BS 7822-3:1995
Current
The latest, up-to-date edition.
Insulation coordination for equipment within low-voltage systems Use of coatings to achieve insulation coordination of printed board assemblies
Hardcopy , PDF
English
15-11-1995
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Committees responsible
National foreword
Introduction
SPECIFICATION
1 Scope
2 Normative references
3 Definitions
4 Design requirements
5 Test specimens
6 Tests
Annexes
A (normative) Test sequence for type A coating
B (normative) Test sequence for type B coating
C (informative) Measuring the insulation distance of a
coated printed board
Table
1 Degrees of severities for rapid change of
temperature
Figures
1 Test specimen
2 Examples of land configurations
C.1 Measurement of the insulation distance
Applies to rigid printed board assemblies with an insulating coating applied to one or both sides of the printed board. Describes the requirements and test procedures for printed board assemblies provided with coatings.
| Committee |
GEL/109
|
| DevelopmentNote |
Supersedes 88/22388 DC (10/2005)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
This part of IEC 664 applies to rigid printed board assemblies with an insulating coating applied to one or both sides of the printed board. Such coatings are used to provide insulation and to protect the microenvironment of the printed board assembly surface against pollution, for the purpose of insulation coordination. It describes the requirements and test procedures for printed board assemblies provided with coatings.
This part covers two types of coatings:
- type A coating only provides protection against pollution. The clearance and creepage distance requirements of IEC 664-1 apply to the printed board assembly under the coating;
- type B coating provides protection against pollution and insulation. There are no requirements for clearances and creepage distances under the coating. Only the requirements of IEC 664-1 for solid insulation apply.
NOTE 1 For type B coating, the conductors are embedded in solid insulation consisting of the base material and the coating.
NOTE 2 Clearances and creepage distance requirements apply to all uncoated parts of the board and between conductive parts over the coating.
The principles in this part are applicable to functional and basic insulation.
NOTE 3 For supplementary and reinforced insulation, additional requirements, which are under consideration, may apply.
| BS 5901:1980 | Method of test for determining the comparative and the proof tracking indices of solid insulating materials under moist conditions |
| BS 4584-103.3:1992 | Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| BS 2011-2.1N:1985 | Environmental testing. Tests Test N. Change of temperature |
| BS 2011-2.1Ca:1977 | Environmental testing. Tests Test Ca. Damp heat, steady state |
| BS 6221-2:1991 | Printed wiring boards Methods of test |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| BS 4727-1:GRP11(1991) : 1991 | GLOSSARY OF ELECTROTECHNICAL, POWER, TELECOMMUNICATION, ELECTRONICS, LIGHTING AND COLOUR TERMS - TERMS COMMON TO POWER, TELECOMMUNICATIONS AND ELECTRONICS - PRINTED CIRCUITS |
| IEC 60364-4-443:1995+AMD1:1998 CSV | Electrical installations of buildings - Part 4: Protection for safety - Chapter 44: Protection against overvoltages - Section 443: Protection against overvoltages of atmospheric origin or due to switching |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60664-1:2007 | Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests |
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