ASTM F 1710 : 1997
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Standard Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer
Hardcopy , PDF
11-11-2014
English
10-06-1997
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
F 01
|
| DocumentType |
Test Method
|
| Pages |
6
|
| PublisherName |
American Society for Testing and Materials
|
| Status |
Superseded
|
| SupersededBy |
1.1 This test method covers the determination of concentrations of trace metallic impurities in high purity titanium.
1.2 This test method pertains to analysis by magnetic-sector glow discharge mass spectrometer (GDMS).
1.3 The titanium matrix must be 99.9 weight percent (3N-grade) pure, or purer, with respect to metallic impurities. There must be no major alloy constituent, for example, aluminum or iron, greater than 1000 weight ppm in concentration.
1.4 this test method does not include all the information needed to complete GDMS analyses. Sophisticated computer-controlled laboratory equipment skillfully used by an experienced operator is required to achieve the required sensitivity. This test method does cover the particular factors (for example, specimen preparation, setting of relative sensitivity factors, determination of sensitivity limits, etc.) known by the responsible technical committee to effect the reliability of high purity titanium analyses.
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
| ASTM F 2063 : 2018 | Standard Specification for Wrought Nickel-Titanium Shape Memory Alloys for Medical Devices and Surgical Implants |
| ASTM F 3166 : 2016 | Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization (Withdrawn 2023) |
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