• IEC 60068-2-54:2006

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  07-03-2017

    Language(s):  English, English - French, Spanish, Castilian

    Published date:  27-04-2006

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General description of the test
    5 Description of the test apparatus
       5.1 Test system
       5.2 Solder bath
    6 Preconditioning
       6.1 Preparation of specimens
       6.2 Ageing
    7 Materials
       7.1 Solder
       7.2 Flux
    8 Procedure
       8.1 Test temperature
       8.2 Fluxing
       8.3 Flux drying
       8.4 Test
    9 Presentation of results
       9.1 Form of chart-recorder trace
       9.2 Points of significance
       9.3 Reference wetting force
       9.4 Test requirements
    10 Information to be given in the relevant specification
    Annex A (normative) Equipment specification
    Annex B (informative) Guide to the use of the wetting balance
                          for solderability testing
    Bibliography
    Figures
    Table

    Abstract - (Show below) - (Hide below)

    IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition, published in 1985 and constitutes a technical revision. The major technical changes with regard to the previous edition concern: - the addition of lead free solder alloy (see Clause 7, Materials); - reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1); - modification to the test requirement for progress of wetting (see Clause 9).

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Stability Date: 2015. (10/2012) A Bilingual edition has been published on 30/07/2013. (08/2013)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    I.S. EN 61188-5-5:2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
    I.S. EN 61051-1:2008 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 60068-2-58 : 2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    13/30287806 DC : 0 BS EN 60539-1 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
    NF EN 60384-4 : 2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 4: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE
    BS EN 61188-5-5 : 2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
    13/30289543 DC : 0 BS EN 60384-4 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 4: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO2) AND NON-SOLID ELECTROLYTE
    BS 9752(1989) : 1989 BLANK DETAIL SPECIFICATION FOR FIXED INSULATED (UNSHIELDED) R.F. INDUCTORS SUITABLE FOR SURFACE MOUNTING AT THE FULL ASSESSMENT LEVEL
    11/30252855 DC : 0 BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING
    14/30280850 DC : 0 BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS 123500-003(2001) : 2001 SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEXIBLE SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITH THROUGH-CONNECTIONS
    BS 123400-003(2001) : 2001 SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEXIBLE SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITHOUT THROUGH-CONNECTIONS
    BS 123800-003(2001) : 2001 SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEXIBLE MULTILAYER PRINTED BOARDS WITH THROUGH-CONNECTIONS
    13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
    IEEE C62.33 : 1982 TEST METHODS AND PERFORMANCE VALUES FOR METAL-OXIDE VARISTOR SURGE PROTECTIVE COMPONENTS
    EN 60068-2-20 : 2008 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    07/30165180 DC : 0 BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE
    11/30243259 DC : 0 BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
    CEI EN 61051-1 : 2010 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    CEI EN 60384-15 : 1ED 2017 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 15: SECTIONAL SPECIFICATION: FIXED TANTALUM CAPACITORS WITH NON-SOLID OR SOLID ELECTROLYTE
    BS 123700-003(2001) : 2001 SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEX-RIGID DOUBLE-SIDED PRINTED BOARDS WITH THROUGH-CONNECTIONS
    BS EN 61169-1 : 2013 RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS
    IEC 60512-12-7:2001 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PT 12-7: SOLDERING TESTS - TEST 12G: SOLDERABILITY, WETTING BALANCE METHOD
    PREN ISO 9455-16 : DRAFT 2011 SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD
    I.S. EN 61076-4-113:2003 CONNECTORS FOR ELECTRONIC EQUIPMENT - PRINTED BOARD CONNECTORS - PART 4-113: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS HAVING 5 ROWS WITH A GRID OF 2,54 MM FOR PRINTED BOARDS AND BACKPLANES IN BUS APPLICATIONS
    BS EN 61076-4-113:2003 (published 2003-03) Connectors for electronic equipment Printed board connectors with assessed quality Detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications
    CSA E60384.1 : 2014 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS 123100-003(2001) : 2001 SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - RIGID SINGLE-SIDED AND DOUBLE-SIDED PRINTED BOARDS WITH PLAIN HOLES
    BS EN 60539-1:2016 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016)
    BS EN 60384-4:2016 Fixed capacitors for use in electronic equipment Sectional specification. Fixed aluminium electrolytic capacitors with solid (MnO2) and non-solid electrolyte
    10/30234803 DC : 0 BS EN 61169-1 ED.2 - RADIO FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS
    10/30210450 DC : 0 BS EN 61076-4-116 - CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 4-116: PRINTED BOARD CONNECTORS: DETAIL SPECIFICATION FOR A HIGH-SPEED TWO-PART CONNECTOR WITH INTEGRATED SHIELDING FUNCTION
    NF EN 60384-1 : 2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    11/30213136 DC : 0 BS EN ISO 9455-16 - SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD
    11/30234673 DC : 0 BS EN ISO 9455-10 - SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD
    NF EN 61076-4-116 : 2012 AMD 1 2016 CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 4-116: PRINTED BOARD CONNECTORS - DETAIL SPECIFICATION FOR A HIGH-SPEED TWO-PART CONNECTOR WITH INTEGRATED SHIELDING FUNCTION
    BS PD6521(1988) : 1988 SUMMARIES OF TEST METHODS FOR ENVIRONMENTAL TESTING OF ELECTROTECHNICAL PRODUCTS
    BS EN 60512-12-7:2001 (published 2001-08) Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Soldering tests Test 12g. Solderability, wetting balance method - Section 7: Test 12g: Solderability, wetting balance method
    BS EN 60384-15:2017 Fixed capacitors for use in electronic equipment Sectional specification: Fixed tantalum capacitors with non-solid or solid electrolyte
    BS EN 60384-1 : 2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 61051-1 : 2008 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 62211:2004 INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
    I.S. EN 60068-2-44:1997 ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING
    BS EN 60068-2-20 : 2008 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    BS 123600-003(2001) : 2001 SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - FLEX-RIGID MULTILAYER PRINTED BOARDS WITH THROUGH-CONNECTIONS
    CEI EN 60539-1 : 2009 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
    IEC 60068-2-44:1995 ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING
    OVE/ONORM EN 61051-1 : 2009 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    IEC 60384-1 REDLINE : 5ED 2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 60115-1 : 2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    IEC 62391-1:2015 RLV Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification
    I.S. EN 60384-15:2017 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 15: SECTIONAL SPECIFICATION: FIXED TANTALUM CAPACITORS WITH NON-SOLID OR SOLID ELECTROLYTE
    BS EN 61076-4-116 : 2012 CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 4-116: PRINTED BOARD CONNECTORS - DETAIL SPECIFICATION FOR A HIGH-SPEED TWO-PART CONNECTOR WITH INTEGRATED SHIELDING FUNCTION
    IEC 62391-1:2015 Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification
    CEI EN 60512-12-7 : 2002 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-7: SOLDERING TESTS - TEST 12G: SOLDERABILITY, WETTING BALANCE METHOD
    IEC 60539-1:2016 Directly heated negative temperature coefficient thermistors - Part 1: Generic specification
    CEI EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    PREN ISO 9455-10 : DRAFT 2011 SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD
    I.S. EN 62211:2017 INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
    CEI EN 60384-4 : 2007 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 4: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE
    NF EN 61076 4 113 : 2005 CONNECTORS FOR ELECTRONIC EQUIPMENT - PRINTED BOARD CONNECTORS - PART 4-113: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS HAVING 5 ROWS WITH A GRID OF 2,54 MM FOR PRINTED BOARDS AND BACKPLANES IN BUS APPLICATIONS
    EN 60384-1:2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60384-1:2016)
    BS EN 62391-1:2016 Fixed electric double-layer capacitors for use in electric and electronic equipment Generic specification
    I.S. EN 60384-4:2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 4: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE
    I.S. EN 61076-4-116:2012 CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 4-116: PRINTED BOARD CONNECTORS - DETAIL SPECIFICATION FOR A HIGH-SPEED TWO-PART CONNECTOR WITH INTEGRATED SHIELDING FUNCTION
    I.S. EN 60068-2-20:2008 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    I.S. EN 60384-1:2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    IEC 60300-3-5:2001 Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    I.S. EN 60068-2-58:2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    I.S. EN 60539-1:2016 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
    I.S. EN 62391-1:2016 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 61169-1:2013 RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS
    IEC 60115-1:2008 Fixed resistors for use in electronic equipment - Part 1: Generic specification
    IEC 60384-15:2017 Fixed capacitors for use in electronic equipment - Part 15: Sectional specification: Fixed tantalum capacitors with non-solid or solid electrolyte
    IEC 61051-1:2007 Varistors for use in electronic equipment - Part 1: Generic specification
    I.S. EN 60115-1:2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
    I.S. EN ISO 9455-16:2013 SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013)
    I.S. EN ISO 9455-10:2012 SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD (ISO 9455-10:2012)
    EN 61169-1:2013/AC:2016-02 RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS (IEC 61169-1:2013)
    EN 60539-1:2016/AC:2017-09 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017)
    EN 61076-4-116:2012/A1:2016 CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 4-116: PRINTED BOARD CONNECTORS - DETAIL SPECIFICATION FOR A HIGH-SPEED TWO-PART CONNECTOR WITH INTEGRATED SHIELDING FUNCTION (IEC 61076-4-116:2012/A1:2015)
    EN 60115-1:2011/A11:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    NF EN 62391-1 : 2018 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    DIN EN ISO 12224-3:2003-10 Solder wire, solid and flux cored - Specifications and test methods - Part 3: Wetting balance test method for flux cored solder wire efficacy (ISO 12224-3:2003)
    DIN EN ISO 9455-10:2013-01 Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012)
    DIN EN ISO 9455-16:2013-08 SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013)
    UNI EN ISO 9455-16 : 2013 SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD
    IEC 62211:2017 INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT
    BS 123200-003(2001) : 2001 SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - RIGID DOUBLE-SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES
    IEC 61076-4-113:2002 Connectors for electronic equipment - Printed board connectors - Part 4-113: Detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications
    IEC 61169-1:2013 Radio frequency connectors - Part 1: Generic specification - General requirements and measuring methods
    UNE-EN ISO 9455-16:2013 Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013)
    BS EN ISO 9455-16:2013 SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013)
    ISO 9455-16:2013 Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method
    ISO 12224-3:2003 Solder wire, solid and flux cored Specifications and test methods Part 3: Wetting balance test method for flux cored solder wire efficacy
    BS 123300-003(2001) : 2001 SYSTEM OF QUALITY ASSESSMENT - CAPABILITY DETAIL SPECIFICATION - RIGID MULTILAYER PRINTED BOARDS
    BS EN ISO 12224-3 : 2003 SOLDER WIRE, SOLID AND FLUX CORED - SPECIFICATIONS AND TESTS METHODS - PART 3: WETTING BALANCE TEST METHOD FOR FLUX CORE SOLDER WIRE EFFICACY
    IEC 60384-1:2016 Fixed capacitors for use in electronic equipment - Part 1: Generic specification
    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    ISO 9455-10:2012 Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method
    IEC 60384-4:2016 Fixed capacitors for use in electronic equipment - Part 4: Sectional specification - Fixed aluminium electrolytic capacitors with solid (MnO2) and non-solid electrolyte
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 62391-1 : 2.0 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN ISO 9455-10:2012 Soft soldering fluxes. Test methods Flux efficacy test, solder spread method
    IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
    IEC 61076-4-116:2012+AMD1:2015 CSV Connectors for electronic equipment - Product requirements - Part4-116: Printed board connectors - Detail specification for a high-speed two-part connector with integrated shielding function
    UNE-EN ISO 9455-10:2012 Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012)
    IEC 60384-1:2016 RLV Fixed capacitors for use in electronic equipment - Part 1: Generic specification
    EN 60068-2-44 : 1995 ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING
    EN 61051-1 : 2008 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    EN 61076-4-113 : 2003 CONNECTORS FOR ELECTRONIC EQUIPMENT - PRINTED BOARD CONNECTORS - PART 4-113: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS HAVING 5 ROWS WITH A GRID OF 2,54 MM FOR PRINTED BOARDS AND BACKPLANES IN BUS APPLICATIONS
    EN 61188-5-5 : 2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
    EN 62211:2017 INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT (IEC 62211:2017)
    EN 60384-4:2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 4: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE (IEC 60384-4:2016)
    EN 60512-12-7 : 2001 CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - SOLDERING TESTS - TEST 12G - SOLDERABILITY, WETTING BALANCE METHOD
    EN 60068-2-58:2015/A1:2018 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017)
    EN 62391-1:2016/AC:2016-12 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 62391-1:2015/COR1:2016)
    EN 60384-15 : 2017 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 15: SECTIONAL SPECIFICATION: FIXED TANTALUM CAPACITORS WITH NON-SOLID OR SOLID ELECTROLYTE (IEC 60384-15:2017)
    EN ISO 9455-10:2012 SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD (ISO 9455-10:2012)
    EN ISO 12224-3 : 2003 SOLDER WIRE, SOLID AND FLUX CORED - SPECIFICATIONS AND TESTS METHODS - PART 3: WETTING BALANCE TEST METHOD FOR FLUX CORE SOLDER WIRE EFFICACY
    EN ISO 9455-16:2013 SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013)
    UNI EN ISO 9455-10 : 2012 SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 61190-1-1:2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    IEC 60068-2-44:1995 ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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