NF EN 60384-26 : 2011
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FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
BS EN 61337-1:2004
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Filters using waveguide type dielectric resonators Generic specification |
BS EN 140200:1997
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Harmonized system of quality assessment for electronic components. Sectional specification: fixed power resistors |
BS EN 60068-1:2014
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Environmental testing General and guidance |
BS IEC 61189-5-4 : 2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
ISO 2093:1986
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Electroplated coatings of tin — Specification and test methods |
16/30353588 DC : 0
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BS EN 61020-1 ED 3.0 - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
UNI EN ISO 4521 : 2008
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METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
02/206181 DC : DRAFT MAY 2002
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IEC 61019-1. ED.1 - SURFACE ACOUSTIC WAVE RESONATORS (SAW) OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 60689:2009
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Measurement and test methods for tuning fork quartz crystal units in the range from 10 kHz to 200 kHz and standard values |
BS EN 60938-1:2000
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Fixed inductors for electromagnetic interference suppression Generic specification |
12/30274796 DC : 0
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BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX |
12/30274804 DC : 0
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BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE |
12/30258507 DC : 0
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BS EN 62575-1 - RADIO FREQUENCY (RF) BUK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
09/30173454 DC : 0
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BS EN 61881-1 - RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: REQUIREMENTS, TESTS AND GENERAL INFORMATION |
05/30138794 DC : DRAFT SEP 2005
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10/30235845 DC : 0
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BS EN 61881-3 - RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITOR FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS |
BS EN 61643-312:2013
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Components for low-voltage surge protective devices Selection and application principles for gas discharge tubes |
11/30253626 DC : 0
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BS EN 61196-2 ED.3 - COAXIAL COMMUNICATION CABLES - PART 2: SECTIONAL SPECIFICATION FOR SEMI-RIGID CABLES WITH POLYTERAFLUOROETHYLENE (PTFE) DIELECTRIC |
10/30211766 DC : 0
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BS EN 61881-3 - RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITOR |
BS IEC 60748-23-3:2002
|
Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Manufacturers\' self-audit checklist and report |
BS CECC 40200:1981
|
Harmonized system of quality assessment for electronic components: sectional specification: fixed power resistors |
BS EN 61051-1:2008
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Varistors for use in electronic equipment Generic specification |
13/30279642 DC : 0
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BS EN 61811-1 - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION |
BS CECC 16000-1:1992
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Harmonized system of quality assessment for electronic components. Generic specification: electromechanical all-or-nothing relays General |
NF EN 62314 : 2006
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SOLID-STATE RELAYS |
14/30311384 DC : 0
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BS EN 60115-2:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
BS EN 60384-26-1:2010
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Fixed capacitors for use in electronic equipment Blank detail specification. Fixed aluminum electrolytic capacitors with conductive polymer solid electrolyte. Assessment level EZ |
11/30258040 DC : 0
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BS EN 61810-1 - ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL REQUIREMENTS |
BS IEC 61189-5-2 : 2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
BS EN 62421:2007
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Electronics assembly technology. Electronic modules |
BS 6201-3:1982
|
Fixed capacitors for use in electronic equipment Specification for fixed capacitors for radio interference suppression. Selection of methods of test and general requirements |
BS CECC 22000:1980
|
Harmonized system of quality assessment for electronic components: generic specification: radio frequency coaxial connectors |
BS EN 171000:2001
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Harmonized system of quality assessment for electronic components. Generic specification. Filters using waveguide type dielectric resonators |
BS EN 61338-2:2004
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Waveguide type dielectric resonators Guidelines for oscillator and filter applications |
BS EN ISO 4521:2008
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Metallic and other inorganic coatings. Electrodeposited silver and silver alloy coatings for engineering purposes. Specification and test methods |
CEI EN 61881-1 : 2012
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RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS |
BS EN 140202:1997
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Harmonized system of quality assessment for electronic components. Blank detail specification: fixed power resistors (Assessment level M) |
BS EN 60939-1:2010
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Passive filter units for electromagnetic interference suppression Generic specification |
BS IEC 61196-9-1:2015
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Coaxial communication cables Flexible RF coaxial cables. Blank detail specification |
15/30325282 DC : 0
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BS EN 62884-1 - MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELETIRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
PREN ISO 9455-16 : DRAFT 2011
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SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
10/30240248 DC : 0
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BS EN 60862-1 - SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
CEI EN 61747-10-1 : 2014
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LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL |
BS EN 60749:1999
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Semiconductor devices. Mechanical and climatic test methods |
13/30286159 DC : 0
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BS EN 62435-1 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
BS EN 60512-12-5:2006
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Connectors for electronic equipment. Tests and measurements Soldering tests. Test 12e. Resistance to soldering heat, soldering iron method |
BS EN 61248-6:1997
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Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for inductors on the basis of the capability approval procedure |
10/30184592 DC : 0
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BS EN 61643-311 ED 2.0 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 311: TEST SPECIFICATION FOR GAS DISCHARGE TUBES |
BS EN 60127-2:2014
|
Miniature fuses Cartridge fuse-links |
04/30112662 DC : DRAFT APR 2004
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IEC 61810-7 ED.2 - ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
BS EN 60539-1:2016
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Directly heated negative temperature coefficient thermistors Generic specification |
IEC 61196-9:2014
|
Coaxial communication cables - Part 9: Sectional specification for RF flexible cables |
DIN EN 138000 : 1997
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GENERIC SPECIFICATION; FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (INDUCTORS FOR WHICH SAFETY TESTS ARE REQUIRED) |
BS EN 62884-1:2017
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Measurement techniques of piezoelectric, dielectric and electrostatic oscillators Basic methods for the measurement |
BS EN ISO 27874:2008
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Metallic coatings. Electrodeposited gold and gold alloy coatings for electrical, electronic and engineering purposes. Specification and test methods |
DD IEC PAS 62246-2-1 : DRAFT 2008
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REED CONTACT UNITS - PART 2-1: HEAVY-DUTY REED SWITCHES - QUALITY ASSESSMENT SPECIFICATION |
13/30286167 DC : 0
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BS EN 62435-5 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5 - DIE & WAFER DEVICES |
BS EN 61248-3:1997
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Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for power transformers on the basis of the capability approval procedure |
NF EN 60384-1 : 2016
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FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
03/104227 DC : DRAFT MAY 2003
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IEC 60393-6 ED.1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS |
BS EN 60384-1:2016
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Fixed capacitors for use in electronic equipment Generic specification |
05/30132097 DC : DRAFT JUNE 2005
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IEC 60679-1 ED 3 - QUARTZ CRYSTAL CONTROLLED OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 62211:2004
|
Inductive components. Reliability management |
BS EN 140101:2008
|
Blank Detail Specification. Fixed low power film resistors |
BS EN 61169-8:2007
|
Radio-frequency connectors Sectional specification. RF coaxial connectors with inner diameter of outer conductor 6,5 mm (0,256 in) with bayonet lock. Characteristic impedance 50 ohms (type BNC) |
07/30167467 DC : 0
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BS EN ISO 27874 - METALLIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
05/30135445 DC : DRAFT JUN 2005
|
IEC 61169-8 - RADIO-FREQUENCY CONNECTORS - PART 8: SECTIONAL SPECIFICATION - RF COAXIAL CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 6,5 MM (0,256 IN) WITH BAYONET LOCK - CHARACTERISTICS IMPEDANCE 50 OHMS (TYPE BNC) |
BS CECC43003(1984) : 1984 AMD 7380
|
SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS (DISC TYPE) |
UNE-EN 60252-1:2011
|
AC motor capacitors -- Part 1: General - Performance, testing and rating - Safety requirements - Guidance for installation and operation |
BS EN 61881-3 : 2012
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS |
BS EN 61881:2000
|
Railway applications. Rolling stock equipment. Capacitors for power electronics |
BS EN 165000-1:1996
|
Film and hybrid integrated circuits Generic specification. Capability approval procedure |
CEI EN 60068-2-21 : 2006
|
ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
BS EN 60127-6:2014
|
Miniature fuses Fuse-holders for miniature fuse-links |
BS CECC68000(1990) : AMD 9184
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION: QUARTZ CRYSTAL UNITS |
OVE/ONORM EN 61051-1 : 2009
|
VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC PAS 62435:2005
|
Electronic components - Long-duration storage of electronic components - Guidance for implementation |
I.S. EN 61811-51:2002
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 51: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - NON-STANDARDIZED TYPES AND CONSTRUCTION |
I.S. EN 168000:1994
|
QUARTZ CRYSTAL UNITS (GENERIC SPECIFICATION) |
I.S. EN 60738-1:2006
|
THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60689:2009
|
MEASUREMENT AND TEST METHODS FOR TUNING FORK QUARTZ CRYSTAL UNITS IN THE RANGE FROM 10 KHZ TO 200 KHZ AND STANDARD VALUES |
CEI EN 60689 : 2009
|
MEASUREMENT AND TEST METHODS FOR TUNING FORK QUARTZ CRYSTAL UNITS IN THE RANGE FROM 10 KHZ TO 200 KHZ AND STANDARD VALUES |
I.S. EN 61051-1:2008
|
VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60400:2017
|
LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS |
IEC 60838-1 REDLINE : 5ED 2016
|
MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS |
I.S. EN 61810-7:2006
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
CEI EN 60512-12-5 : 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-5: SOLDERING TESTS - TEST 12E: RESISTANCE TO SOLDERING HEAT, IRON METHOD |
I.S. EN 61643-311:2013
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 311: PERFORMANCE REQUIREMENTS AND TEST CIRCUITS FOR GAS DISCHARGE TUBES (GDT) (IEC 61643-311:2013 (EQV)) |
I.S. EN 140402:2015
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
I.S. EN 61881-1:2011
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS |
I.S. EN 60068-2-69:2017
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
I.S. EN 60068-1:2014
|
ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE |
I.S. EN 61248-5:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 5: SECTIONAL SPECIFICATION FOR PULSE TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
I.S. EN IEC 61643-331:2018
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTION - PART 331: PERFORMANCE REQUIREMENTS AND TEST METHODS FOR METAL OXIDE VARISTORS (MOV) |
BS EN 60838-1 : 2017
|
MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS (IEC 60838-1:2016) |
I.S. EN 140402-801:2015
|
DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
BS EN 60252-1 : 2011
|
AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION |
BS EN 60238 : 2004
|
EDISON SCREW LAMPHOLDERS |
IEC 62391-1:2015 RLV
|
Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification |
IEC 62391-1:2015
|
Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification |
NF EN 61249 5-4 : 1997
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS - SECTION 4: CONDUCTIVE INKS |
BS EN 60068-2-21:2006
|
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices |
NF EN 60939-3 : 2016
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE |
I.S. EN 60512-12-2:2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-2: SOLDERING TESTS - TEST 12B: SOLDERABILITY, WETTING, SOLDERING IRON METHOD |
I.S. EN ISO 27874:2008
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
I.S. EN 61248-1:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 62246-1-1:2013
|
REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT (IEC 62246-1-1:2013 (EQV)) |
I.S. EN 60127-6:2014
|
MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE FUSE-LINKS |
I.S. EN 60252-2:2011
|
AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS (IEC 60252-2:2010 (EQV)) |
CSA C22.2 No. 61058.1 : 2009 : R2014
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
IEC 61253-1:1993
|
Piezoelectric ceramic resonators - A specification in the IEC quality assessment system for electronic components (IECQ) - Part 1: Generic specification - Qualification approval |
NF EN 60068-2-58 : 2015
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
NF EN 60115-2 : 2015
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
I.S. EN 61248-7:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 7: SECTIONAL SPECIFICATION FOR HIGH-FREQUENCY INDUCTORS AND INTERMEDIATE FREQUENCY TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
I.S. EN 60939-1:2010
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
IEC 60249-3-3:1991
|
Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
EN 60068-2-21:2006
|
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
I.S. EN ISO 9455-16:2013
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
IEC 61643-331:2017
|
Components for low-voltage surge protective devices - Part 331: Performance requirements and test methods for metal oxide varistors (MOV) |
I.S. EN 61191-2:2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
I.S. EN ISO 9455-10:2012
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD (ISO 9455-10:2012) |
NF EN 62391-1 : 2018
|
FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
NF EN 60122-1 : 2003
|
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 16602-70-10:2015
|
Space product assurance. Qualification of printed circuit boards |
BS EN 61191-3:2017
|
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
PD IEC/TS 62861:2017
|
Guidelines for principal component reliability testing for LED light sources and LED luminaires |
UNI EN ISO 9455-16 : 2013
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
IEC 61747-5:1998
|
Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
IEC 62211:2017
|
Inductive components - Reliability management |
IEC 62246-1:2015
|
Reed switches - Part 1: Generic specification |
IEC 62319-1:2005
|
Polymeric thermistors - Directly heated positive step function temperature coefficient - Part 1: Generic specification |
IEC 60127-2:2014
|
Miniature fuses - Part 2: Cartridge fuse-links |
14/30309696 DC : 0
|
BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
UNE-EN 60749-15:2011
|
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
IEC 61191-4:2017
|
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
BS EN 61191-1:2013
|
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
BS EN ISO 9455-16:2013
|
Soft soldering fluxes. Test methods Flux efficacy test, wetting balance method |
IEC 61249-5-4:1996
|
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks |
IEC 60384-1:2016 RLV
|
Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
EN 61881-1:2011
|
Railway applications - Rolling stock equipment - Capacitors for power electronics - Part 1: Paper/plastic film capacitors |
EN 61337-1:2004
|
Filters using waveguide type dielectric resonators - Part 1: Generic specification |
EN 60384-26-1:2010
|
Fixed capacitors for use in electronic equipment - Part 26-1: Blank detail specification - Fixed aluminum electrolytic capacitors with conductive polymer solid electrolyte - Assessment level EZ |
NF EN 60749-20 : 2010
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
EN 61058-1:2002/A2:2008
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
EN 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
EN 61811-51:2002
|
Electromechanical all-or-nothing relays - Part 51: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Non-standardized types and construction |
EN 61643-331:2003
|
Components for low-voltage surge protective devices - Part 331: Specification for metal oxide varistors (MOV) |
EN 60810 : 2018
|
LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
EN 61019-1 : 2005
|
Surface acoustic wave (SAW) resonators - Part 1: Generic specification |
EN 61249-8-7:1996
|
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks |
EN 62246-1:2015
|
Reed switches - Part 1: Generic specification |
EN 61249-5-4:1996
|
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks |
EN 140402-801:2015
|
Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2 |
EN 60127-4:2005/A2:2013
|
Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types |
EN 134000:1994
|
Generic Specification: Variable capacitors (Qualification approval and capability approval) |
EN 62435-5:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
EN 60068-3-13:2016
|
Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
EN 61248-2:1997
|
Transformers and inductors for use in electronic and telecommunication equipment - Part 2: Sectional specification for signal transformers on the basis of the capability approval procedure |
EN 60939-1:2010
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
EN 60068-2-44:1995
|
Environmental testing - Part 2: Tests - Guidance on Test T: Soldering |
EN 60689:2009
|
Measurement and test methods for tuning fork quartz crystal units in the range from 10 kHz to 200 kHz and standard values |
EN 60684-2:2011
|
Flexible insulating sleeving - Part 2: Methods of test |
EN 140101:2008
|
Blank Detail Specification: Fixed low power film resistors |
CLC/TS 50466:2006
|
Long duration storage of electronic components - Specification for implementation |
EN 61797-1:1996
|
Transformers and inductors for use in telecommunication and electronic equipment - Main dimensions of coil formers - Part 1: Coil formers for laminated cores |
EN 61747-5:1998
|
Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
EN 61204-6:2001
|
Low-voltage power supplies, DC output - Part 6: Requirements for low-voltage power supplies of assessed performance |
EN 129000:1993/A1:1995
|
GENERIC SPECIFICATION - FIXED RF WOUND INDUCTORS |
EN 62149-6:2003
|
Fibre optic active components and devices - Performance standards - Part 6: 650-nm 250-Mbit/s plastic optical fibre transceivers |
NF EN 62025-2 : 2005
|
HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
EN 61051-1:2008
|
Varistors for use in electronic equipment - Part 1: Generic specification |
EN 60252-1 : 2011 AMD 1 2013
|
AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION (IEC 60252-1:2010/A1:2013) |
EN 61811-54:2002
|
Electromechanical all-or-nothing relays - Part 54: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 15 mm x 7,5 mm base |
EN 62435-1:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General |
EN 60738-1:2006/A1:2009
|
THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
EN 61189-5-4:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
EN 62326-4-1:1997
|
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C |
EN 60068-1:2014
|
Environmental testing - Part 1: General and guidance |
EN 60838-2-1:1996/A2:2004
|
MISCELLANEOUS LAMPHOLDERS - PART 2: PARTICULAR REQUIREMENTS - SECTION 1: LAMPHOLDERS S14 (IEC 60838-2-1:1994/A2:2004) |
EN 60512-12-6 : 1996
|
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering |
EN 60115-2:2015
|
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
EN 62878-1-1:2015
|
Device embedded substrate - Part 1-1: Generic specification - Test methods |
EN 61248-4:1997
|
Transformers and inductors for use in electronic and telecommunication equipment - Part 4: Sectional specification for power transformers for switched mode power supplies (SMPS) on the basis of the capability approval procedure |
EN 140401:2009
|
Blank Detail Specification: Fixed low power film surface mount (SMD) resistors |
EN 61189-5-3:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
I.S. EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
EN 61881-2 : 2012
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE (IEC 61881-2:2012) |
EN 140402:2015/A1:2016
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
EN 62319-1:2005
|
Polymeric thermistors - Directly heated positive step function temperature coefficient - Part 1: Generic specification |
EN 60169-21:1997
|
Radio-frequency connectors - Part 21: Two types of radio-frequency connectors with inner diameter of outer conductor 9,5 mm (0,374 in) with different versions of screw coupling - Characteristic impendance 50 ohms (types SC-A and SC-B) |
EN 61193-3:2013
|
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
EN 61191-3:2017
|
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
IPC S 804 : A1987
|
PRINTED WIRING BOARDS, SOLDERABILITY TEST METHODS FOR, |
EN 117000:1991
|
Generic Specification: Solid state all-or-nothing relays of assessed quality - Generic data and methods of test |
EN 168000 : 1993 AMD 2 1998
|
GENERIC SPECIFICATION - QUARTZ CRYSTAL UNITS |
BS CECC 00802:1991
|
Harmonized system of quality assessment for electronic components. Guidance document: CECC standard method for the specification of surface mounting components (SMDs) of assessed quality |
12/30268003 DC : 0
|
BS EN 60939-3 - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: HARMONIZED STANDARD FOR PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE |
BS EN 62739-3:2017
|
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods |
02/209660 DC : DRAFT OCT 2002
|
IEC 60512-12-3, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT BASIC TESTING AND MEASUREMENTS - PART 12-3 - TEST 12C: SOLDERABILITY, DE-WETTING |
BS EN 61747-5:1998
|
Liquid crystal and solid-state display devices Environmental, endurance and mechanical test methods |
04/30126718 DC : DRAFT DEC 2004
|
IEC 60189-1 ED.3 - LOW-FREQUENCY CABLES AND WIRES WITH PVC INSULATION AND PVC SHEATH - PART 1: GENERAL TEST AND MEASURING METHODS |
13/30278343 DC : 0
|
BS EN 62246-1 - REED SWITCHES - PART 1: GENERIC SPECIFICATION |
17/30352704 DC : 0
|
BS IEC 62149-10 ED1.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 10: ROF (RADIO OVER FIBER) TRANSCEIVERS FOR MOBILE FRONTHAUL |
BS IEC 61196-9:2014
|
Coaxial communication cables Sectional specification for RF flexible cables |
06/30157868 DC : 0
|
BS EN 60393-1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
NF EN 62246-1-1 : 2013
|
REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT |
BS CECC 43000(1982) : AMD 7315
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION: DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
UTEC 96 029 : 2011
|
ELECTRONIC COMPONENTS - LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDE FOR IMPLEMENTATION |
03/101947 DC : DRAFT FEB 2003
|
IEC 60939-1 ED.2.0 - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
BS EN 62326-20:2016
|
Printed boards Printed circuit boards for high-brightness LEDs |
BS EN 60512-12-7:2001
|
Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Soldering tests Test 12g. Solderability, wetting balance method - Section 7: Test 12g: Solderability, wetting balance method |
BS EN 62922:2017
|
Organic light emitting diode (OLED) panels for general lighting. Performance requirements |
15/30332490 DC : 0
|
BS EN 62211 - INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
02/203604 DC : DRAFT MAR 2002
|
IEC 61810-1. ED.2 - ELEMENTARY RELAYS - PART 1: SAFETY-RELATED AND GENERAL REQUIREMENTS |
BS EN 61189-5:2006
|
Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies |
IEC 61071 REDLINE : 2ED 2017
|
CAPACITORS FOR POWER ELECTRONICS |
07/30165180 DC : 0
|
BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE |
CEI EN 62149-4 : 2011
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
05/30129049 DC : DRAFT FEB 2005
|
IEC 62025-2 - HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
EN 60939-3:2015/AC:2016-04
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE (IEC 60939-3:2015/COR1:2016) |
BS EN 61338-1:2005
|
Waveguide type dielectric resonators Generic specification |
BS EN 60512-12-1:2006
|
Connectors for electronic equipment. Tests and measurements Soldering tests - Test 12a. Solderability, wetting, solder bath method |
11/30243259 DC : 0
|
BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
CEI EN 60384-26-1 : 2011
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ |
03/103741 DC : DRAFT FEB 2003
|
IEC 61338-1 ED.1 - WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
NF EN 61643-311 : 2014
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 311: PERFORMANCE REQUIREMENTS AND TEST CIRCUITS FOR GAS DISCHARGE TUBES (GDT) |
BS EN 62326-4:1997
|
Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification |
BS EN 62314:2006
|
Solid-state relays |
BS EN 60252:1994
|
A.C. motor capacitors |
BS EN 61169-1:2013
|
Radio-frequency connectors Generic specification. General requirements and measuring methods |
NF EN 60068-3-13 : 2016
|
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
10/30196657 DC : 0
|
BS EN 61881-2 - RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE |
IEC 60512-12-7:2001
|
Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method |
09/30203267 DC : 0
|
BS EN 60749-15 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
BS CECC 41200:1979
|
Harmonized system of quality assurance for electronic components: sectional specification: power potentiometers |
BS EN 60068-2-83:2011
|
Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste |
NF EN 61643-331 : 2003
|
COMPOSANTS POUR PARAFOUDRES BASSE TENSION - PARTIE 331: SPECIFICATIONS POUR LES VARISTANCES A OXYDE METALLIQUE (MOV) |
17/30336631 DC : 0
|
BS EN 62246-1-1 - REED SWITCHES - PART 1-1: DETAIL SPECIFICATION - QUALITY ASSESSMENT |
CSA E60384.1 : 2014
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
10/30234803 DC : 0
|
BS EN 61169-1 ED.2 - RADIO FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS |
NF EN 61020-1 : 2009
|
ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 60749-15:2010
|
Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices |
14/30296909 DC : 0
|
BS EN 61643-331 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 331: PERFORMANCE REQUIREMENTS AND TEST METHODS FOR METAL OXIDE VARISTORS (MOV) |
BS EN 60862-1:2015
|
Surface acoustic wave (SAW) filters of assessed quality Generic specification |
CEI EN 62739-1 : 2014
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING |
I.S. EN 61249-8-7:1999
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS |
12/30274800 DC : 0
|
BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE |
09/30186180 DC : 0
|
BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
BS EN 60738-1 : 2006
|
THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
05/30134428 DC : DRAFT JUN 2005
|
|
09/30207307 DC : 0
|
BS EN 60115-2 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: FIXED LOW-POWER NON-WIREWOUND RESISTORS |
I.S. EN 61337-1:2005
|
FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
CSA E60127.6 : 2003
|
MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE CARTRIDGE FUSE-LINKS |
CAN/CSA-E60127-6-03 (R2017)
|
Miniature Fuses - Part 6: Fuse-Holders for Miniature Cartridge Fuse-Links (Adopted CEI/IEC 127-6:1994, first edition, 1994-04, including Amendment 1:1996, with Canadian deviations) | Coupe-circuit miniatures - Partie 6: Ensembles-porteurs pour cartouches de coupe-circuit miniatures (norme CEI/IEC 127-6:1994 adoptée, première édition, 1994-04, y compris l\'Amendement 1:1996, avec exigences propres au Canada) |
I.S. CLC TS 50466:2006
|
LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION |
CEI EN 60393-1 : 2010
|
POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
EN IEC 61058-1:2018
|
Switches for appliances - Part 1: General requirements |
NF EN 60684-2 : 2012
|
FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST |
BS EN 61810-1:2015
|
Electromechanical elementary relays General and safety requirements |
NF EN 61881-1 : 2011
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS |
IEC 60068-2-44:1995
|
Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
CEI EN 61810-1 : 2016
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
NF EN 61249 8-8 : 1998
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS |
NF EN 62246-1 : 2015
|
REED SWITCHES - PART 1: GENERIC SPECIFICATION |
BS EN 138000:1997
|
Harmonized system of quality assessment for electronic components. Generic specification: fixed inductors for electromagnetic interference suppression (inductors for which safety tests are required) |
CEI EN 60384-26 : 2011
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
IEC 60810:2017
|
Lamps, light sources and LED packages for road vehicles - Performance requirements |
I.S. EN 16602-70-10:2015
|
SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS |
CEI EN 60512-12-1 : 2007
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD |
I.S. EN 62435-5:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
I.S. EN 61019-1:2005
|
SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION |
I.S. EN 61071:2007
|
CAPACITORS FOR POWER ELECTRONICS |
I.S. EN 60115-8:2012
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD)) |
I.S. EN 60115-8-1:2015
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
EN 62884-1:2017
|
Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement |
I.S. EN 61193-3:2013
|
QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING (IEC 61193-3:2013 (EQV)) |
BS EN 61058-1 : 2002
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
BS EN 60115-1 : 2011
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60512-12-1:2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, |
I.S. EN 61058-1:2002
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
I.S. EN 60068-2-82:2007
|
ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
I.S. EN 61248-4:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 4: SECTIONAL SPECIFICATION FOR POWER TRANSFORMERS FOR SWITCHED MODE POWER SUPPLIES (SMPS) ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
I.S. EN 61248-3:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 3: SECTIONAL SPECIFICATION FOR POWER TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
BS EN 60127-4 : 2005
|
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
I.S. EN 61747-10-1:2013
|
LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL (IEC 61747-10-1:2013 (EQV)) |
I.S. EN 60512-12-5:2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-5: SOLDERING TESTS - TEST 12E: RESISTANCE TO SOLDERING HEAT, SOLDERING IRON METHOD |
CEI EN 60068-2-58 : 2016
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
I.S. EN 61881-3:2012
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS (IEC 61881-3:2012 (EQV)) |
I.S. EN 60068-2-83:2011
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV)) |
IEC 60539-1:2016
|
Directly heated negative temperature coefficient thermistors - Part 1: Generic specification |
I.S. EN 61249-5-4:1999
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS - SECTION 4: CONDUCTIVE INKS |
I.S. EN 60512-12-4:2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
CEI EN 61881-2 : 2013
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE |
VDE 0468-2-69 : 2018
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
CSA C22.2 No. 61058.1 : 2009 : INC : UPD 1 : 2013
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
UNE-EN ISO 4521:2010
|
Metallic and other inorganic coatings - Electrodeposited silver and silver alloy coatings for engineering purposes - Specification and test methods (ISO 4521:2008) |
NF EN 60400 : 2008 AMD 2 2014
|
LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS |
NF EN 60939-1 : 2011
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
NF EN 61189-5 : 2008
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
IEC PAS 61811-55:2000
|
Electromechanical all-or-nothing relays - Part 55: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 11 mm x 7,5 mm (max.) base |
I.S. EN 60368-1:2000
|
PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
IEC 61196-1-305:2015
|
Coaxial communication cables - Part 1-305: Mechanical test methods - Solderability and resistance to soldering |
I.S. EN 61760-1:2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
I.S. EN 61196-2:2003
|
RADIO-FREQUENCY CABLES - PART 2: SECTIONAL SPECIFICATION FOR SEMI-RIGID RADIO-FREQUENCY AND COAXIAL CABLES WITH POLYTETRAFLUOROETHYLENE (PTFE) INSULATION |
IEC 60115-8-1:2014
|
Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
I.S. EN 140100:2008
|
SECTIONAL SPECIFICATION: FIXED LOW POWER FILM RESISTORS |
EN 62922:2017
|
Organic light emitting diode (OLED) panels for general lighting - Performance Requirements |
DIN EN ISO 9455-10:2013-01
|
Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
DIN EN ISO 9455-16:2013-08
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
BS EN 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
IEC 61189-5-2:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
IEC 61204-6:2000
|
Low-voltage power supplies, d.c. output - Part 6: Requirements for low-voltage power supplies of assessed performance |
IEC 61189-5-4:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
IEC 62739-3:2017
|
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods |
UNE-EN ISO 9455-16:2013
|
Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013) |
IEC 60068-2-21:2006
|
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
IEC 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV
|
Semiconductor devices - Mechanical and climatic test methods |
IEC 61338-2:2004
|
Waveguide type dielectric resonators - Part 2: Guidelines for oscillator and filter applications |
I.S. EN 61191-4:2017
|
PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
I.S. EN 61191-3:2017
|
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
EN 61760-3:2010
|
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering |
IEC 60838-1:2016 RLV
|
Miscellaneous lampholders - Part 1: General requirements and tests |
DIN EN ISO 27874:2009-01
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
IEC 61058-1:2016 RLV
|
Switches for appliances - Part 1: General requirements |
DIN EN 61270-1 : 1997
|
CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL |
VDE 0560-800 : 1998
|
GENERIC SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC A.C. CAPACITORS WITH NON-SOLID ELECTROLYTE FOR USE WITH MOTORS |
BIS IS/IEC 61058-1 : 2000(R2007)
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
DIN VDE 0616-3 : 1992
|
LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS |
DIN EN 137000 : 1998-03
|
GENERIC SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC A.C. CAPACITORS WITH NON-SOLID ELECTROLYTE FOR USE WITH MOTORS |
DIN EN 60938-1 : 2008
|
FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
BS 2011-1.1:1989
|
Environmental testing General and guidance |
VDE 0560-22 : 1997
|
CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL |
BS CECC 50000:1987
|
Harmonized system of quality assessment for electronic components. Generic specification: discrete semiconductor devices |
VDE 0557-6 : 2001
|
LOW-VOLTAGE POWER SUPPLIES, DC OUTPUT - PART 6: REQUIREMENTS FOR LOW-VOLTAGE POWER SUPPLIES OF ASSESSED PERFORMANCE |
BS CECC17000(1992) : 1992 AMD 9626
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION - SOLID STATE ALL OR NOTHING RELAYS - GENERIC DATA AND METHODS OF TEST |
CEI EN 60068-3-13 : 1ED 2017
|
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
CEI CLC/TS 50466 : 2006
|
LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION |
02/209659 DC : DRAFT OCT 2001
|
IEC 60512-12-2, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-2 - TEST 12B: SOLDERABILITY, WETTING, IRON METHOD |
I.S. EN 62435-2:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
BS EN 61811-52:2002
|
Electromechanical all-or-nothing relays Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 20 mm x 10 mm base |
14/30309692 DC : 0
|
BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS |
I.S. EN 62739-1:2013
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013 (EQV)) |
BS CECC 64000:1990
|
Harmonized system of quality assessment for electronic components: generic specification: film resistor networks |
BS CECC 41300:1979
|
Harmonized system of quality assessment for electronic components. Sectional specification: low power single-turn rotary potentiometers |
13/30287806 DC : 0
|
BS EN 60539-1 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
09/30207352 DC : 0
|
BS EN 62149-4 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
IEC 61261-1:1994
|
Piezoelectric ceramic filters for use in electronic equipment - A specification in the IEC quality assessment system for electronic components (IECQ) - Part 1: Generic specification - Qualification approval |
BS EN 61643-311:2013
|
Components for low-voltage surge protective devices Performance requirements and test circuits for gas discharge tubes (GDT) |
07/30162213 DC : 0
|
BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
BS EN 60115-2:2015
|
Fixed resistors for use in electronic equipment Sectional specification: Leaded fixed low power film resistors |
BS EN 60939-3:2015
|
Passive filter units for electromagnetic interference suppression Passive filter units for which safety tests are appropriate |
06/30153438 DC : DRAFT JULY 2006
|
BS IEC 60539-1 ED.2 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORES - PART 1: GENERIC SPECIFICATION |
12/30250506 DC : DRAFT MAR 2012
|
BS EN 62739-1 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING |
BS EN 60838-2-1 : 1997
|
MISCELLANEOUS LAMPHOLDERS - PART 2: PARTICULAR REQUIREMENTS - SECTION 1: LAMPHOLDERS S14 |
CEI EN 62421 : 2008
|
ELECTRONICS ASSEMBLY TECHNOLOGY - ELECTRONIC MODULES |
11/30252855 DC : 0
|
BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING |
CEI EN 60115-8-1 : 2016
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
CEI EN 62739-3 : 1ED 2017
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS |
09/30207299 DC : DRAFT JULY 2009
|
BS EN 60252-2 - AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS |
BS EN 61189-5-4:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
97/231700 DC : DRAFT DEC 1997
|
IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
12/30252220 DC : DRAFT MAR 2012
|
BS EN 62604-1 - SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS - PART 1: GENERIC SPECIFICATION |
I.S. EN 60238:2004
|
EDISON SCREW LAMPHOLDERS (IEC 60238:2004 (EQV)) |
BS EN 61189-5-2:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies |
BS EN 140000:1995
|
Harmonized system of quality assessment for electronic components. Generic specification: fixed resistors |
11/30252972 DC : 0
|
BS EN 61747-10-1 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL |
BS IEC 61189-5-3 : 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
BS EN 61747-10-1:2013
|
Liquid crystal display devices Environmental, endurance and mechanical test methods. Mechanical |
NF EN 60068-2-83 : 2012
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
16/30338981 DC : 0
|
BS EN 60934 - CIRCUIT-BREAKERS FOR EQUIPMENT (CBE) |
BS EN 61019-1:2005
|
Surface acoustic wave (SAW) resonators Generic specification |
EN 60400:2017
|
Lampholders for tubular fluorescent lamps and starterholders |
BS EN 61811-53:2002
|
Electromechanical all-or-nothing relays Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 14 mm x 9 mm base |
08/30176905 DC : DRAFT JAN 2008
|
BS EN 60684-2 - FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST |
BS EN 140401-803 : 2007
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
BS EN 61811-51:2002
|
Electromechanical all-or-nothing relays Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Non-standardized types and construction |
I.S. EN 61337-2:2004
|
FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE |
BS EN 62739-1:2013
|
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing |
BS 123400-003:2001
|
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections |
BS EN 60068-2-54:2006
|
Environmental testing Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
02/209662 DC : DRAFT OCT 2002
|
IEC 60512-12-5, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-5 - TEST 12E: RESISTANCE TO SOLDERING HEAT, IRON METHOD |
10/30235844 DC : 0
|
BS EN 61881-2 - RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITOR FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE |
02/209661 DC : DRAFT OCT 2002
|
IEC 60512-12-4, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-4 - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
BS EN 61189-5-3:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies |
BS 4584-103.2:1990
|
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials |
04/30112673 DC : DRAFT APR 2004
|
IEC 62314 ED.1 - SOLID-STATE RELAYS |
13/30291353 DC : 0
|
BS EN 60838-1 ED 5.0 - MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS |
CEI EN 60368-1 : 2006
|
PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 61204-6:2001
|
Low voltage power supplies, d.c. output Requirements for low-voltage power supplies of assessed performance |
BS EN 61881-2:2012
|
Railway applications. Rolling stock equipment. Capacitors for power electronics Aluminium electrolytic capacitors with non solid electrolyte |
BS EN 133000:1997
|
Harmonized system of quality assessment for electronic components. Generic specification: passive filter units for electromagnetic interference suppression |
BS EN 61760-1:2006
|
Surface mounting technology Standard method for the specification of surface mounting components (SMDs) |
BS IEC 60748-23-1:2002
|
Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification |
BS EN 61760-3:2010
|
Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering |
BS EN 61881-1:2011
|
Railway applications. Rolling stock equipment. Capacitors for power electronics Paper/plastic film capacitors |
BS EN 120000:1996
|
Harmonized system of quality assessment for electronic components. General specification: semiconductor optoelectronic and liquid crystal devices |
BS QC 763000(1990) : AMD 6754
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION |
BIS IS/IEC 60862-1 : 2003
|
SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
06/30155922 DC : 0
|
BS EN 140100 - SECTIONAL SPECIFICATION - FIXED LOW POWER FILM RESISTORS |
BS EN 61811-55:2002
|
Electromechanical non-specified time all-or-nothing relays of assessed quality Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 11 mm x 7,5 mm (max.) base |
IEC 62326-4:1996
|
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
BS EN 60252-2 : 2011
|
AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS |
10/30184605 DC : 0
|
BS EN 61643-313 ED 1.0 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 313: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (GDT) |
07/30169004 DC : 0
|
BS EN 60400 - LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS |
BS EN 168000:1996
|
Harmonized system of quality assessment for electronic components. Generic specification: quartz crystal units |
IEC 60326-9:1991
|
Printed boards - Part 9: Specification for flexible multilayer printed boards with through connections |
BS EN 61811-54:2002
|
Electromechanical non-specified time all-or-nothing relays of assessed quality Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 15 mm x 7,5 mm base |
BS EN 62246-1-1:2013
|
Reed switches Generic specification. Quality assessment |
15/30329267 DC : 0
|
BS EN 60747-17 - SEMICONDUCTOR DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION |
BS EN 61193-3:2013
|
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
BS EN 60684-2:2011
|
Flexible insulating sleeving Methods of test |
CSA E691 : 0
|
THERMAL LINKS - REQUIREMENTS AND APPLICATION GUIDE |
14/30317306 DC : 0
|
BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
BS EN 60368-1:2000
|
Piezoelectric filters Generic specification |
CSA E60127.6 : 2003 : R2012
|
MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE CARTRIDGE FUSE-LINKS |
CEI EN 62884-1 : 1ED 2018
|
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
UNE-EN 61020-1:2011
|
Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
NF EN 60938-1 : 2008 AMD 1 2008
|
FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
IEC 61338-1-2:1998
|
Waveguide type dielectric resonators - Part 1-2: General information and test conditions - Test conditions |
GOST R IEC 60252-1 : 2005
|
AC MOTOR CAPACITORS - PART 1: GENERAL. PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDE FOR INSTALLATION AND OPERATION |
EN 60068-2-69:2017/AC:2018-03
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018) |
BS EN 167000:1993
|
Harmonized system of quality assessment for electronic components. Generic specification: piezoelectric filters |
IEC 60400:2017
|
Lampholders for tubular fluorescent lamps and starterholders |
I.S. EN ISO 4521:2008
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
I.S. EN 60810:2015
|
LAMPS FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
BS EN 140402 : 2015
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
I.S. EN 61189-5:2006
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
BS EN 60934 : 2001
|
CIRCUIT-BREAKERS FOR EQUIPMENT (CBE) |
I.S. EN 140101-806:2009
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
I.S. EN 60384-1:2016
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
CEI EN 60122-1 : 2004
|
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 62922:2017
|
ORGANIC LIGHT EMITTING DIODE (OLED) PANELS FOR GENERAL LIGHTING - PERFORMANCE REQUIREMENTS |
I.S. EN 138000:1998
|
FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (INDUCTORS FOR WHICH SAFETY TESTS ARE REQUIRED) (GENERIC SPECIFICATION) |
I.S. EN 61338-1:2005
|
WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
BS EN IEC 60810:2018
|
Lamps, light sources and led packages for road vehicles. Performance requirements |
NF EN 60127-6 : 2014
|
MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE CARTRIDGE FUSE-LINKS |
BS EN 140401:2009
|
Blank Detail Specification. Fixed low power film surface mount (SMD) resistors |
I.S. EN 133000:1998
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (GENERIC SPECIFICATION) |
EN IEC 62246-1-1:2018
|
Reed switches - Part 1-1: Generic specification - Blank detail specification |
EN IEC 61643-331:2018
|
Components for low-voltage surge protective devices - Part 331: Performance requirements and test methods for metal oxide varistors (MOV) |
NF EN 61760-3 : 2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
PREN ISO 9455-10 : DRAFT 2011
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
I.S. EN 62884-1:2017
|
MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
CEI EN 60068-2-83 : 2012
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
ISO 7587:1986
|
Electroplated coatings of tin-lead alloys — Specification and test methods |
I.S. EN 62149-4:2010
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
I.S. EN 60393-1:2009
|
POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60068-2-54:2006
|
ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
I.S. EN 62149-6:2003
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 6: 650-NM 250-MBIT/S PLASTIC OPTICAL FIBRE TRANSCEIVERS |
IEC 60115-1:2008
|
Fixed resistors for use in electronic equipment - Part 1: Generic specification |
IEC 60115-8:2009
|
Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
IEC 61196-2:1995
|
Radio-frequency cables - Part 2: Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene (PTFE) insulation |
IEC PAS 60747-17:2011
|
Semiconductor devices - Discrete devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation |
I.S. EN 61984:2009
|
CONNECTORS - SAFETY REQUIREMENTS AND TESTS |
IEC PAS 62246-2-1:2008
|
Reed contact units - Part 2-1: Heavy-duty reed switches - Quality assessment specification |
I.S. EN 62319-1:2005
|
POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
IEC 61058-1 REDLINE : 4ED 2016
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
IEC 61196-9-1:2015
|
Coaxial communication cables - Part 9-1: Flexible RF coaxial cables - Blank detail specification |
IEC 62326-4-1:1996
|
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C |
IEC 60838-1:2016+AMD1:2017 CSV
|
Miscellaneous lampholders - Part 1: General requirements and tests |
I.S. EN 61189-3:2008
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
I.S. EN 60938-1:1999
|
FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
I.S. EN 60838-2-1:1997
|
MISCELLANEOUS LAMPHOLDERS - PART 2: PARTICULAR REQUIREMENTS - SECTION 1: LAMPHOLDERS S14 |
I.S. EN 61249-8-8:1999
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER |
IEC 61051-1:2007
|
Varistors for use in electronic equipment - Part 1: Generic specification |
I.S. EN 60115-1:2011
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
IEC 60238:2016+AMD1:2017 CSV
|
Edison screw lampholders |
I.S. EN 62211:2017
|
INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
I.S. EN 61747-5:1999
|
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
EN 140200 : 1996 AMD 1 2001
|
FIXED POWER RESISTORS (SECTIONAL SPECIFICATION) |
NF EN 61810-1 : 2015
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
DIN EN 14436 E : 2004
|
COPPER AND COPPER ALLOYS - ELECTROLYTICALLY TINNED STRIP |
IEC 60368-1:2000+AMD1:2004 CSV
|
Piezoelectric filters of assessed quality - Part 1: Genericspecification |
IEC 61189-5:2006
|
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
BS EN 61191-4:2017
|
Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV
|
Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types |
BS EN 14436:2004
|
Copper and copper alloys. Electrolytically tinned strip |
IEC 61169-1:2013
|
Radio frequency connectors - Part 1: Generic specification - General requirements and measuring methods |
IEC 61881-3:2012+AMD1:2013 CSV
|
Railway applications - Rolling stock equipment - Capacitors forpower electronics - Part 3: Electric double-layer capacitors |
IEC 61643-311:2013
|
Components for low-voltage surge protective devices - Part 311: Performance requirements and test circuits for gas discharge tubes (GDT) |
IEC 61249-8-7:1996
|
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks |
IEC 61337-1:2004
|
Filters using waveguide type dielectric resonators - Part 1: Generic specification |
IEC 60068-2-83:2011
|
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste |
BS EN ISO 9455-17:2006
|
Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues |
IEC 61810-1:2015
|
Electromechanical elementary relays - Part 1: General and safety requirements |
IEC 61747-10-1:2013
|
Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods - Mechanical |
EN 60749-15:2010/AC:2011
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
EN 60749-20:2009
|
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
EN 61007:1997
|
Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures |
EN 61760-1:2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
EN ISO 4521 : 2008
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
UNI EN ISO 9455-10 : 2012
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
IEC 61811-1:2015
|
Electromechanical telecom elementary relays of assessed quality - Part 1: Generic specification and blank detail specification |
EN ISO 27874:2008
|
Metallic and other inorganic coatings - Electrodeposited gold and gold alloy coatings for electrical, electronic and engineering purposes - Specification and test methods (ISO 27874:2008) |
EN 60249-1 : 1993 COR 1994
|
BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
I.S. EN IEC 60810:2018
|
LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
BS EN 60384-26:2010
|
Fixed capacitors for use in electronic equipment Sectional specification. Fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte |
05/30137416 DC : 0
|
|
BS EN 140100:2008
|
Sectional specification. Fixed low power film resistors |
NF EN 60068 2-69 : 2017
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
NF EN 60252-1 : 2011 AMD 1 2014
|
AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION |
BS EN 62435-2:2017
|
Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms |
12/30260802 DC : 0
|
BS EN 62391-1 - FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
07/30149142 DC : 0
|
BS IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
NF EN 60115-8 : 2013
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
CAN/CSA-C22.2 NO. 60947-7-4:18
|
Low-voltage switchgear and controlgear ? Part 7-4: Ancillary equipment ? PCB terminal blocks for copper conductors (Trinational standard with NMX-J-538/7-4-ANCE and UL 60974-7-4) |
BS EN 62149-9:2014
|
Fibre optic active components and devices. Performance standards Seeded reflective semiconductor optical amplifier transceivers |
I.S. EN 62435-1:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
I.S. EN 143000:1994
|
THERMISTORS (GENERIC SPECIFICATION) |
BS CECC 40100:1981
|
Harmonized system of quality assessment for electronic components: sectional specification: fixed low power non-wirewound resistors |
BS EN 140203:1997
|
Harmonized system of quality assessment for electronic components. Blank detail specification: fixed power resistors (Assessment level H) |
I.S. EN 60684-2:2011
|
FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST (IEC 60684-2:2011) |
BS EN 60169-21:1997
|
Radio-frequency connectors Two types of radio-frequency connectors with inner diameter of outer conductor 9,5 mm (0,374 in) with different versions of screw coupling. Characteristic impedance 50 ohms (types SC-A and SC-B) |
03/103740 DC : DRAFT FEB 2003
|
IEC 61337-1 ED.1 - FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
CEI EN 60169-21 : 1998
|
RADIO-FREQUENCY CONNECTORS - PART 21: TWO TYPES OF RADIO-FREQUENCY CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 9,5 MM (0,374 IN) WITH DIFFERENT VERSIONS OF SCREW COUPLING CHARACTERISTIC IMPEDANCE 50 OHMS (TYPES SC-A AND SC-B) |
17/30363106 DC : DRAFT SEP 2017
|
BS IEC 63138-1 ED.1.0 - MULTI-RADIO FREQUENCY CHANNEL CONNECTORS - PART 1: GENERIC SPECIFICATION-GENERAL REQUIREMENTS AND MEASURING METHODS |
CEI EN 60947-7-4 : 2014
|
LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS |
07/30168484 DC : 0
|
BS EN 60749-20 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
14/30280850 DC : 0
|
BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
08/30186808 DC : DRAFT JULY 2008
|
BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS |
DD CLC/TS 50466:2006
|
Long duration storage of electronic components. Specification for implementation |
BS EN 140201:1997
|
Harmonized system of quality assessment for electronic components. Blank detail specification: fixed power resistors (Assessment level S) |
BS 123500-003:2001
|
System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections |
BS CECC 40301:1988
|
Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Fixed precision resistors |
13/30277857 DC : 0
|
BS EN 62149-9 ED 1.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS |
BS EN 60068-3-13:2016
|
Environmental testing Supporting documentation and guidance on Test T. Soldering |
BS EN 140401-802 : 2007
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
12/30259014 DC : 0
|
BS EN 60127-6 - MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE FUSE-LINKS |
CEI EN 60512-12-6 : 1997
|
ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT/ BASIC TESTING PROCEDURES AND MEASURING METHODS - PART 12: SOLDERING TESTS - SECTION 6: TEST 12F: SEALING AGAINST FLUX AND CLEANING SOLVENTS IN MACHINE SOLDERING |
BS EN 61270-1:1998
|
Capacitors for microwave ovens General |
BS EN 60512-12-2:2006
|
Connectors for electronic equipment. Tests and measurements Soldering tests. Test 12b. Solderability, wetting, soldering iron method |
10/30234015 DC : 0
|
BS EN 62246-1-1 ED.1 - REED SWITCHES - PART 1-1: QUALITY ASSESSMENT SPECIFICATION |
UNE-EN 60947-7-4:2014
|
Low-voltage switchgear and controlgear - Part 7-4: Ancillary equipment - PCB terminal blocks for copper conductors |
IEC 61045-1:1991
|
Fixed film resistor networks for use in electronic equipment - Part 1: Generic specification |
13/30264600 DC : 0
|
BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
I.S. EN 62025-2:2005
|
HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
I.S. EN 62739-3:2017
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS |
I.S. EN 60252-1:2011
|
AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION (IEC 60252-1:2010 (EQV)) |
CEI EN 62314 : 2007
|
SOLID-STATE RELAYS |
CEI EN 61051-1 : 2010
|
VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 61071:2007
|
Capacitors for power electronics |
BS EN 61007:1997
|
Transformers and inductors for use in electronic and telecommunication equipment. Measuring methods and test procedures |
BS EN 61248-5:1997
|
Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for pulse transformers on the basis of the capability approval procedure |
BS EN 62025-2:2005
|
High frequency inductive components. Non-electrical characteristics and measuring methods Test methods for non-electrical characteristics |
NF EN 62326 4-1 : 1998
|
PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION PERFORMANCE LEVELS A, B AND C |
BS EN 61248-1:1997
|
Transformers and inductors for use in electronic and telecommunication equipment Generic specification |
BS EN IEC 62246-1-1:2018
|
Reed switches Generic specification. Blank detail specification |
BS EN 60115-8-1:2015
|
Fixed resistors for use in electronic equipment Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
DIN EN 60252 : 1994
|
CAPACITORS - MOTOR CAPACITORS |
CEI 48-15 : 1998
|
FLAT, QUICK-CONNECT TERMINATIONS |
CEI EN 60749-20 : 2010
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
09/30209389 DC : 0
|
BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E |
06/30149145 DC : DRAFT OCT 2006
|
IEC 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
EN IEC 61076-3-119:2018
|
Connectors for electrical and electronic equipment - Product requirements - Part 3-119: Rectangular connectors - Detail specification for shielded and unshielded, free and fixed 10-way connectors with push-pull coupling for industrial environments for data transmission with frequencies up to 100 MHz |
11/30206085 DC : 0
|
BS EN 60947-7-4 - LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PRINTED BOARD TERMINAL BLOCKS FOR COPPER CONDUCTORS |
BS EN 60068-2-82:2007
|
Environmental testing Tests. Test Tx. Whisker test methods for electronic and electric components |
BS EN 61249-8-8:1997
|
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings |
BS EN 61337-2:2004
|
Filters using waveguide type dielectric resonators Guide for use |
08/30193715 DC : 0
|
BS EN 62246-1 ED.2 - REED SWITCHES - PART 1: GENERIC SPECIFICATION |
02/208665 DC : DRAFT SEP 2002
|
IEC 62319-1 ED.1.0 - POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
NF EN 61204-6 : 2001
|
LOW-VOLTAGE POWER SUPPLIES, DC OUTPUT - PART 6: REQUIREMENTS FOR LOW-VOLTAGE POWER SUPPLIES ASSESSED PERFORMANCE |
BS EN 123400:1992
|
Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections |
BS EN 130000:1994
|
Harmonized system of quality assessment for electronic components. Generic specification: fixed capacitors |
BS EN 62319-1:2005
|
Polymeric thermistors. Directly heated positive step function temperature coefficient Generic specification |
NF EN 60252-2 : 2011 AMD 1 2014
|
AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS |
BS EN 60122-1 : 2002
|
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 61643-331:2003
|
Low voltage surge protective devices Specification for metal oxide varistors (MOV) |
08/30193881 DC : 0
|
BS EN 60939-1 ED.3 - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
PD 6521:1988
|
Summaries of test methods for environmental testing of electrotechnical products |
BS EN 61196-2:2003
|
Radio-frequency cables. Specifications. Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene (PTFE) insulation |
BS EN 60749-20:2009
|
Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
NF EN 61071 : 2007
|
CAPACITORS FOR POWER ELECTRONICS |
BS EN 61248-2:1997
|
Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for signal transformers on the basis of the capability approval procedure |
BS EN 61810-7:2006
|
Electromechanical elementary relays Test and measurement procedures |
UL 60947-7-4:1ED 2018-04
|
Low-Voltage Switchgear and Controlgear - Part 7-4: Ancillary equipment - PCB terminal blocks for copper conductors |
I.S. EN 61797-1:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN TELECOMMUNICATION AND ELECTRONIC EQUIPMENT - MAIN DIMENSIONS OF COIL FORMERS - PART 1: COIL FORMERS FOR LAMINATED CORES |
I.S. EN 60169-21:1999
|
RADIO-FREQUENCY CONNECTORS - PART 21: TWO TYPES OF RADIO-FREQUENCY CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 9,5 MM (0,374 IN) WITH DIFFERENT VERSIONS OF SCREW COUPLING - CHARACTERISTIC IMPEDANCE 50 OHMS (TYPES SC-A AND SC-B) |
IEC 61178-1:1993
|
Quartz crystal units - A specification in the IEC Quality Assessment System for Electronic Components (IECQ) - Part 1: Generic specification |
IEC 61020-3:1991
|
Electromechanical switches for use in electronic equipment - Part 3: Sectional specification for in-line package switches |
CEI EN 62319-1 : 2005
|
POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
BS EN 170000:1999
|
Harmonized system of quality assessment for electronic components. Generic specification: waveguide type dielectric resonators |
NF EN 62739-1 : 2014
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING |
I.S. EN 61007:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES |
NF EN ISO 4521 : 2008
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
EN 61810-1:2015/AC:2018-04
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS (IEC 61810-1:2015/COR1:2018) |
I.S. EN IEC 62246-1-1:2018
|
REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - BLANK DETAIL SPECIFICATION |
I.S. EN 61760-3:2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
I.S. EN 165000-1:1998
|
FILM AND HYBRID INTEGRATED CIRCUITS - PART 1: GENERIC SPECIFICATION CAPABILITY APPROVAL PROCEDURE |
I.S. EN 134000:1994
|
GENERIC SPECIFICATION: VARIABLE CAPACITORS (QUALIFICATION APPROVAL AND CAPABILITY APPROVAL) |
I.S. EN 60068-3-13:2016
|
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
I.S. EN 61643-312:2013
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (IEC 61643-312:2013 (EQV) + CORRIGENDUM JUL. 2013 (EQV)) |
I.S. EN 61189-5-4:2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 60749-15:2010
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
BS CECC 40103:1988
|
Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Fixed low power non-wirewound resistors. Assessment level P |
CEI EN 60068-2-54 : 2007
|
ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
EN IEC 60810:2018
|
Lamps, light sources and led packages for road vehicles - Performance requirements |
CEI EN 60512-12-7 : 2002
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-7: SOLDERING TESTS - TEST 12G: SOLDERABILITY, WETTING BALANCE METHOD |
I.S. CECC 33000:1994
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (GENERIC SPECIFICATION) |
BS EN 60947-7-4:2013
|
Low-voltage switchgear and controlgear Ancillary equipment. PCB terminal blocks for copper conductors |
CSA C22.2 No. 61058.1 : 2009
|
SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
CEI EN 62246-1-1 : 2014
|
REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT |
EN 140401-802:2007/A3:2017
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
I.S. EN 62246-1:2015
|
REED SWITCHES - PART 1: GENERIC SPECIFICATION |
CEI EN 60749-15 : 2012
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
DIN EN 60068-2-69 : 2007
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
CEI EN 61810-7 : 2006
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
EN 60384-1:2016
|
Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
IEC 60300-3-5:2001
|
Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles |
I.S. EN 60127-2:2014
|
MINIATURE FUSES - PART 2: CARTRIDGE FUSE-LINKS |
IEC 61071:2017
|
Capacitors for power electronics |
I.S. EN 61020-1:2009
|
ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 61337-1-2:1999
|
Filters using waveguide type dielectric resonators - Part 1-2: Test conditions |
I.S. EN 140101:2008
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS |
I.S. EN 60838-1:2017
|
MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS |
I.S. EN 140401-802:2007
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
I.S. EN 140401-803:2007
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
I.S. EN 62391-1:2016
|
FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 61169-1:2013
|
RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS |
IEC 61191-1:2013
|
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
IEC 62884-1:2017
|
Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement |
IEC 60749-20:2008
|
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
IEC 60326-10:1991
|
Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections |
IEC 60326-11:1991
|
Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections |
I.S. EN 62878-1-1:2015
|
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
IEC 61007:1994
|
Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures |
IEC 60115-2:2014
|
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
IEC 61196-8:2012
|
Coaxial communication cables - Part 8: Sectional specification for semi-flexible cables with polytetrafluoroethylene (PTFE) dielectric |
EN 61169-1:2013/AC:2016-02
|
RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS (IEC 61169-1:2013) |
EN 60938-1:1999/A1:2007
|
FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
EN 60539-1:2016/AC:2017-09
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017) |
EN 60115-1:2011/A11:2015
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
DIN EN ISO 9455-2:1995-11
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD |
16/30350012 DC : 0
|
BS EN 60810 - LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
IEC 60738-1:2006+AMD1:2009 CSV
|
Thermistors - Directly heated positive temperature coefficient -Part 1: Generic specification |
IEC 60938-1:1999+AMD1:2006 CSV
|
Fixed inductors for electromagnetic interference suppression - Part 1: Generic specification |
IEC 60689:2008
|
Measurement and test methods for tuning fork quartz crystal units in the range from 10 kHz to 200 kHz and standard values |
IEC 61248-6:1996
|
Transformers and inductors for use in electronic andtelecommunication equipment - Part 6: Sectional specification forinductors on the basis of the capability approval procedure |
BS EN 61984:2009
|
Connectors. Safety requirements and tests |
ISO 9455-2:1993
|
Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method |
ISO 4521:2008
|
Metallic and other inorganic coatings — Electrodeposited silver and silver alloy coatings for engineering purposes — Specification and test methods |
IEC 60512-12-5:2006
|
Connectors for electronic equipment - Tests and measurements - Part 12-5: Soldering tests - Test 12e: Resistance to soldering heat, soldering iron method |
IEC 61984:2008
|
Connectors - Safety requirements and tests |
IEC 60384-26-1:2010
|
Fixed capacitors for use in electronic equipment - Part 26-1: Blank detail specification - Fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte - Assessment level EZ |
IEC 61797-1:1996
|
Transformers and inductors for use in telecommunication and electronic equipment - Main dimensions of coil formers - Part 1: Coil formers for laminated cores |
15/30327712 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
BS EN 61191-2:2017
|
Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies |
IEC 60384-1:2016
|
Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
05/30128512 DC : DRAFT JAN 2005
|
IEC 61984 ED.2 - CONNECTORS - SAFETY REQUIREMENTS AND TESTS |
IEC 61811-53:2002
|
Electromechanical all-or-nothing relays - Part 53: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 14 mm x 9 mm base |
IEC 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
IEC 62435-5:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
IEC 61270-1:1996
|
Capacitors for microwave ovens - Part 1: General |
IEC 61058-2-4:1995+AMD1:2003 CSV
|
Switches for appliances - Part 2-4: Particular requirements for independently mounted switches |
11/30255124 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 62314:2006
|
Solid-state relays |
IEC 61020-1:2009
|
Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
IEC 61189-5-3:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
IEC 61881-2:2012
|
Railway applications - Rolling stock equipment - Capacitors for power electronics - Part 2: Aluminium electrolytic capacitors with non-solid electrolyte |
IEC 61881-1:2010
|
Railway applications - Rolling stock equipment - Capacitors for power electronics - Part 1: Paper/plastic film capacitors |
IEC 60838-2-1:1994
|
Miscellaneous lampholders - Part 2: Particular requirements - Section 1: Lampholders S14 |
IEC 60939-1:2010
|
Passive filter units for electromagnetic interference suppression - Part 1: Generic specification |
IEC 61747-1:1998+AMD1:2003 CSV
|
Liquid crystal and solid-state display devices - Part 1: Generic specification |
IEC 60512-12-6:1996
|
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering |
IEC 62739-1:2013
|
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing |
ISO 9455-17:2002
|
Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues |
IEC 60684-2:2011
|
Flexible insulating sleeving - Part 2: Methods of test |
IEC 61193-3:2013
|
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
IEC 60862-1:2015
|
Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification |
IEC 60512-12-2:2006
|
Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method |
BS EN 62149-6:2003
|
Fibre optic active components and devices. Performance standards 650-nm 250-Mbit/s plastic optical fibre transceivers |
ISO 9455-10:2012
|
Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method |
IEC 60947-7-4:2013
|
Low-voltage switchgear and controlgear - Part 7-4: Ancillary equipment - PCB terminal blocks for copper conductors |
IEC 61169-8:2007
|
Radio-frequency connectors - Part 8: Sectional specification - RF coaxial connectors with inner diameter of outer conductor 6,5 mm (0,256 in) with bayonet lock - Characteristic impedance 50 Ω (type BNC) |
IEC 61248-1:1996
|
Transformers and inductors for use in electronic and telecommunication equipment - Part 1: Generic specification |
IEC 62149-9:2014
|
Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers |
IEC 62435-2:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
IEC 61811-55:2002
|
Electromechanical all-or-nothing relays - Part 55: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 11 mm x 7,5 mm (max.) base |
IEC 61811-51:2002
|
Electromechanical all-or-nothing relays - Part 51: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Non-standardized types and construction |
IEC 61019-1:2004
|
Surface acoustic wave (SAW) resonators - Part 1: Generic specification |
IEC 62391-1 : 2.0
|
FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 61248-5:1996
|
Transformers and inductors for use in electronic andtelecommunication equipment - Part 5: Sectional specification forpulse transformers on the basis of the capability approvalprocedure |
IEC 61811-52:2002
|
Electromechanical all-or-nothing relays - Part 52: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 20 mm x 10 mm base |
IEC 60252-1:2010+AMD1:2013 CSV
|
AC motor capacitors - Part 1: General - Performance, testing andrating - Safety requirements - Guidance for installation and operation |
IEC 60068-3-13:2016
|
Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
NF EN ISO 9455-16 : 2013
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TESTS, WETTING BALANCE METHOD |
IEC 60252-2:2010+AMD1:2013 CSV
|
AC motor capacitors - Part 2: Motor start capacitors |
IEC 61248-3:1996
|
Transformers and inductors for use in electronic andtelecommunication equipment - Part 3: Sectional specification forpower transformers on the basis of the capability approvalprocedure |
BS EN 60810:2015
|
Lamps for road vehicles. Performance requirements |
BS EN ISO 9455-10:2012
|
Soft soldering fluxes. Test methods Flux efficacy test, solder spread method |
IEC 61811-54:2002
|
Electromechanical all-or-nothing relays - Part 54: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 15 mm x 7,5 mm base |
IEC 61248-4:1996
|
Transformers and inductors for use in electronic andtelecommunication equipment - Part 4: Sectional specification forpower transformers for switched mode power supplies (SMPS) on thebasis of the capability approval procedure |
IEC 61338-1:2004
|
Waveguide type dielectric resonators - Part 1: Generic specification |
BS EN 140402-801:2015
|
Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2 |
UNE-EN 60400:2011
|
Lampholders for tubular fluorescent lamps and starterholders |
IEC 60127-6:2014
|
Miniature fuses - Part 6: Fuse-holders for miniature fuse-links |
BS EN 62435-5:2017
|
Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
IEC 62149-4:2010
|
Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application |
IEC 61760-1:2006
|
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
IEC 60068-2-82:2007
|
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
IEC 60749-15:2010
|
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
IEC 61248-2:1996
|
Transformers and inductors for use in electronic andtelecommunication equipment - Part 2: Sectional specification forsignal transformers on the basis of the capability approvalprocedure |
IEC 61191-3:2017
|
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
IEC 62025-2:2005
|
High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics |
IEC 61337-2:2004
|
Filters using waveguide type dielectric resonators - Part 2: Guidance for use |
IEC 61189-3:2007
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
IEC 60512-12-4:2006
|
Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method |
EN 61811-1:2015
|
Electromechanical telecom elementary relays of assessed quality - Part 1: Generic specification and blank detail specification |
EN 62326-4:1997
|
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
EN 61196-2:2003
|
Radio-frequency cables - Part 2: Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene (PTFE) insulation |
EN 61811-52:2002
|
Electromechanical all-or-nothing relays - Part 52: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 20 mm x 10 mm base |
EN 62739-1 : 2013
|
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013) |
EN 60862-1:2015
|
Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification |
EN ISO 9455-2:1995
|
Soft soldering fluxes - Test methods - Part 2: Determination of non-volatile matter, ebulliometric method (ISO 9455-2:1993) |
EN ISO 9455-10:2012
|
Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
EN 14436:2004
|
Copper and copper alloys - Electrolytically tinned strip |
EN 16602-70-10:2015
|
Space product assurance - Qualification of printed circuit boards |
EN ISO 9455-17:2006
|
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002) |
EN ISO 9455-16:2013
|
Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013) |
13/30294866 DC : 0
|
BS EN 61058-1 - SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
BS EN 62435-1:2017
|
Electronic components. Long-term storage of electronic semiconductor devices General |
BS EN 60068-2-58 : 2015
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
DD IEC/PAS 62435:2005
|
Electronic components. Long duration storage of electronic components. Guidance for implementation |
17/30340059 DC : 0
|
BS EN 61076-3-119 - CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 3-119: RECTANGULAR CONNECTORS - DETAIL SPECIFICATION FOR UNSHIELDED, FREE AND FIXED 10 WAY CONNECTORS WITH PUSH-PULL COUPLING FOR INDUSTRIAL ENVIRONMENTS WITH FREQUENCIES UP TO 100 MHZ |
BS EN 61811-1:2015
|
Electromechanical telecom elementary relays of assessed quality Generic specification and blank detail specification |
BS EN 60512-12-4:2006
|
Connectors for electronic equipment. Tests and measurements Soldering tests. Test 12d. Resistance to soldering heat, solder bath method |
BS 9752:1989
|
Blank detail specification for fixed insulated (unshielded) r.f. inductors suitable for surface mounting at the full assessment level |
DD IEC/PAS 60747-17:2011
|
Semiconductor devices. Discrete devices Magnetic and capacitive coupler for basic and reinforced isolation |
11/30243576 DC : DRAFT FEB 2011
|
BS EN 62643-1 - ELECTROSTATIC MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
02/209658 DC : DRAFT OCT 2002
|
IEC 60512-12-1, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-1 - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD |
I.S. EN 60384-26-1:2010
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ |
CEI EN 61071 : 2007
|
CAPACITORS FOR POWER ELECTRONICS |
CEI EN 62391-1 : 2016
|
FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
CEI EN 61270-1 : 1997
|
CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL |
BS CECC 32100:1992
|
Harmonized system of quality assessment for electronic components. Sectional specification: fixed multilayer ceramic chip capacitors |
CEI EN 60068-2-82 : 2008
|
ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
CEI EN 60115-2 : 2016
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
UNI EN ISO 27874 : 2008
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
17/30349734 DC : 0
|
BS EN 60384-26 ED.2.0 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
BS EN 62326-4-1:1997
|
Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C |
CEI EN 60684-2 : 2012
|
FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST |
CEI EN 140401 : 2009
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
13/30294204 DC : 0
|
BS EN 60238 - EDISON SCREW LAMPHOLDERS |
BS EN 61189-3:2008
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards) |
BS EN 60393-1:2009
|
Potentiometers for use in electronic equipment Generic specification |
BS EN 60115-8:2012
|
Fixed resistors for use in electronic equipment Sectional specification. Fixed surface mount resistors |
CEI EN 138000 : 1996
|
GENERIC SPECIFICATION: FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (INDUCTORS FOR WHICH SAFETY TESTS ARE REQUIRED) |
BS 6201-2:1982
|
Fixed capacitors for use in electronic equipment. Specification for fixed capacitors of ceramic dielectric, Class 2. Selection of methods of test and general requirements |
BS CECC43002(1984) : 1984 AMD 7379
|
SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
03/308375 DC : DRAFT JUNE 2003
|
IEC 61196-1 - COAXIAL COMMUNICATION CABLES - PART 1: GENERIC SPECIFICATION - GENERAL, DEFINITIONS AND REQUIREMENTS |
CEI EN 60115-8 : 2013
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
BS EN 61020-1:2009
|
Electromechanical switches for use in electrical and electronic equipment Generic specification |
08/30192301 DC : 0
|
BS EN 60384-26 ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
13/30264596 DC : 0
|
BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
I.S. EN 61810-1:2015
|
ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
CEI EN 60512-12-2 : 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-2: SOLDERING TESTS - TEST 12B: SOLDERABILITY, WETTING, SOLDERING IRON METHOD |
IEEE C62.33-1982
|
IEEE Standard Test Specifications for Varistor Surge-Protective Devices |
10/30184598 DC : 0
|
BS EN 61643-312 ED 1.0 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: PERFORMANCE SPECIFICATION FOR GAS DISCHARGE TUBES (GDT) |
BS ISO 9455-17 : 2002 AMD 16425
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
BS EN 62246-1:2015
|
Reed switches Generic specification |
BS CECC43004(1984) : 1984 AMD 1992
|
SPEC FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS (ROD TYPE) |
13/30286163 DC : 0
|
BS EN 62435-2 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2 - DETERIORATION MECHANISMS |
12/30265027 DC : 0
|
BS EN 61196-9 ED.1 - COAXIAL COMMUNICATION CABLES - PART 9: SECTIONAL SPECIFICATION FOR FLEXIBLE RF COAXIAL CABLES |
IEC 60068-2-69:2017
|
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
IEC 60393-1:2008
|
Potentiometers for use in electronic equipment - Part 1: Generic specification |
I.S. EN 60115-2:2015
|
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
I.S. EN 60249-1:1994
|
BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
16/30338642 DC : 0
|
BS EN 62739-3 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHOD |
CEI EN 61643-331 : 2005
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 331: SPECIFICATION FOR METAL OXIDE VARISTORS (MOV) |
CEI EN 61249-8-7 : 1997
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS |
BS EN 61248-7:1998
|
Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for high-frequency inductors and intermediate transformers on the basis of the capability approval procedure |
BS EN 60068-2-69:2017
|
Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
11/30213136 DC : 0
|
BS EN ISO 9455-16 - SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
11/30234673 DC : 0
|
BS EN ISO 9455-10 - SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
BS EN 62149-4:2010
|
Fibre optic active components and devices. Performance standards 1300 nm fibre optic transceivers for Gigabit Ethernet application |
I.S. EN 60068-2-44:1997
|
ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING |
I.S. EN 61248-2:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 2: SECTIONAL SPECIFICATION FOR SIGNAL TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
BS EN 62878-1-1:2015
|
Device embedded substrate Generic specification. Test methods |
BS EN 61248-4:1997
|
Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for power transformers for switched mode power supplies (SMPS) on the basis of the capability approval procedure |
BS CECC43001(1984) : 1984 AMD 7378
|
SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
CEI EN 60068-2-69 : 2008
|
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
DIN EN 61881 : 2000
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS |
CEI EN 60539-1 : 2009
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
NF EN 60238 : 2005 AMD 2 2011
|
|
I.S. EN 60939-3:2015
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE |
I.S. EN 60934:2001
|
CIRCUIT BREAKERS FOR EQUIPMENT (CBE) (IEC 60934:2000 (EQV)) |
I.S. EN 61189-5-3:2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 61811-54:2002
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 54: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 15 MM X 7,5 MM BASE |
I.S. EN 61811-53:2002
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 53: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 14 MM X 9 MM BASE |
NF EN 61249 8-7 : 1997
|
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND LINKS |
I.S. EN IEC 61076-3-119:2018
|
CONNECTORS FOR ELECTRICAL AND ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 3-119: RECTANGULAR CONNECTORS - DETAIL SPECIFICATION FOR SHIELDED AND UNSHIELDED, FREE AND FIXED 10-WAY CONNECTORS WITH PUSH-PULL COUPLING FOR INDUSTRIAL ENVIRONMENTS FOR DATA TRANSMISSION WITH FREQUENCIES UP TO 100 MHZ |
I.S. EN 61881-2:2012
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE (IEC 61881-2:2012 (EQV)) |
IEEE C62.35-2010
|
IEEE Standard Test Methods for Avalanche Junction Semiconductor Surge-Protective Device Components |
I.S. EN 60384-26:2010
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
I.S. EN 60127-4:2005
|
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV)) |
I.S. EN 60749-20:2009
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
BS EN 140101-806 : 2008
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
I.S. EN 60122-1:2002 AMD 1 2018
|
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 61270-1:1999
|
CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL |
I.S. EN 61248-6:1998
|
TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 6: SECTIONAL SPECIFICATION FOR INDUCTORS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
I.S. EN 60862-1:2015
|
SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 62326-20:2016
|
PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
I.S. EN 62149-9:2014
|
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS |
I.S. EN 61189-5-2:2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 61811-1:2015
|
ELECTROMECHANICAL TELECOM ELEMENTARY RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION |
IEC 62149-6:2003
|
Fibre optic active components and devices - Performance standards - Part 6: 650-nm 250-Mbit/s plastic optical fibre transceivers |
IEC 61196-1:2005
|
Coaxial communication cables - Part 1: Generic specification - General, definitions and requirements |
I.S. EN 61169-8:2007
|
RADIO-FREQUENCY CONNECTORS - PART 8: SECTIONAL SPECIFICATION - RF COAXIAL CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 6,5 MM (0,256 IN) WITH BAYONET LOCK - CHARACTERISTICS IMPEDANCE 50 OHMS (TYPE BNC) |
I.S. EN 60068-2-21:2006
|
ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
NF EN 62319-1 : 2005
|
POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
NF EN 60127-4 : 2005 AMD 2 2013
|
MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
UNE-EN ISO 27874:2010
|
Metallic and other inorganic coatings - Electrodeposited gold and gold alloy coatings for electrical, electronic and engineering purposes - Specification and test methods (ISO 27874:2008) |
IEC 60238:2016 RLV
|
Edison screw lampholders |
BIS IS 15934-5 : 2011
|
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
CEI EN 60939-1 : 2011
|
PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
CEI EN 60512-12-4 : 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS -PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
EN 60838-1:2017/A1:2017
|
MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS (IEC 60838-1:2016/A1:2017) |
I.S. EN 60947-7-4:2013
|
LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS (IEC 60947-7-4:2013 (EQV)) |
CEI EN 61760-3 : 2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
BS EN 62391-1:2016
|
Fixed electric double-layer capacitors for use in electric and electronic equipment Generic specification |
I.S. EN 61811-52:2002
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 52: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 20 MM X 10 MM BASE |
I.S. EN 61811-55:2002
|
ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 55: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 11 MM X 7,5 MM (MAX.) BASE |
IEC 60748-23-1:2002
|
Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification |
IEC 61058-1:2016
|
Switches for appliances - Part 1: General requirements |
I.S. EN 62314:2006
|
SOLID-STATE RELAYS |
I.S. EN 140401:2009
|
BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
I.S. EN 61643-331:2003
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 331: SPECIFICATION FOR METAL OXIDE VARISTORS (MOV) |
IEC 60238 REDLINE : 9ED 2016
|
EDISON SCREW LAMPHOLDERS |
IEC 61019-1-2:1993
|
Surface acoustic wave (SAW) resonators - Part 1: General information, standard values and test conditions - Section 2: Test conditions |
I.S. EN 116000-3:1998
|
GENERIC SPECIFICATION: ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 3: TEST AND MEASUREMENT PROCEDURES |
IEC 60068-2-58:2015+AMD1:2017 CSV
|
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
I.S. EN 60068-2-58:2015
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
IEC 60384-1 REDLINE : 5ED 2016
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60539-1:2016
|
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
IEC 60748-23-3:2002
|
Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report |
EN 140401-803 : 2007 AMD 3 2017
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
EN 140101-806 : 2008 COR 2014
|
DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
EN 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
IEC 61810-7:2006
|
Electromechanical elementary relays - Part 7: Test and measurement procedures |
IEC 60512-12-1:2006
|
Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method |
IEC 62326-20:2016
|
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
IEC 61881:1999
|
Railway applications - Rolling stock equipment - Capacitors for power electronics |
IEC 62922:2016
|
Organic light emitting diode (OLED) panels for general lighting - Performance requirements |
ISO 27874:2008
|
Metallic and other inorganic coatings — Electrodeposited gold and gold alloy coatings for electrical, electronic and engineering purposes — Specification and test methods |
IEC 60934:2000+AMD1:2007+AMD2:2013 CSV
|
Circuit-breakers for equipment (CBE) |
ISO 9455-16:2013
|
Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method |
IEC 60068-2-54:2006
|
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
IEC 60068-1:2013
|
Environmental testing - Part 1: General and guidance |
IEC TS 62861:2017
|
Guidelines for principal component reliability testing for LED light sources and LED luminaires |
EN 62211:2017
|
Inductive components - Reliability management |
EN 61248-7:1997
|
Transformers and inductors for use in electronic and telecommunication equipment - Part 7: Sectional specification for high-frequency inductors and intermediate frequency transformers on the basis of the capability approval procedure |
EN 61338-2:2004
|
Waveguide type dielectric resonators - Part 2: Guidelines for oscillator and filter applications |
EN 61811-55:2002
|
Electromechanical all-or-nothing relays - Part 55: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 11 mm x 7,5 mm (max.) base |
EN 61249-8-8:1997
|
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings |
EN 61248-6:1997
|
Transformers and inductors for use in electronic and telecommunication equipment - Part 6: Sectional specification for inductors on the basis of the capability approval procedure |
EN 61169-8:2007
|
Radio-frequency connectors - Part 8: Sectional specification - RF coaxial connectors with inner diameter of outer conductor 6,5 mm (0,256 in) with bayonet lock - Characteristic impedance 50 ohms (type BNC) |
EN 61881:1999
|
Railway applications - Rolling stock equipment - Capacitors for power electronics |
EN 60512-12-5:2006/corrigendum:2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-5: SOLDERING TESTS - TEST 12E: RESISTANCE TO SOLDERING HEAT, SOLDERING IRON METHOD |
EN 61747-10-1:2013
|
Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods – Mechanical |
EN 61984:2009
|
Connectors - Safety requirements and tests |
EN 61811-53:2002
|
Electromechanical all-or-nothing relays - Part 53: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 14 mm x 9 mm base |
EN 61270-1:1996
|
Capacitors for microwave ovens - Part 1: General |
EN 60934:2001/A2:2013
|
CIRCUIT BREAKERS FOR EQUIPMENT (CBE) (IEC 60934:2000/A2:2013) |
EN 119000 : 1996
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION: DRY AND MERCURY WETTED REED CONTACT UNITS |
EN 60252 : 94 AC 94
|
A.C. MOTOR CAPACITORS |
EN 62739-3:2017
|
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods |
EN 62149-4:2010
|
Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application |
EN 61248-1 : 1997
|
Transformers and inductors for use in electronic and telecommunication equipment - Part 1: Generic specification |
EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
EN 60122-1:2002/A1:2018
|
QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION (IEC 60122-1:2002/A1:2017) |
EN 61643-311:2013
|
Components for low-voltage surge protective devices - Part 311: Performance requirements and test circuits for gas discharge tubes (GDT) |
IEC 61071:2017 RLV
|
Capacitors for power electronics |
EN 60115-8:2012
|
Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
EN 60238 : 2004 AMD 2 2011
|
EDISON SCREW LAMPHOLDERS (IEC 60238:2004/A2:2011) |
EN 60368-1:2000/A1:2004
|
PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
EN 60512-12-2:2006/corrigendum Dec. 2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-2: SOLDERING TESTS - TEST 12B: SOLDERABILITY, WETTING, SOLDERING IRON METHOD |
EN 61189-5-2:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
EN 60127-2:2014
|
Miniature fuses - Part 2: Cartridge fuse-links |
EN 62246-1-1:2013
|
Reed switches - Part 1-1: Generic specification - Quality assessment |
EN 60252-2 : 2011 AMD 1 2013
|
AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS (IEC 60252-2:2010/A1:2013) |
EN 60068-2-83 : 2011
|
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011) |
DIN EN 14436:2004-11
|
Copper and copper alloys - Electrolytically tinned strip |
EN 61810-7:2006
|
Electromechanical elementary relays - Part 7: Test and measurement procedures |
EN 62326-20:2016
|
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
EN 165000-1:1996
|
Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure |
EN 61071:2007
|
Capacitors for power electronics |
EN 143000 : 1991
|
THERMISTORS (GENERIC SPECIFICATION) |
DIN EN ISO 4521:2009-01
|
METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
EN 116000-3 : 1996
|
GENERIC SPECIFICATION: ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 3: TEST AND MEASUREMENT PROCEDURES |
EN 60068-2-54:2006
|
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
EN 137000:1995
|
Generic Specification: Fixed aluminium electrolytic a.c. capacitors with non-solid electrolyte for use with motors |
EN 61881-3:2012/A1:2013
|
RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS (IEC 61881-3:2012/A1:2013) |
OVE/ONORM EN 62025-2 : 2005
|
HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
EN 60512-12-7:2001
|
Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method |
EN 60512-12-4:2006/corrigendum:2006
|
CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
EN 61189-5 : 2006
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
EN 61338-1:2005
|
Waveguide type dielectric resonators - Part 1: Generic specification |
EN 60068-2-82:2007
|
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
EN 60115-8-1:2015
|
Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
EN 60068-2-58:2015/A1:2018
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
EN 62391-1:2016/AC:2016-12
|
FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 62391-1:2015/COR1:2016) |
EN 140100:2008
|
Sectional Specification: Fixed low power film resistors |
EN 62435-2:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
EN 60947-7-4 : 2013
|
LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS (IEC 60947-7-4:2013) |
EN 60127-6:2014
|
Miniature fuses - Part 6: Fuse-holders for miniature fuse-links |
EN 61191-4:2017
|
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
EN 62149-9:2014
|
Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers |
EN 62314 : 2006
|
SOLID-STATE RELAYS |
EN 60512-12-1:2006
|
Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method |
EN 60393-1:2009
|
Potentiometers for use in electronic equipment - Part 1: Generic specification |
EN 62025-2:2005
|
High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics |
EN 61337-2:2004
|
Filters using waveguide type dielectric resonators - Part 2: Guidance for use |
EN 60384-26 : 2010
|
FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
EN 61189-3:2008
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
EN 60749 : 99 AMD 2 2001
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS |
EN 61020-1:2009
|
Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
EN 61248-3:1997
|
Transformers and inductors for use in electronic and telecommunication equipment - Part 3: Sectional specification for power transformers on the basis of the capability approval procedure |
EN 61248-5:1997
|
Transformers and inductors for use in electronic and telecommunication equipment - Part 5: Sectional specification for pulse transformers on the basis of the capability approval procedure |
EN 61643-312 : 2013
|
COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (IEC 61643-312:2013 + CORRIGENDUM JUL. 2013) |
EN 140000 : 1993
|
GENERIC SPECIFICATION: FIXED RESISTORS |
I.S. EN ISO 9455-17:2006
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
BS CECC 30000:1992
|
Harmonized system of quality assessment for electronic components. Generic specification: fixed capacitors |
BS CECC 30000:1984
|
Harmonized system of quality assessment for electronic components: generic specification: fixed capacitors |
BS 2011-2.2T:1981
|
Environmental testing. Guidance Test T. Guidance on Test T: soldering |