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BS EN 60249-2-8:1995

BS EN 60249-2-8:1995

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Specifications Specification for flexible copper-clad polyester (PETP) film

Available format(s)

Hardcopy , PDF

Withdrawn date

01-10-2006

Language(s)

English

Published date

01-02-1995

Publisher

British Standards Institution

National foreword
Committees responsible
Specification
1. Scope
2. Materials and construction
3. Internal marking
4. Electrical properties
5. Non-electrical properties of the copper-clad film
6. Non-electrical properties of the base material
     after complete removal of the copper foil
7. Packaging and marking
8. Acceptance testing
9. Additional requirements

Committee
EPL/501
DevelopmentNote
Renumbers and supersedes BS 4584-102.8(1990). 1995 version incorporates amendment 8417 to BS 4584-102.8(1990). Also numbered as IEC 60249-2-8. Supersedes BS 4584-9(1977) & 89/22203 DC. (09/2005)
DocumentType
Standard
Pages
16
PublisherName
British Standards Institution
Status
Withdrawn
Supersedes

BS 123400-003:2001 System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
BS 123700-003:2001 System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
BS 123500-003:2001 System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
BS 123600-003:2001 System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections

BS EN 60249-1:1993 Base materials for printed circuits Base materials for printed circuits. Test methods
BS 4584-103.2:1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials

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Hardcopy - English
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