BS 4584-15:1978
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Metal-clad base materials for printed wiring boards Adhesive coated polymeric films: PETP-F-15 and PI-F-15
Hardcopy , PDF
01-07-2006
English
31-10-1978
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Foreword
Cooperating organizations
Specification
1 Scope
2 References
3 Materials and construction
4 Marking
5 Properties of the adhesive coated film
6 Properties of the adhesive coated film after
lamination as a cover sheet
7 Packaging and dimensions
8 Determination of thickness
9 Lamination of adhesive coated film as a cover sheet
10 Determination of surface resistance after damp heat
and recovery
11 Determination of permittivity and dissipation factor
after damp heat and recovery
12 Determination of peel strength after lamination
13 Determination of peel strength after lamination and
heat shock
14 Determination of peel strength after lamination and
dry heat
15 Determination of dimensional stability
16 Determination of resistance to flexural fatigue
17 Determination of flammability (vertical burning test
for flexible materials)
Tables
1 Preferred thicknesses and permitted deviations of
polyester film
2 Preferred thicknesses and permitted deviations of
polyimide film
3 Sizes and permitted number of inclusions
4 Properties of the adhesive coated film after
lamination as a cover sheet
Figures
1 Examples of schematic arrangements for measuring
peel strength
2 Fluidized sand bath
3 Location of specimens on original sheet for
dimensional stability
4 Location of marks on specimen for dimensional
stability test
5 Flexural fatigue test pattern
6 Flexural fatigue test
7 Fire resistant shield for flammability test
8 Arrangement of vertical burning test for flexible
materials
Properties of films of polyester and polyimide used as cover sheets for flexible printed circuits.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 77/26427 DC (08/2005)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| IEC 60250:1969 | Recommended methods for the determination of the permittivity and dielectric dissipation factor of electrical insulating materials at power, audio and radio frequencies including metre wavelengths |
| BS 2011-2.1B:1977 | Environmental testing. Tests Tests B. Dry Heat |
| IEC 60249-3-3:1991 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| IEC 60249-3-1:1981 | Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards |
| BS 4584-10:1977 | Specification for metal-clad base materials for printed circuits Flexible copper-clad polyimide film: PI-F-Cu-10 |
| BS 3502:1967 | Schedule of common names and abbreviations for plastics and rubbers. |
| BS 2011-2.1Ca:1977 | Environmental testing. Tests Test Ca. Damp heat, steady state |
| BS 4584-1(1970) : LATEST | |
| BS 4584-9:1977 | Specification for metal-clad base materials for printed circuits Flexible copper-clad polyester (PETP) film: PETP-F-Cu-9 |
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