AS 60068.2.44-2004

SECTION ONE - GENERAL1 Scope2 Normative referencesSECTION TWO - GENERAL PRINCIPLES3 Introduction4 Solderability of components and wettability of their terminations5 Place of solderability in environmental testing6 Solderability tests7 Wettability tests 7.1 General principles 7.2 Bath test 7.3 Soldering iron test 7.4 Globule test 7.5 Rotary dip test 7.6 Wetting balance test 7.7 Solderability, resistance to dissolution of metallization and soldering heat of Surface Mounting Devices (SMD) IEC 60068-2-58: Test Td8 Explanations of the test conditions 8.1 Classification 8.2 Choice of testing materials 8.3 Methods of accelerated ageing9 Requirements and the statistical character of resultsSECTION THREE - GUIDE TO THE USE OF THE WETTING BALANCE FOR SOLDERABILITY TESTING10 General 10.1 Definition of the measure of wettability 10.2 Specimen shape 10.3 Specimen preparation11 Characteristics of test apparatus 11.1 Recording device 11.2 Balance system 11.3 Solder bath 11.4 Bath lifting mechanism and controls12 Examples of representative force-time curves13 Parameters to be measured from the force-time trace 13.1 Choice of test criteria 13.2 Reference wetting force

Part of a suite of Standards that adopt the IEC 60068 series of Standards as Australian Standards. The series contains fundamental information on environmental testing procedures and severities of tests, including information on atmospheric conditions for measurement and testing. Although primarily intended for electrotechnical products, many of the environmental testing procedures are equally applicable to other industrial products.

The purpose of this International Standard is to provide background information and recommendations for writers of specifications containing references to IEC 60068-2-20, IEC 60068-2-54 and IEC 60068-2-58.

First published as AS 60068.2.44-2004.