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BS 4584-102.8(1990) : 1990 AMD 8417

BS 4584-102.8(1990) : 1990 AMD 8417

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR FLEXIBLE COPPER CLAD POLYESTER (PETP) FILM

Superseded date

15-02-1995

Published date

23-11-2012

Publisher

British Standards Institution

National foreword
Committees responsible
Specification
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad film
6 Non-electrical properties of the base material after
   complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
9 Additional requirements

Describes requirements for properties of flexible copper clad polyester film. Includes optional requirements which apply only by agreement between purchaser and supplier. Copper clad film complying with all the requirements not marked "optional" should be deemed to comply. Covers materials and construction, internal marking, electrical properties, non electrical properties of the copper clad film, non electrical properties of the base material after complete removal of the copper foil, packaging and marking, acceptance testing and additional requirements. BS AMD 8417 RENUMBERS THIS STANDARD TO BS EN 60249 PT2-8: 1995

Committee
ECL/19
DevelopmentNote
Renumbered and superseded by BS EN 60249-2.8. Supersedes BS 4584-9(1977) & 89/22203 DC. (09/2005)
DocumentType
Standard
PublisherName
British Standards Institution
Status
Superseded
SupersededBy
Supersedes

Standards Relationship
IEC 60249-2-8:1987 Identical

BS 6221-22:1990 Printed wiring boards Guide to the use of printed wiring board substrate materials: surface mount technology

IEC 60249-3A:1976 First supplement: Metal-clad base materials for printed circuits - Specification No. 2: Specification for copper foil for use in the manufacture of copper clad base materials

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