ASTM D 1825 : 2003
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Standard Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing (Withdrawn 2012)
Hardcopy , PDF
31-01-2012
English
01-10-2003
Important note : Users cannot be edited or removed once added to your Multi user PDF.CONTAINED IN VOL. 10.01, 2009 Describes a procedure for etching and cleaning copper clad thermosetting laminates for electrical testing.
| Committee |
D 09
|
| DocumentType |
Standard Practice
|
| Pages |
2
|
| PublisherName |
American Society for Testing and Materials
|
| Status |
Withdrawn
|
| Supersedes |
1.1 This practice describes a procedure for etching and cleaning copper-clad electrical insulating materials and thermosetting laminates for electrical testing.
1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific warning statements see 6.3 and 6.4.
| SAE AMS3613E | FILM, COPPER CLAD POLYESTER |
| ASTM D 2861 : 2014 : REDLINE | Standard Test Methods for Flexible Composites of Copper Foil with Dielectric Film or Treated Fabrics |
| ASTM D 229 : 2019 | Standard Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation |
| ASTM D 2861 : 2014 | Standard Test Methods for Flexible Composites of Copper Foil with Dielectric Film or Treated Fabrics (Withdrawn 2020) |
| ASTM D 5109 : 2012 | Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020) |
| ASTM D 5109 : 2012 : REDLINE | Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards |
| ASTM D 1867 : 2013 : REDLINE | Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring |
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