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  • ASTM F 3166 : 2016

    Current The latest, up-to-date edition.

    Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization (Withdrawn 2023)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  13-07-2016

    Publisher:  American Society for Testing and Materials

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    Abstract - (Show below) - (Hide below)

    CONTAINED IN VOL. 10.04, 2016 Specifies the generic criteria requirements of high pure titanium sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advance packaging.

    Scope - (Show below) - (Hide below)

    1.1This specification details the generic criteria requirements of high pure titanium sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advance packaging.

    1.2Sputtering target purity, grain size, inner quality, bonding, dimension, and appearance specifications are included in this specification along with references for qualification test methods. Reliability, certification, traceability, and packaging requirements are also included.

    1.2.1Purity Requirements:

    1.2.1.1Metallic element impurities, and

    1.2.1.2Non-metallic element impurities.

    1.2.2Grain Size Requirements—Grain size.

    1.2.3Inner Quality Requirements—Internal defect.

    1.2.4Bonding Requirements:

    1.2.4.1Backing plate, and

    1.2.4.2Bonding ratio.

    1.2.5Configuration Requirements:

    1.2.5.1Dimension,

    1.2.5.2Tolerance, and

    1.2.5.3Surface roughness.

    1.2.6Appearance Requirements—Surface cleanness.

    1.3The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

    1.4This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

    General Product Information - (Show below) - (Hide below)

    Committee F 01
    Document Type Standard
    Publisher American Society for Testing and Materials
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    ASTM E 1001 : 2016 : REDLINE Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
    ASTM F 1512 : 1994 : R1999 Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
    ASTM F 1709 : 1997 : R2016 Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2023)
    ASTM B 209 : 2014 Standard Specification for Aluminum and Aluminum-Alloy Sheet and Plate
    ASTM F 1710 : 1997 Standard Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer
    ASTM E 1001 : 2021 Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
    ASTM E 1001 : 2011 Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
    ASTM E 1001 : 1999 : REV A Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
    ASTM F 1512 : 1994 : R2003 Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
    ASTM F 1709 : 1997 : R2002 Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
    ASTM B 248 : 2017 Standard Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar
    ASTM F 1709 : 1997 Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
    ASTM E 1001 : 2016 Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
    ASTM B 209 : 2014 : REDLINE Standard Specification for Aluminum and Aluminum-Alloy Sheet and Plate
    ASTM E 1001 : 2006 Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
    ASTM F 1512 : 1994 : R2011 Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies (Withdrawn 2020)
    ASTM E 112 : 2013 : R2021 Standard Test Methods for Determining Average Grain Size
    ASTM E 112 : 2013 Standard Test Methods for Determining Average Grain Size
    ASTM F 1710 : 2008 Standard Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer
    ASTM B 248 : 2022 Standard Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar
    ASTM E 1001 : 2004 Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
    ASTM B 248 : 2017 : REDLINE Standard Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar
    ASTM F 1709 : 1997 : R2008 Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
    ASTM F 1710 : 2008 : R2016 Standard Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer (Withdrawn 2023)
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