AS 60068.2.58-2004
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Environmental testing Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
30-01-2019
English
01-01-2004
Important note : Users cannot be edited or removed once added to your Multi user PDF.1 Scope2 Normative references3 Terms and definitions4 Preconditioning5 Solder bath method 5.1 Test apparatus and materials for the solder bath method6 Procedure 6.1 Number of specimens 6.2 Clamping 6.3 Fluxing 6.4 Solder immersion7 Solder reflow methods 7.1 Test apparatus and materials8 Test procedure 8.1 Number of specimens 8.2 Application of solder paste 8.3 Placement of specimens 8.4 Preheating 8.5 Solder reflow9 Flux removal 9.1 Recovery 9.2 Evaluation10 Information to be given in the relevant specificationAnnex A (normative) - Criteria for visual examinationAnnex B (informative) - Guidance
The AS 60068 Standards include a series of environmental testing procedures, information on the severity of tests, and information on atmospheric conditions for measurement and testing. Although primarily intended for electrotechnical products, many of the procedures are equally applicable to other industrial products
| Committee |
EL-026
|
| DocumentType |
Standard
|
| ISBN |
0 7337 6220 4
|
| Pages |
13
|
| ProductNote |
Withdrawn 30-01-2019.
|
| PublisherName |
Standards Australia
|
| Status |
Withdrawn
|
| Supersedes |
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). Soldering tests applicable to SMD in IEC 60068-2-69 and to other electrotechnical products are in IEC 60068-2-20 and IEC 60068-2-54, for which guidance is given in IEC 60068-2-44. This standard provides standard procedures for determining the solderabillty, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD) (hereinafter referred to as specimens). The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems.
| Standards | Relationship |
| IEC 60068-2-58:1999 | Identical |
First published as AS 60068.2.58-2004.
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