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BS 9766:1983

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

View Superseded by

Specification for printed circuits of assessed quality: sectional specification for multilayer flexi-rigid printed circuits with through hole connections

Available format(s)

Hardcopy , PDF

Withdrawn date

15-12-2000

Superseded by

BS EN 123600:1997

Language(s)

English

Published date

30-12-1983

€271.12
Excluding VAT

Foreword
Committees responsible
Specification
1 Scope
2 Related documents
3 Terminology
4 Base materials
5 Customer's detail specification
6 Inspection requirements
7 Description of capability: limits of approval
8 Demonstration of capability
9 Capability CTP allocation
10 Capability approval acceptance levels
11 Capability approval report
12 Abstract of description of capability
13 Quality conformance inspection
14 Certified test records
15 BS 9764 approval
Appendices
A CTP materials and finishes
B CTP test pattern locations
C Layout of composite of all V layers for extension of
    approval for more than six layers
D Layout of specimens A, B, G and Y
E Layout of specimen C
F Layout of specimens D and E
G Layout of specimens F and K
H Layout of specimens L and N
J Layout of specimen P
K Layout of specimens M and H
L Layout of specimens J, X, Z1 and Z2
M CTP finished hole sizes and cover layer hole sizes
    in the group pattern layout
N CTP layout
P Representation of six-, eight-, ten- and twelve-
    layer construction
Q Example of abstract of description of capability for
    inclusion in PD 9002
R Customer's detail specification
S Examples of delamination
T Examples of hole defects
U Test method for flexural fatigue (hinge) of
    specimens Z1 and Z2
V Notes applicable to appendices D to L
Tables
1 CTP allocation of specimens
2 Schedule of tests for capability approval
3 Quality conformance inspection
Figure
1 Group pattern for 1 CTP

Specifies the tests and requirements from those listed in BS 9760 that are applicable to multilayer flexi-rigid printed circuits with through-hole connections and also the requirements for capability approval and for quality conformance inspection during manufacture.

Committee
EPL/501
DocumentType
Standard
Pages
42
PublisherName
British Standards Institution
Status
Withdrawn
SupersededBy

BS 2011-2.1Ca:1977 Environmental testing. Tests Test Ca. Damp heat, steady state

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