Skip to content
Please enter a keyword to search

  • BS 6221-2:1991

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Printed wiring boards Methods of test

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  24-04-2012

    Language(s):  English

    Published date:  28-06-1991

    Publisher:  British Standards Institution

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    Committees responsible
    National foreword
    Method
    1. Introduction
    2. Scope
    3. Object
    4. General
    5. General examination
    6. Electrical tests
    7. Mechanical tests
    8. Miscellaneous tests
    9. Environmental conditioning
    Annexes
    A. List of tests
    B. Outgassing test of plated-through holes
    Figures
    1. Untitled
    2. Untitled
    3. Test probes for current-carrying capacity test
    4. Untitled
    5. Solderability
    6. Needle burner test. Side views of test board and
        burner
    7. Abrasion fixture
    8. Fluidized sand bath
    9. Example of a soldering tool
    10. Plier fixture for thermal shock test, dip soldering
    11. Schematic layout of steam/oxygen ageing test
        apparatus
    12. Examples of typical test coupons
    B.1 Untitled
    B.2 Untitled
    B.3 Untitled
    B.4 Plated-through hole normal view under stereo
        microscope without oil and view of land after
        testing with soldering iron
    B.5 Plated-through hole with oil. Convex meniscus. The
        wall is not visible
    B.6 Plated-through hole with oil. Concave meniscus. The
        wall is visible
    B.7 Defective plate-through hole. Formation of bubbles
        in the oil

    Abstract - (Show below) - (Hide below)

    Test methods and procedures including environmental conditioning for printed boards.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Also numbered as IEC 60326-2 Supersedes BS 6221-2(1982) (09/2005)
    Document Type Standard
    Publisher British Standards Institution
    Status Withdrawn
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS 123300-003:2001 System of quality assessment. Capability detail specification. Rigid multilayer printed boards
    BS EN 123800:1997 Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections
    BS 123800-003:2001 System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
    BS EN 123400:1992 Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections
    BS 123400-003:2001 System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
    BS 6221-6:1982 Printed wiring boards Specification for multilayer printed wiring boards
    BS EN 123500-800:1992 Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
    BS 123200:2001 System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
    BS EN 123400-800:1992 Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
    BS EN 123600:1997 Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections
    BS 4584-103.3:1992 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
    BS EN 123500:1992 Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections
    BS 123200-003:2001 System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
    BS 123100:2001 System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes
    BS EN 123100:1992 Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes
    BS 6221-11:1991 Printed wiring boards Specification for flex-rigid multilayer printed boards with through connections
    BS 123500:2001 System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
    BS 123700:2001 System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections
    BS 123600:2001 System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
    BS EN 60068-2-44:1995 Environmental testing. Test methods Tests. Guidance on Test T. Soldering
    BS 123000:2001 System of quality assessment. Generic specification. Printed boards
    BS CECC 23200-003:1996 Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes
    BS 123600-003:2001 System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
    BS EN 61249-8-7:1997 Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks
    BS 6221-10:1991 Printed wiring boards Specification for flex-rigid double-sided printed boards with through connections
    BS CECC 123400-003:1994 Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
    BS EN 123300:1992 Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
    BS EN 123200:1992 Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes
    BS 123300:2001 System of quality assessment. Sectional specification. Rigid multilayer printed boards
    BS 123100-003:2001 System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
    BS CECC 23300-003:1996 Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
    BS 6221-9:1991 Printed wiring boards Specification for flexible multilayer boards with through connections
    BS 123400:2001 System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards without through-connections
    BS 6221-4:1982 Printed wiring boards Method for specifying single and double sided printed wiring boards with plain holes
    BS 123700-003:2001 System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
    BS EN 123000:1992 Harmonized system of quality assessment for electronic components. Generic specification: printed boards
    BS 7822-3:1995 Insulation coordination for equipment within low-voltage systems Use of coatings to achieve insulation coordination of printed board assemblies
    BS EN 123700:1997 Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid double sided printed boards with through connections
    BS 123500-003:2001 System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
    BS 123800:2001 System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
    BS 6221-12:1992 Printed wiring boards Specification for mass lamination panels (semi-manufactured multilayer printed boards)

    Standards Referencing This Book - (Show below) - (Hide below)

    BS 5830:1979 Specification for grid system for printed circuits
    BS 6458-2.2(1984) : 1984 FIRE HAZARD TESTING FOR ELECTROTECHNICAL PRODUCTS - METHODS OF TEST - NEEDLE FLAME TEST
    BS 6413-0:1983 Lubricants, industrial oils and related products (class L) Classification (general)
    IEC 60454-3-1:1998+AMD1:2001 CSV Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive
    BS 2011-2.1Ca:1977 Environmental testing. Tests Test Ca. Damp heat, steady state
    BS 6458-2.1:1984 Fire hazard testing for electrotechnical products. Test methods Glow-wire test
    BS 6221-6:1982 Printed wiring boards Specification for multilayer printed wiring boards
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    BS 6221-5:1982 Printed wiring boards Specification for single and double sided rigid printed boards with plated-through holes
    IEC 60326-1:1984 Printed boards - Part 1: General information for the specification writer
    IEC 60326-3:1991 Printed boards - Part 3: Design and use of printed boards
    BS 2011-2.1T:1981 Environmental testing. Tests Test T. Soldering
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective