BS 6221-21:1984
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Printed wiring boards Guide for the repair of printed wiring boards
Hardcopy , PDF
15-02-2001
English
30-04-1984
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Foreword
Committees responsible
Guide
1. Scope
2. Definitions
3. General
4. Special precautions
5. Removal and restoration of protective coatings
6. Component removal and replacement
7. Defective conductors (single- and double-sided
boards)
8. Lifted conductors
9. Lifted and defective lands
10. Eyelet and tubular pin defects
11. Defective plated-through holes (double-sided boards)
12. Base-board material defects
13. Inclusions
14. Short circuits or unwanted conductive material on
the surface of the laminate
15. Repair of inner layers of multilayer printed wiring
boards
16. Repairs to printed edge connectors
17. Modification of assembled printed wiring boards
Appendix
A. Suitable tools and materials
Table
1. Applicability of methods for the repair of defective
conductors
Figures
1. Resistor or capacitor with two axial leads
2. TO5 and TO18 transistors with multi-leads
3. Leaded components where the leads are inaccessible
form the component side
4. Dual in-line package mounted through the board
5. A typical surface mounted dual in-line package
6. Defective conductors
7. Copper foil connections
8. Tinned copper wire connections
9. Insulated wire connections
10. Repair using an insulated wire link
11. Straight conductor repair using parallel gap welding
12. Corner repairs using parallel gap welding
13. Lifted conductors
14. Repair of damaged land using overlaid land
15. Replacement bonded land
16. Lifted land and conductor
17. Eyelet and tubular pin defects
18. Defective plated-through hole
19. Repair of defective plated-through hole by the wire
link method
20. Repair of defective plated-through hole by the
eyelet method
21. Repair of defective plated-through holes by parallel
gap welding: method 1
22. Repair of defective plated-through holes by parallel
gap welding: method 2
23. Damaged base-board materials
24. Printed edge connector: complete contact replacement
25. Removal of unwanted conductors
26. Fitting of additional components and/or wires
27. Modification to printed edge connectors
Recommends principles and practices for the repair of printed wiring boards and for modifications if required.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes BS 6221(1982) and BS 5370(1976) (07/2004)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| BS 6221-23:1991 | Printed wiring boards Guide for the design and use of printed wiring boards: surface mounted devices |
| BS 6221-22:1990 | Printed wiring boards Guide to the use of printed wiring board substrate materials: surface mount technology |
| BS 6221-3:1984 | Printed wiring boards Guide for the design and use of printed wiring boards |
| BS 6221-20:1984 | Printed wiring boards Guide for the assembly of printed wiring boards |
| BS 6221-20:1984 | Printed wiring boards Guide for the assembly of printed wiring boards |
| BS 6221-3:1984 | Printed wiring boards Guide for the design and use of printed wiring boards |
| BS 6221-8:1982 | Printed wiring boards Method for specifying single and double sided flexible printed wiring boards with through connections |
| BS 6221-6:1982 | Printed wiring boards Specification for multilayer printed wiring boards |
| BS 6221-5:1982 | Printed wiring boards Specification for single and double sided rigid printed boards with plated-through holes |
| BS 6221-7:1982 | Printed wiring boards Method for specifying single and double sided flexible printed wiring boards without through connections |
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