• BS EN 123600:1997

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  13-10-2017

    Language(s):  English

    Published date:  15-05-1997

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Introduction
        1.1 Scope and object
        1.2 Related documents
    2 General
    3 Test specimen
        3.1 Capability Approval
        3.2 Quality conformance inspection
    4 Relevant specification
    5 Characteristics of the printed board
        Table I Basic characteristics
        Table II Additional characteristics
    6 Capability test programme
        Table III
    7 Quality conformance inspection
        Table IV
    8 Test pattern - Test boards
        8.1 General
        8.2 Application of test patterns and test boards
              Table V
        8.3 Structure of test boards
        8.4 Multiple arrangements of the composite test pattern
              8.4.1 Examples of multiple arrangements
                      Test board structure, Table VI
                      Figure 3a Layer 1
                      Figure 3b Layer 2
                      Figure 3c Layer 3
                      Figure 3d Layer 4
                      Figure 3e Layer 5
                      Figure 3f Layer 6
                      Figure 3g
                      Figure 3h
                      Figure 4a L specimen (layer 3, 3a, 3b)
                      Figure 4b L specimen (layer 4, 4a, 4b)
                      Figure 5 Examples of delamination
                      Figure 6a Methods of reinforcing lands
                      Figure 6b Examples relating to access
                                  holes
                      Figure 7 Examples of soldered holes

    Abstract - (Show below) - (Hide below)

    Defines the characteristics to be assessed and the test methods to be used for capability testing and for quality conformity testing (lot-by-lot and periodic inspection).

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Supersedes BS 9766(1983) and 91/28661 DC. (08/2005)
    Document Type Standard
    Publisher British Standards Institution
    Status Withdrawn
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS CECC 23600-801:1998 Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60097:1991 Grid systems for printed circuits
    BS 2011-2.1Z/AD:1977 Environmental testing. Tests Tests Z/AD. Composite temperature/humidity cyclic test
    BS 2011-2.1Ca:1977 Environmental testing. Tests Test Ca. Damp heat, steady state
    BS 6221-2:1991 Printed wiring boards Methods of test
    BS 6221-3:1991 Printed wiring boards Guide for the design and use of printed wiring boards
    BS EN 123000:1992 Harmonized system of quality assessment for electronic components. Generic specification: printed boards
    IEC 60326-11:1991 Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections
    BS 4727-1:GRP11(1991) : 1991 GLOSSARY OF ELECTROTECHNICAL, POWER, TELECOMMUNICATION, ELECTRONICS, LIGHTING AND COLOUR TERMS - TERMS COMMON TO POWER, TELECOMMUNICATIONS AND ELECTRONICS - PRINTED CIRCUITS
    IEC 60326-1:1984 Printed boards - Part 1: General information for the specification writer
    BS 2011-2.1T:1981 Environmental testing. Tests Test T. Soldering
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