-1:1994 Piezoelectric ceramic filters for use in electronic equipment - A specification in the IEC quality assessment system for electronic components (IECQ) - Part 1: Generic specification - Qualification approval
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BS EN 60939-3:2015 Passive filter units for electromagnetic interference suppression Passive filter units for which safety tests are appropriate
06/30153438 DC : DRAFT JULY 2006 BS IEC 60539-1 ED.2 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORES - PART 1: GENERIC SPECIFICATION
12/30250506 DC : DRAFT MAR 2012 BS EN 62739-1 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING
BS EN 60838-2-1 : 1997 MISCELLANEOUS LAMPHOLDERS - PART 2: PARTICULAR REQUIREMENTS - SECTION 1: LAMPHOLDERS S14
CEI EN 62421 : 2008 ELECTRONICS ASSEMBLY TECHNOLOGY - ELECTRONIC MODULES
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CEI EN 62739-3 : 1ED 2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS
09/30207299 DC : DRAFT JULY 2009 BS EN 60252-2 - AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS
BS EN 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
97/231700 DC : DRAFT DEC 1997 IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
12/30252220 DC : DRAFT MAR 2012 BS EN 62604-1 - SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS - PART 1: GENERIC SPECIFICATION
I.S. EN 60238:2004 EDISON SCREW LAMPHOLDERS (IEC 60238:2004 (EQV))
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BS EN 140000:1995 Harmonized system of quality assessment for electronic components. Generic specification: fixed resistors
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BS EN 61747-10-1:2013 Liquid crystal display devices Environmental, endurance and mechanical test methods. Mechanical
NF EN 60068-2-83 : 2012 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
16/30338981 DC : 0 BS EN 60934 - CIRCUIT-BREAKERS FOR EQUIPMENT (CBE)
BS EN 61019-1:2005 Surface acoustic wave (SAW) resonators Generic specification
EN 60400:2017 Lampholders for tubular fluorescent lamps and starterholders
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08/30176905 DC : DRAFT JAN 2008 BS EN 60684-2 - FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST
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BS EN 61811-51:2002 Electromechanical all-or-nothing relays Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Non-standardized types and construction
I.S. EN 61337-2:2004 FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE
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BS 123400-003:2001 System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
BS EN 60068-2-54:2006 Environmental testing Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
02/209662 DC : DRAFT OCT 2002 IEC 60512-12-5, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-5 - TEST 12E: RESISTANCE TO SOLDERING HEAT, IRON METHOD
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02/209661 DC : DRAFT OCT 2002 IEC 60512-12-4, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-4 - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD
BS EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies
BS 4584-103.2:1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials
04/30112673 DC : DRAFT APR 2004 IEC 62314 ED.1 - SOLID-STATE RELAYS
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CEI EN 60368-1 : 2006 PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
BS EN 61204-6:2001 Low voltage power supplies, d.c. output Requirements for low-voltage power supplies of assessed performance
BS EN 61881-2:2012 Railway applications. Rolling stock equipment. Capacitors for power electronics Aluminium electrolytic capacitors with non solid electrolyte
BS EN 133000:1997 Harmonized system of quality assessment for electronic components. Generic specification: passive filter units for electromagnetic interference suppression
BS EN 61760-1:2006 Surface mounting technology Standard method for the specification of surface mounting components (SMDs)
BS IEC 60748-23-1:2002 Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification
BS EN 61760-3:2010 Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering
BS EN 61881-1:2011 Railway applications. Rolling stock equipment. Capacitors for power electronics Paper/plastic film capacitors
BS EN 120000:1996 Harmonized system of quality assessment for electronic components. General specification: semiconductor optoelectronic and liquid crystal devices
BS QC 763000(1990) : AMD 6754 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION
BIS IS/IEC 60862-1 : 2003 SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
06/30155922 DC : 0 BS EN 140100 - SECTIONAL SPECIFICATION - FIXED LOW POWER FILM RESISTORS
BS EN 61811-55:2002 Electromechanical non-specified time all-or-nothing relays of assessed quality Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 11 mm x 7,5 mm (max.) base
IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
BS EN 60252-2 : 2011 AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS
10/30184605 DC : 0 BS EN 61643-313 ED 1.0 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 313: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (GDT)
07/30169004 DC : 0 BS EN 60400 - LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS
BS EN 168000:1996 Harmonized system of quality assessment for electronic components. Generic specification: quartz crystal units
IEC 60326-9:1991 Printed boards - Part 9: Specification for flexible multilayer printed boards with through connections
BS EN 61811-54:2002 Electromechanical non-specified time all-or-nothing relays of assessed quality Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 15 mm x 7,5 mm base
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BS EN 60684-2:2011 Flexible insulating sleeving Methods of test
CSA E691 : 0 THERMAL LINKS - REQUIREMENTS AND APPLICATION GUIDE
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BS EN 60368-1:2000 Piezoelectric filters Generic specification
CSA E60127.6 : 2003 : R2012 MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE CARTRIDGE FUSE-LINKS
CEI EN 62884-1 : 1ED 2018 MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT
UNE-EN 61020-1:2011 Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification
NF EN 60938-1 : 2008 AMD 1 2008 FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION
IEC 61338-1-2:1998 Waveguide type dielectric resonators - Part 1-2: General information and test conditions - Test conditions
GOST R IEC 60252-1 : 2005 AC MOTOR CAPACITORS - PART 1: GENERAL. PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDE FOR INSTALLATION AND OPERATION
EN 60068-2-69:2017/AC:2018-03 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018)
BS EN 167000:1993 Harmonized system of quality assessment for electronic components. Generic specification: piezoelectric filters
IEC 60400:2017 Lampholders for tubular fluorescent lamps and starterholders
I.S. EN ISO 4521:2008 METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS
I.S. EN 60810:2015 LAMPS FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
BS EN 140402 : 2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
I.S. EN 61189-5:2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
BS EN 60934 : 2001 CIRCUIT-BREAKERS FOR EQUIPMENT (CBE)
I.S. EN 140101-806:2009 DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS
I.S. EN 60384-1:2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
CEI EN 60122-1 : 2004 QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
I.S. EN 62922:2017 ORGANIC LIGHT EMITTING DIODE (OLED) PANELS FOR GENERAL LIGHTING - PERFORMANCE REQUIREMENTS
I.S. EN 138000:1998 FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (INDUCTORS FOR WHICH SAFETY TESTS ARE REQUIRED) (GENERIC SPECIFICATION)
I.S. EN 61338-1:2005 WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION
BS EN IEC 60810:2018 Lamps, light sources and led packages for road vehicles. Performance requirements
NF EN 60127-6 : 2014 MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE CARTRIDGE FUSE-LINKS
BS EN 140401:2009 Blank Detail Specification. Fixed low power film surface mount (SMD) resistors
I.S. EN 133000:1998 PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (GENERIC SPECIFICATION)
EN IEC 62246-1-1:2018 Reed switches - Part 1-1: Generic specification - Blank detail specification
EN IEC 61643-331:2018 Components for low-voltage surge protective devices - Part 331: Performance requirements and test methods for metal oxide varistors (MOV)
NF EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
PREN ISO 9455-10 : DRAFT 2011 SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD
I.S. EN 62884-1:2017 MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT
CEI EN 60068-2-83 : 2012 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
ISO 7587:1986 Electroplated coatings of tin-lead alloys — Specification and test methods
I.S. EN 62149-4:2010 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION
I.S. EN 60393-1:2009 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 60068-2-54:2006 ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
I.S. EN 62149-6:2003 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 6: 650-NM 250-MBIT/S PLASTIC OPTICAL FIBRE TRANSCEIVERS
IEC 60115-1:2008 Fixed resistors for use in electronic equipment - Part 1: Generic specification
IEC 60115-8:2009 Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
IEC 61196-2:1995 Radio-frequency cables - Part 2: Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene (PTFE) insulation
IEC PAS 60747-17:2011 Semiconductor devices - Discrete devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation
I.S. EN 61984:2009 CONNECTORS - SAFETY REQUIREMENTS AND TESTS
IEC PAS 62246-2-1:2008 Reed contact units - Part 2-1: Heavy-duty reed switches - Quality assessment specification
I.S. EN 62319-1:2005 POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
IEC 61058-1 REDLINE : 4ED 2016 SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS
IEC 61196-9-1:2015 Coaxial communication cables - Part 9-1: Flexible RF coaxial cables - Blank detail specification
IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
IEC 60838-1:2016+AMD1:2017 CSV Miscellaneous lampholders - Part 1: General requirements and tests
I.S. EN 61189-3:2008 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
I.S. EN 60938-1:1999 FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION
I.S. EN 60838-2-1:1997 MISCELLANEOUS LAMPHOLDERS - PART 2: PARTICULAR REQUIREMENTS - SECTION 1: LAMPHOLDERS S14
I.S. EN 61249-8-8:1999 MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER
IEC 61051-1:2007 Varistors for use in electronic equipment - Part 1: Generic specification
I.S. EN 60115-1:2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
IEC 60238:2016+AMD1:2017 CSV Edison screw lampholders
I.S. EN 62211:2017 INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
I.S. EN 61747-5:1999 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS
EN 140200 : 1996 AMD 1 2001 FIXED POWER RESISTORS (SECTIONAL SPECIFICATION)
NF EN 61810-1 : 2015 ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS
DIN EN 14436 E : 2004 COPPER AND COPPER ALLOYS - ELECTROLYTICALLY TINNED STRIP
IEC 60368-1:2000+AMD1:2004 CSV Piezoelectric filters of assessed quality - Part 1: Genericspecification
IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
BS EN 61191-4:2017 Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types
BS EN 14436:2004 Copper and copper alloys. Electrolytically tinned strip
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IEC 61881-3:2012+AMD1:2013 CSV Railway applications - Rolling stock equipment - Capacitors forpower electronics - Part 3: Electric double-layer capacitors
IEC 61643-311:2013 Components for low-voltage surge protective devices - Part 311: Performance requirements and test circuits for gas discharge tubes (GDT)
IEC 61249-8-7:1996 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
IEC 61337-1:2004 Filters using waveguide type dielectric resonators - Part 1: Generic specification
IEC 60068-2-83:2011 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
BS EN ISO 9455-17:2006 Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues
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EN 60749-15:2010/AC:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 61007:1997 Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures
EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
EN ISO 4521 : 2008 METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS
UNI EN ISO 9455-10 : 2012 SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD
IEC 61811-1:2015 Electromechanical telecom elementary relays of assessed quality - Part 1: Generic specification and blank detail specification
EN ISO 27874:2008 Metallic and other inorganic coatings - Electrodeposited gold and gold alloy coatings for electrical, electronic and engineering purposes - Specification and test methods (ISO 27874:2008)
EN 60249-1 : 1993 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS
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05/30137416 DC : 0
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NF EN 60252-1 : 2011 AMD 1 2014 AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION
BS EN 62435-2:2017 Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms
12/30260802 DC : 0 BS EN 62391-1 - FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
07/30149142 DC : 0 BS IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
NF EN 60115-8 : 2013 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
CAN/CSA-C22.2 NO. 60947-7-4:18 Low-voltage switchgear and controlgear ? Part 7-4: Ancillary equipment ? PCB terminal blocks for copper conductors (Trinational standard with NMX-J-538/7-4-ANCE and UL 60974-7-4)
BS EN 62149-9:2014 Fibre optic active components and devices. Performance standards Seeded reflective semiconductor optical amplifier transceivers
I.S. EN 62435-1:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
I.S. EN 143000:1994 THERMISTORS (GENERIC SPECIFICATION)
BS CECC 40100:1981 Harmonized system of quality assessment for electronic components: sectional specification: fixed low power non-wirewound resistors
BS EN 140203:1997 Harmonized system of quality assessment for electronic components. Blank detail specification: fixed power resistors (Assessment level H)
I.S. EN 60684-2:2011 FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST (IEC 60684-2:2011)
BS EN 60169-21:1997 Radio-frequency connectors Two types of radio-frequency connectors with inner diameter of outer conductor 9,5 mm (0,374 in) with different versions of screw coupling. Characteristic impedance 50 ohms (types SC-A and SC-B)
03/103740 DC : DRAFT FEB 2003 IEC 61337-1 ED.1 - FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
CEI EN 60169-21 : 1998 RADIO-FREQUENCY CONNECTORS - PART 21: TWO TYPES OF RADIO-FREQUENCY CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 9,5 MM (0,374 IN) WITH DIFFERENT VERSIONS OF SCREW COUPLING CHARACTERISTIC IMPEDANCE 50 OHMS (TYPES SC-A AND SC-B)
17/30363106 DC : DRAFT SEP 2017 BS IEC 63138-1 ED.1.0 - MULTI-RADIO FREQUENCY CHANNEL CONNECTORS - PART 1: GENERIC SPECIFICATION-GENERAL REQUIREMENTS AND MEASURING METHODS
CEI EN 60947-7-4 : 2014 LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS
07/30168484 DC : 0 BS EN 60749-20 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
14/30280850 DC : 0 BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
08/30186808 DC : DRAFT JULY 2008 BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS
DD CLC/TS 50466:2006 Long duration storage of electronic components. Specification for implementation
BS EN 140201:1997 Harmonized system of quality assessment for electronic components. Blank detail specification: fixed power resistors (Assessment level S)
BS 123500-003:2001 System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
BS CECC 40301:1988 Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Fixed precision resistors
13/30277857 DC : 0 BS EN 62149-9 ED 1.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS
BS EN 60068-3-13:2016 Environmental testing Supporting documentation and guidance on Test T. Soldering
BS EN 140401-802 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
12/30259014 DC : 0 BS EN 60127-6 - MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE FUSE-LINKS
CEI EN 60512-12-6 : 1997 ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT/ BASIC TESTING PROCEDURES AND MEASURING METHODS - PART 12: SOLDERING TESTS - SECTION 6: TEST 12F: SEALING AGAINST FLUX AND CLEANING SOLVENTS IN MACHINE SOLDERING
BS EN 61270-1:1998 Capacitors for microwave ovens General
BS EN 60512-12-2:2006 Connectors for electronic equipment. Tests and measurements Soldering tests. Test 12b. Solderability, wetting, soldering iron method
10/30234015 DC : 0 BS EN 62246-1-1 ED.1 - REED SWITCHES - PART 1-1: QUALITY ASSESSMENT SPECIFICATION
UNE-EN 60947-7-4:2014 Low-voltage switchgear and controlgear - Part 7-4: Ancillary equipment - PCB terminal blocks for copper conductors
IEC 61045-1:1991 Fixed film resistor networks for use in electronic equipment - Part 1: Generic specification
13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
I.S. EN 62025-2:2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
I.S. EN 62739-3:2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS
I.S. EN 60252-1:2011 AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION (IEC 60252-1:2010 (EQV))
CEI EN 62314 : 2007 SOLID-STATE RELAYS
CEI EN 61051-1 : 2010 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS EN 61071:2007 Capacitors for power electronics
BS EN 61007:1997 Transformers and inductors for use in electronic and telecommunication equipment. Measuring methods and test procedures
BS EN 61248-5:1997 Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for pulse transformers on the basis of the capability approval procedure
BS EN 62025-2:2005 High frequency inductive components. Non-electrical characteristics and measuring methods Test methods for non-electrical characteristics
NF EN 62326 4-1 : 1998 PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION PERFORMANCE LEVELS A, B AND C
BS EN 61248-1:1997 Transformers and inductors for use in electronic and telecommunication equipment Generic specification
BS EN IEC 62246-1-1:2018 Reed switches Generic specification. Blank detail specification
BS EN 60115-8-1:2015 Fixed resistors for use in electronic equipment Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
DIN EN 60252 : 1994 CAPACITORS - MOTOR CAPACITORS
CEI 48-15 : 1998 FLAT, QUICK-CONNECT TERMINATIONS
CEI EN 60749-20 : 2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
09/30209389 DC : 0 BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E
06/30149145 DC : DRAFT OCT 2006 IEC 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
EN IEC 61076-3-119:2018 Connectors for electrical and electronic equipment - Product requirements - Part 3-119: Rectangular connectors - Detail specification for shielded and unshielded, free and fixed 10-way connectors with push-pull coupling for industrial environments for data transmission with frequencies up to 100 MHz
11/30206085 DC : 0 BS EN 60947-7-4 - LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PRINTED BOARD TERMINAL BLOCKS FOR COPPER CONDUCTORS
BS EN 60068-2-82:2007 Environmental testing Tests. Test Tx. Whisker test methods for electronic and electric components
BS EN 61249-8-8:1997 Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings
BS EN 61337-2:2004 Filters using waveguide type dielectric resonators Guide for use
08/30193715 DC : 0 BS EN 62246-1 ED.2 - REED SWITCHES - PART 1: GENERIC SPECIFICATION
02/208665 DC : DRAFT SEP 2002 IEC 62319-1 ED.1.0 - POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
NF EN 61204-6 : 2001 LOW-VOLTAGE POWER SUPPLIES, DC OUTPUT - PART 6: REQUIREMENTS FOR LOW-VOLTAGE POWER SUPPLIES ASSESSED PERFORMANCE
BS EN 123400:1992 Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections
BS EN 130000:1994 Harmonized system of quality assessment for electronic components. Generic specification: fixed capacitors
BS EN 62319-1:2005 Polymeric thermistors. Directly heated positive step function temperature coefficient Generic specification
NF EN 60252-2 : 2011 AMD 1 2014 AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS
BS EN 60122-1 : 2002 QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
BS EN 61643-331:2003 Low voltage surge protective devices Specification for metal oxide varistors (MOV)
08/30193881 DC : 0 BS EN 60939-1 ED.3 - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION
PD 6521:1988 Summaries of test methods for environmental testing of electrotechnical products
BS EN 61196-2:2003 Radio-frequency cables. Specifications. Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene (PTFE) insulation
BS EN 60749-20:2009 Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
NF EN 61071 : 2007 CAPACITORS FOR POWER ELECTRONICS
BS EN 61248-2:1997 Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for signal transformers on the basis of the capability approval procedure
BS EN 61810-7:2006 Electromechanical elementary relays Test and measurement procedures
UL 60947-7-4:1ED 2018-04 Low-Voltage Switchgear and Controlgear - Part 7-4: Ancillary equipment - PCB terminal blocks for copper conductors
I.S. EN 61797-1:1998 TRANSFORMERS AND INDUCTORS FOR USE IN TELECOMMUNICATION AND ELECTRONIC EQUIPMENT - MAIN DIMENSIONS OF COIL FORMERS - PART 1: COIL FORMERS FOR LAMINATED CORES
I.S. EN 60169-21:1999 RADIO-FREQUENCY CONNECTORS - PART 21: TWO TYPES OF RADIO-FREQUENCY CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 9,5 MM (0,374 IN) WITH DIFFERENT VERSIONS OF SCREW COUPLING - CHARACTERISTIC IMPEDANCE 50 OHMS (TYPES SC-A AND SC-B)
IEC 61178-1:1993 Quartz crystal units - A specification in the IEC Quality Assessment System for Electronic Components (IECQ) - Part 1: Generic specification
IEC 61020-3:1991 Electromechanical switches for use in electronic equipment - Part 3: Sectional specification for in-line package switches
CEI EN 62319-1 : 2005 POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
BS EN 170000:1999 Harmonized system of quality assessment for electronic components. Generic specification: waveguide type dielectric resonators
NF EN 62739-1 : 2014 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING
I.S. EN 61007:1998 TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES
NF EN ISO 4521 : 2008 METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS
EN 61810-1:2015/AC:2018-04 ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS (IEC 61810-1:2015/COR1:2018)
I.S. EN IEC 62246-1-1:2018 REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - BLANK DETAIL SPECIFICATION
I.S. EN 61760-3:2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
I.S. EN 165000-1:1998 FILM AND HYBRID INTEGRATED CIRCUITS - PART 1: GENERIC SPECIFICATION CAPABILITY APPROVAL PROCEDURE
I.S. EN 134000:1994 GENERIC SPECIFICATION: VARIABLE CAPACITORS (QUALIFICATION APPROVAL AND CAPABILITY APPROVAL)
I.S. EN 60068-3-13:2016 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
I.S. EN 61643-312:2013 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (IEC 61643-312:2013 (EQV) + CORRIGENDUM JUL. 2013 (EQV))
I.S. EN 61189-5-4:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
I.S. EN 60749-15:2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
BS CECC 40103:1988 Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Fixed low power non-wirewound resistors. Assessment level P
CEI EN 60068-2-54 : 2007 ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
EN IEC 60810:2018 Lamps, light sources and led packages for road vehicles - Performance requirements
CEI EN 60512-12-7 : 2002 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-7: SOLDERING TESTS - TEST 12G: SOLDERABILITY, WETTING BALANCE METHOD
I.S. CECC 33000:1994 PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (GENERIC SPECIFICATION)
BS EN 60947-7-4:2013 Low-voltage switchgear and controlgear Ancillary equipment. PCB terminal blocks for copper conductors
CEI EN 62246-1-1 : 2014 REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT
EN 140401-802:2007/A3:2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
I.S. EN 62246-1:2015 REED SWITCHES - PART 1: GENERIC SPECIFICATION
CEI EN 60749-15 : 2012 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
DIN EN 60068-2-69 : 2007 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
CEI EN 61810-7 : 2006 ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES
EN 60384-1:2016 Fixed capacitors for use in electronic equipment - Part 1: Generic specification
IEC 60300-3-5:2001 Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles
I.S. EN 60127-2:2014 MINIATURE FUSES - PART 2: CARTRIDGE FUSE-LINKS
IEC 61071:2017 Capacitors for power electronics
I.S. EN 61020-1:2009 ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
IEC 61337-1-2:1999 Filters using waveguide type dielectric resonators - Part 1-2: Test conditions
I.S. EN 140101:2008 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS
I.S. EN 60838-1:2017 MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS
I.S. EN 140401-802:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
I.S. EN 140401-803:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
I.S. EN 62391-1:2016 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 61169-1:2013 RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 62884-1:2017 Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement
IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60326-10:1991 Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections
IEC 60326-11:1991 Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections
I.S. EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
IEC 61007:1994 Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures
IEC 60115-2:2014 Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors
IEC 61196-8:2012 Coaxial communication cables - Part 8: Sectional specification for semi-flexible cables with polytetrafluoroethylene (PTFE) dielectric
EN 61169-1:2013/AC:2016-02 RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS (IEC 61169-1:2013)
EN 60938-1:1999/A1:2007 FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION
EN 60539-1:2016/AC:2017-09 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017)
EN 60115-1:2011/A11:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
DIN EN ISO 9455-2:1995-11 SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD
16/30350012 DC : 0 BS EN 60810 - LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
IEC 60738-1:2006+AMD1:2009 CSV Thermistors - Directly heated positive temperature coefficient -Part 1: Generic specification
IEC 60938-1:1999+AMD1:2006 CSV Fixed inductors for electromagnetic interference suppression - Part 1: Generic specification
IEC 60689:2008 Measurement and test methods for tuning fork quartz crystal units in the range from 10 kHz to 200 kHz and standard values
IEC 61248-6:1996 Transformers and inductors for use in electronic andtelecommunication equipment - Part 6: Sectional specification forinductors on the basis of the capability approval procedure
BS EN 61984:2009 Connectors. Safety requirements and tests
ISO 9455-2:1993 Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method
ISO 4521:2008 Metallic and other inorganic coatings — Electrodeposited silver and silver alloy coatings for engineering purposes — Specification and test methods
IEC 60512-12-5:2006 Connectors for electronic equipment - Tests and measurements - Part 12-5: Soldering tests - Test 12e: Resistance to soldering heat, soldering iron method
IEC 61984:2008 Connectors - Safety requirements and tests
IEC 60384-26-1:2010 Fixed capacitors for use in electronic equipment - Part 26-1: Blank detail specification - Fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte - Assessment level EZ
IEC 61797-1:1996 Transformers and inductors for use in telecommunication and electronic equipment - Main dimensions of coil formers - Part 1: Coil formers for laminated cores
15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 60384-1:2016 Fixed capacitors for use in electronic equipment - Part 1: Generic specification
05/30128512 DC : DRAFT JAN 2005 IEC 61984 ED.2 - CONNECTORS - SAFETY REQUIREMENTS AND TESTS
IEC 61811-53:2002 Electromechanical all-or-nothing relays - Part 53: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 14 mm x 9 mm base
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
IEC 61270-1:1996 Capacitors for microwave ovens - Part 1: General
IEC 61058-2-4:1995+AMD1:2003 CSV Switches for appliances - Part 2-4: Particular requirements for independently mounted switches
11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 62314:2006 Solid-state relays
IEC 61020-1:2009 Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification
IEC 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
IEC 61881-2:2012 Railway applications - Rolling stock equipment - Capacitors for power electronics - Part 2: Aluminium electrolytic capacitors with non-solid electrolyte
IEC 61881-1:2010 Railway applications - Rolling stock equipment - Capacitors for power electronics - Part 1: Paper/plastic film capacitors
IEC 60838-2-1:1994 Miscellaneous lampholders - Part 2: Particular requirements - Section 1: Lampholders S14
IEC 60939-1:2010 Passive filter units for electromagnetic interference suppression - Part 1: Generic specification
IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
IEC 60512-12-6:1996 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering
IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
ISO 9455-17:2002 Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
IEC 60684-2:2011 Flexible insulating sleeving - Part 2: Methods of test
IEC 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
IEC 60862-1:2015 Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification
IEC 60512-12-2:2006 Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method
BS EN 62149-6:2003 Fibre optic active components and devices. Performance standards 650-nm 250-Mbit/s plastic optical fibre transceivers
ISO 9455-10:2012 Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method
IEC 60947-7-4:2013 Low-voltage switchgear and controlgear - Part 7-4: Ancillary equipment - PCB terminal blocks for copper conductors
IEC 61169-8:2007 Radio-frequency connectors - Part 8: Sectional specification - RF coaxial connectors with inner diameter of outer conductor 6,5 mm (0,256 in) with bayonet lock - Characteristic impedance 50 Ω (type BNC)
IEC 61248-1:1996 Transformers and inductors for use in electronic and telecommunication equipment - Part 1: Generic specification
IEC 62149-9:2014 Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers
IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
IEC 61811-55:2002 Electromechanical all-or-nothing relays - Part 55: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 11 mm x 7,5 mm (max.) base
IEC 61811-51:2002 Electromechanical all-or-nothing relays - Part 51: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Non-standardized types and construction
IEC 61019-1:2004 Surface acoustic wave (SAW) resonators - Part 1: Generic specification
IEC 62391-1 : 2.0 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
IEC 61248-5:1996 Transformers and inductors for use in electronic andtelecommunication equipment - Part 5: Sectional specification forpulse transformers on the basis of the capability approvalprocedure
IEC 61811-52:2002 Electromechanical all-or-nothing relays - Part 52: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 20 mm x 10 mm base
IEC 60252-1:2010+AMD1:2013 CSV AC motor capacitors - Part 1: General - Performance, testing andrating - Safety requirements - Guidance for installation and operation
IEC 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
NF EN ISO 9455-16 : 2013 SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TESTS, WETTING BALANCE METHOD
IEC 60252-2:2010+AMD1:2013 CSV AC motor capacitors - Part 2: Motor start capacitors
IEC 61248-3:1996 Transformers and inductors for use in electronic andtelecommunication equipment - Part 3: Sectional specification forpower transformers on the basis of the capability approvalprocedure
BS EN 60810:2015 Lamps for road vehicles. Performance requirements
BS EN ISO 9455-10:2012 Soft soldering fluxes. Test methods Flux efficacy test, solder spread method
IEC 61811-54:2002 Electromechanical all-or-nothing relays - Part 54: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 15 mm x 7,5 mm base
IEC 61248-4:1996 Transformers and inductors for use in electronic andtelecommunication equipment - Part 4: Sectional specification forpower transformers for switched mode power supplies (SMPS) on thebasis of the capability approval procedure
IEC 61338-1:2004 Waveguide type dielectric resonators - Part 1: Generic specification
BS EN 140402-801:2015 Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2
UNE-EN 60400:2011 Lampholders for tubular fluorescent lamps and starterholders
IEC 60127-6:2014 Miniature fuses - Part 6: Fuse-holders for miniature fuse-links
BS EN 62435-5:2017 Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices
IEC 62149-4:2010 Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 60068-2-82:2007 Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
IEC 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 61248-2:1996 Transformers and inductors for use in electronic andtelecommunication equipment - Part 2: Sectional specification forsignal transformers on the basis of the capability approvalprocedure
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC 62025-2:2005 High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics
IEC 61337-2:2004 Filters using waveguide type dielectric resonators - Part 2: Guidance for use
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 60512-12-4:2006 Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method
EN 61811-1:2015 Electromechanical telecom elementary relays of assessed quality - Part 1: Generic specification and blank detail specification
EN 62326-4:1997 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
EN 61196-2:2003 Radio-frequency cables - Part 2: Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene (PTFE) insulation
EN 61811-52:2002 Electromechanical all-or-nothing relays - Part 52: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 20 mm x 10 mm base
EN 62739-1 : 2013 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013)
EN 60862-1:2015 Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification
EN ISO 9455-2:1995 Soft soldering fluxes - Test methods - Part 2: Determination of non-volatile matter, ebulliometric method (ISO 9455-2:1993)
EN ISO 9455-10:2012 Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012)
EN 14436:2004 Copper and copper alloys - Electrolytically tinned strip
EN 16602-70-10:2015 Space product assurance - Qualification of printed circuit boards
EN ISO 9455-17:2006 Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002)
EN ISO 9455-16:2013 Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013)
13/30294866 DC : 0 BS EN 61058-1 - SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS
BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices General
BS EN 60068-2-58 : 2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
17/30340059 DC : 0 BS EN 61076-3-119 - CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 3-119: RECTANGULAR CONNECTORS - DETAIL SPECIFICATION FOR UNSHIELDED, FREE AND FIXED 10 WAY CONNECTORS WITH PUSH-PULL COUPLING FOR INDUSTRIAL ENVIRONMENTS WITH FREQUENCIES UP TO 100 MHZ
BS EN 61811-1:2015 Electromechanical telecom elementary relays of assessed quality Generic specification and blank detail specification
BS EN 60512-12-4:2006 Connectors for electronic equipment. Tests and measurements Soldering tests. Test 12d. Resistance to soldering heat, solder bath method
BS 9752:1989 Blank detail specification for fixed insulated (unshielded) r.f. inductors suitable for surface mounting at the full assessment level
DD IEC/PAS 60747-17:2011 Semiconductor devices. Discrete devices Magnetic and capacitive coupler for basic and reinforced isolation
11/30243576 DC : DRAFT FEB 2011 BS EN 62643-1 - ELECTROSTATIC MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
02/209658 DC : DRAFT OCT 2002 IEC 60512-12-1, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-1 - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD
I.S. EN 60384-26-1:2010 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ
CEI EN 61071 : 2007 CAPACITORS FOR POWER ELECTRONICS
CEI EN 62391-1 : 2016 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
CEI EN 61270-1 : 1997 CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL
BS CECC 32100:1992 Harmonized system of quality assessment for electronic components. Sectional specification: fixed multilayer ceramic chip capacitors
CEI EN 60068-2-82 : 2008 ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS
CEI EN 60115-2 : 2016 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS
UNI EN ISO 27874 : 2008 METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS
17/30349734 DC : 0 BS EN 60384-26 ED.2.0 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
BS EN 62326-4-1:1997 Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
CEI EN 60684-2 : 2012 FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST
CEI EN 140401 : 2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
13/30294204 DC : 0 BS EN 60238 - EDISON SCREW LAMPHOLDERS
BS EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards)
BS EN 60393-1:2009 Potentiometers for use in electronic equipment Generic specification
BS EN 60115-8:2012 Fixed resistors for use in electronic equipment Sectional specification. Fixed surface mount resistors
CEI EN 138000 : 1996 GENERIC SPECIFICATION: FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (INDUCTORS FOR WHICH SAFETY TESTS ARE REQUIRED)
BS 6201-2:1982 Fixed capacitors for use in electronic equipment. Specification for fixed capacitors of ceramic dielectric, Class 2. Selection of methods of test and general requirements
BS CECC43002(1984) : 1984 AMD 7379 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS
03/308375 DC : DRAFT JUNE 2003 IEC 61196-1 - COAXIAL COMMUNICATION CABLES - PART 1: GENERIC SPECIFICATION - GENERAL, DEFINITIONS AND REQUIREMENTS
CEI EN 60115-8 : 2013 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
BS EN 61020-1:2009 Electromechanical switches for use in electrical and electronic equipment Generic specification
08/30192301 DC : 0 BS EN 60384-26 ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
I.S. EN 61810-1:2015 ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS
CEI EN 60512-12-2 : 2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-2: SOLDERING TESTS - TEST 12B: SOLDERABILITY, WETTING, SOLDERING IRON METHOD
IEEE C62.33-1982 IEEE Standard Test Specifications for Varistor Surge-Protective Devices
10/30184598 DC : 0 BS EN 61643-312 ED 1.0 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: PERFORMANCE SPECIFICATION FOR GAS DISCHARGE TUBES (GDT)
BS ISO 9455-17 : 2002 AMD 16425 SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES
BS EN 62246-1:2015 Reed switches Generic specification
BS CECC43004(1984) : 1984 AMD 1992 SPEC FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS (ROD TYPE)
13/30286163 DC : 0 BS EN 62435-2 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2 - DETERIORATION MECHANISMS
12/30265027 DC : 0 BS EN 61196-9 ED.1 - COAXIAL COMMUNICATION CABLES - PART 9: SECTIONAL SPECIFICATION FOR FLEXIBLE RF COAXIAL CABLES
IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
IEC 60393-1:2008 Potentiometers for use in electronic equipment - Part 1: Generic specification
I.S. EN 60115-2:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS
I.S. EN 60249-1:1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS
16/30338642 DC : 0 BS EN 62739-3 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHOD
CEI EN 61643-331 : 2005 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 331: SPECIFICATION FOR METAL OXIDE VARISTORS (MOV)
CEI EN 61249-8-7 : 1997 MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS
BS EN 61248-7:1998 Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for high-frequency inductors and intermediate transformers on the basis of the capability approval procedure
BS EN 60068-2-69:2017 Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
11/30213136 DC : 0 BS EN ISO 9455-16 - SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD
11/30234673 DC : 0 BS EN ISO 9455-10 - SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD
BS EN 62149-4:2010 Fibre optic active components and devices. Performance standards 1300 nm fibre optic transceivers for Gigabit Ethernet application
I.S. EN 60068-2-44:1997 ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING
I.S. EN 61248-2:1998 TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 2: SECTIONAL SPECIFICATION FOR SIGNAL TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE
BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
BS EN 61248-4:1997 Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for power transformers for switched mode power supplies (SMPS) on the basis of the capability approval procedure
BS CECC43001(1984) : 1984 AMD 7378 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS
CEI EN 60068-2-69 : 2008 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
DIN EN 61881 : 2000 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS
CEI EN 60539-1 : 2009 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
NF EN 60238 : 2005 AMD 2 2011
I.S. EN 60939-3:2015 PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE
I.S. EN 60934:2001 CIRCUIT BREAKERS FOR EQUIPMENT (CBE) (IEC 60934:2000 (EQV))
I.S. EN 61189-5-3:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
I.S. EN 61811-54:2002 ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 54: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 15 MM X 7,5 MM BASE
I.S. EN 61811-53:2002 ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 53: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 14 MM X 9 MM BASE
NF EN 61249 8-7 : 1997 MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND LINKS
I.S. EN IEC 61076-3-119:2018 CONNECTORS FOR ELECTRICAL AND ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 3-119: RECTANGULAR CONNECTORS - DETAIL SPECIFICATION FOR SHIELDED AND UNSHIELDED, FREE AND FIXED 10-WAY CONNECTORS WITH PUSH-PULL COUPLING FOR INDUSTRIAL ENVIRONMENTS FOR DATA TRANSMISSION WITH FREQUENCIES UP TO 100 MHZ
I.S. EN 61881-2:2012 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE (IEC 61881-2:2012 (EQV))
IEEE C62.35-2010 IEEE Standard Test Methods for Avalanche Junction Semiconductor Surge-Protective Device Components
I.S. EN 60384-26:2010 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
I.S. EN 60127-4:2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV))
I.S. EN 60749-20:2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
BS EN 140101-806 : 2008 DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS
I.S. EN 60122-1:2002 AMD 1 2018 QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
I.S. EN 61270-1:1999 CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL
I.S. EN 61248-6:1998 TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 6: SECTIONAL SPECIFICATION FOR INDUCTORS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE
I.S. EN 60862-1:2015 SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
I.S. EN 62326-20:2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
I.S. EN 62149-9:2014 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS
I.S. EN 61189-5-2:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
I.S. EN 61811-1:2015 ELECTROMECHANICAL TELECOM ELEMENTARY RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION
IEC 62149-6:2003 Fibre optic active components and devices - Performance standards - Part 6: 650-nm 250-Mbit/s plastic optical fibre transceivers
IEC 61196-1:2005 Coaxial communication cables - Part 1: Generic specification - General, definitions and requirements
I.S. EN 61169-8:2007 RADIO-FREQUENCY CONNECTORS - PART 8: SECTIONAL SPECIFICATION - RF COAXIAL CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 6,5 MM (0,256 IN) WITH BAYONET LOCK - CHARACTERISTICS IMPEDANCE 50 OHMS (TYPE BNC)
I.S. EN 60068-2-21:2006 ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
NF EN 62319-1 : 2005 POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
NF EN 60127-4 : 2005 AMD 2 2013 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
UNE-EN ISO 27874:2010 Metallic and other inorganic coatings - Electrodeposited gold and gold alloy coatings for electrical, electronic and engineering purposes - Specification and test methods (ISO 27874:2008)
IEC 60238:2016 RLV Edison screw lampholders
BIS IS 15934-5 : 2011 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS
CEI EN 60939-1 : 2011 PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION
CEI EN 60512-12-4 : 2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS -PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD
EN 60838-1:2017/A1:2017 MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS (IEC 60838-1:2016/A1:2017)
I.S. EN 60947-7-4:2013 LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS (IEC 60947-7-4:2013 (EQV))
CEI EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
I.S. EN 61811-52:2002 ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 52: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 20 MM X 10 MM BASE
I.S. EN 61811-55:2002 ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 55: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 11 MM X 7,5 MM (MAX.) BASE
IEC 60748-23-1:2002 Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
IEC 61058-1:2016 Switches for appliances - Part 1: General requirements
I.S. EN 62314:2006 SOLID-STATE RELAYS
I.S. EN 140401:2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
I.S. EN 61643-331:2003 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 331: SPECIFICATION FOR METAL OXIDE VARISTORS (MOV)
IEC 60238 REDLINE : 9ED 2016 EDISON SCREW LAMPHOLDERS
IEC 61019-1-2:1993 Surface acoustic wave (SAW) resonators - Part 1: General information, standard values and test conditions - Section 2: Test conditions
I.S. EN 116000-3:1998 GENERIC SPECIFICATION: ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 3: TEST AND MEASUREMENT PROCEDURES
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
I.S. EN 60068-2-58:2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
IEC 60384-1 REDLINE : 5ED 2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 60539-1:2016 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
IEC 60748-23-3:2002 Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report
EN 140401-803 : 2007 AMD 3 2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
EN 140101-806 : 2008 COR 2014 DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS
EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61810-7:2006 Electromechanical elementary relays - Part 7: Test and measurement procedures
IEC 60512-12-1:2006 Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method
IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
IEC 61881:1999 Railway applications - Rolling stock equipment - Capacitors for power electronics
IEC 62922:2016 Organic light emitting diode (OLED) panels for general lighting - Performance requirements
ISO 27874:2008 Metallic and other inorganic coatings — Electrodeposited gold and gold alloy coatings for electrical, electronic and engineering purposes — Specification and test methods
IEC 60934:2000+AMD1:2007+AMD2:2013 CSV Circuit-breakers for equipment (CBE)
ISO 9455-16:2013 Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method
IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC TS 62861:2017 Guidelines for principal component reliability testing for LED light sources and LED luminaires
EN 62211:2017 Inductive components - Reliability management
EN 61248-7:1997 Transformers and inductors for use in electronic and telecommunication equipment - Part 7: Sectional specification for high-frequency inductors and intermediate frequency transformers on the basis of the capability approval procedure
EN 61338-2:2004 Waveguide type dielectric resonators - Part 2: Guidelines for oscillator and filter applications
EN 61811-55:2002 Electromechanical all-or-nothing relays - Part 55: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 11 mm x 7,5 mm (max.) base
EN 61249-8-8:1997 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
EN 61248-6:1997 Transformers and inductors for use in electronic and telecommunication equipment - Part 6: Sectional specification for inductors on the basis of the capability approval procedure
EN 61169-8:2007 Radio-frequency connectors - Part 8: Sectional specification - RF coaxial connectors with inner diameter of outer conductor 6,5 mm (0,256 in) with bayonet lock - Characteristic impedance 50 ohms (type BNC)
EN 61881:1999 Railway applications - Rolling stock equipment - Capacitors for power electronics
EN 60512-12-5:2006/corrigendum:2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-5: SOLDERING TESTS - TEST 12E: RESISTANCE TO SOLDERING HEAT, SOLDERING IRON METHOD
EN 61747-10-1:2013 Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods – Mechanical
EN 61984:2009 Connectors - Safety requirements and tests
EN 61811-53:2002 Electromechanical all-or-nothing relays - Part 53: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 14 mm x 9 mm base
EN 61270-1:1996 Capacitors for microwave ovens - Part 1: General
EN 60934:2001/A2:2013 CIRCUIT BREAKERS FOR EQUIPMENT (CBE) (IEC 60934:2000/A2:2013)
EN 119000 : 1996 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION: DRY AND MERCURY WETTED REED CONTACT UNITS
EN 60252 : 94 AC 94 A.C. MOTOR CAPACITORS
EN 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
EN 62149-4:2010 Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application
EN 61248-1 : 1997 Transformers and inductors for use in electronic and telecommunication equipment - Part 1: Generic specification
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
EN 60122-1:2002/A1:2018 QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION (IEC 60122-1:2002/A1:2017)
EN 61643-311:2013 Components for low-voltage surge protective devices - Part 311: Performance requirements and test circuits for gas discharge tubes (GDT)
IEC 61071:2017 RLV Capacitors for power electronics
EN 60115-8:2012 Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
EN 60238 : 2004 AMD 2 2011 EDISON SCREW LAMPHOLDERS (IEC 60238:2004/A2:2011)
EN 60368-1:2000/A1:2004 PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
EN 60512-12-2:2006/corrigendum Dec. 2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-2: SOLDERING TESTS - TEST 12B: SOLDERABILITY, WETTING, SOLDERING IRON METHOD
EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
EN 60127-2:2014 Miniature fuses - Part 2: Cartridge fuse-links
EN 62246-1-1:2013 Reed switches - Part 1-1: Generic specification - Quality assessment
EN 60252-2 : 2011 AMD 1 2013 AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS (IEC 60252-2:2010/A1:2013)
EN 60068-2-83 : 2011 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011)
DIN EN 14436:2004-11 Copper and copper alloys - Electrolytically tinned strip
EN 61810-7:2006 Electromechanical elementary relays - Part 7: Test and measurement procedures
EN 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
EN 165000-1:1996 Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure
EN 61071:2007 Capacitors for power electronics
EN 143000 : 1991 THERMISTORS (GENERIC SPECIFICATION)
DIN EN ISO 4521:2009-01 METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS
EN 116000-3 : 1996 GENERIC SPECIFICATION: ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 3: TEST AND MEASUREMENT PROCEDURES
EN 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
EN 137000:1995 Generic Specification: Fixed aluminium electrolytic a.c. capacitors with non-solid electrolyte for use with motors
EN 61881-3:2012/A1:2013 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS (IEC 61881-3:2012/A1:2013)
OVE/ONORM EN 62025-2 : 2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
EN 60512-12-7:2001 Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method
EN 60512-12-4:2006/corrigendum:2006 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD
EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
EN 61338-1:2005 Waveguide type dielectric resonators - Part 1: Generic specification
EN 60068-2-82:2007 Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
EN 60115-8-1:2015 Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
EN 60068-2-58:2015/A1:2018 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017)
EN 62391-1:2016/AC:2016-12 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 62391-1:2015/COR1:2016)
EN 140100:2008 Sectional Specification: Fixed low power film resistors
EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
EN 60947-7-4 : 2013 LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS (IEC 60947-7-4:2013)
EN 60127-6:2014 Miniature fuses - Part 6: Fuse-holders for miniature fuse-links
EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
EN 62149-9:2014 Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers
EN 62314 : 2006 SOLID-STATE RELAYS
EN 60512-12-1:2006 Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method
EN 60393-1:2009 Potentiometers for use in electronic equipment - Part 1: Generic specification
EN 62025-2:2005 High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics
EN 61337-2:2004 Filters using waveguide type dielectric resonators - Part 2: Guidance for use
EN 60384-26 : 2010 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
EN 60749 : 99 AMD 2 2001 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS
EN 61020-1:2009 Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification
EN 61248-3:1997 Transformers and inductors for use in electronic and telecommunication equipment - Part 3: Sectional specification for power transformers on the basis of the capability approval procedure
EN 61248-5:1997 Transformers and inductors for use in electronic and telecommunication equipment - Part 5: Sectional specification for pulse transformers on the basis of the capability approval procedure
EN 61643-312 : 2013 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (IEC 61643-312:2013 + CORRIGENDUM JUL. 2013)
EN 140000 : 1993 GENERIC SPECIFICATION: FIXED RESISTORS
CSA E60384.1 : 2014 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
CSA C22.2 No. 61058.1 : 2009 SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS
I.S. EN ISO 9455-17:2006 SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES
CSA C22.2 No. 61058.1 : 2009 : R2014 SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS
BS CECC 30000:1992 Harmonized system of quality assessment for electronic components. Generic specification: fixed capacitors
BS CECC 30000:1984 Harmonized system of quality assessment for electronic components: generic specification: fixed capacitors
BS 2011-2.2T:1981 Environmental testing. Guidance Test T. Guidance on Test T: soldering
ONORM EN ISO 9455-17 : 2006 SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES
CSA C22.2 No. 61058.1 : 2009 : INC : UPD 1 : 2013 SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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