ASTM D 1867 : 2013 : REDLINE
Current
The latest, up-to-date edition.
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
English
01-11-2013
Important note : Users cannot be edited or removed once added to your Multi user PDF.CONTAINED IN VOL. 10.01, 2015 Defines twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces.
| Committee |
D 09
|
| DocumentType |
Redline
|
| Pages |
9
|
| PublisherName |
American Society for Testing and Materials
|
| Status |
Current
|
1.1This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.
1.2The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
1.3This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
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| MIL-DTL-28754 Revision E:2016 | Connectors, Electrical, Modular, and Component Parts General Specification for |
| ASTM D 1825 : 2003 | Standard Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing (Withdrawn 2012) |
| ASTM B 451 : 1993 | Specification for Copper Foil, Strip, and Sheet for Printed Circuits and Carrier Tapes (Withdrawn 1998) |
| ASTM D 5109 : 2012 : REDLINE | Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards |
| DSCC 10012 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING |
| DSCC 11006 : 0 | PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING |
| ASTM D 709 : 2017 : REDLINE | Standard Specification for Laminated Thermosetting Materials |
| ASTM D 1711 : 2015 : REDLINE | Standard Terminology Relating to Electrical Insulation |
| ASTM D 5109 : 2012 : REDLINE | Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards |
| NEMA LI 1 : 1998(R2011) | INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS |
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